A polishing method capable of improving a spatial resolution of a film-thickness measurement without changing a measuring cycle of a film-thickness sensor and without increasing an amount of measurement data is disclosed. The polishing method includes: rotating a first film-thickness sensor and a second film-thickness sensor together with a polishing table, the first film-thickness sensor and the second film-thickness sensor being located at the same distance from a center of the polishing table; causing the first film-thickness sensor and the second film-thickness sensor to generate signal values indicating film thicknesses at measurement points on a surface of a substrate, while a polishing head is pressing the substrate against a polishing pad on the rotating polishing table, the measurement points being located at different distances from a center of the substrate; and controlling polishing pressure applied from the polishing head to the substrate based on the signal values generated by the first film-thickness sensor and the second film-thickness sensor.

Stored is a height of a grinding mechanism when lower surfaces of grinding stones have come into contact with an upper surface of a wafer held on a holding surface, through lowering of the grinding mechanism from above the wafer. Based on this height, an origin point height which is a height of the grinding mechanism when the lower surfaces of the grinding stones have come into contact with the holding surface is then determined.

Stored is a height of a grinding mechanism when lower surfaces of grinding stones have come into contact with an upper surface of a wafer held on a holding surface, through lowering of the grinding mechanism from above the wafer. Based on this height, an origin point height which is a height of the grinding mechanism when the lower surfaces of the grinding stones have come into contact with the holding surface is then determined.

Multiple floor treatment operations, such as burnishing, polishing, and scrubbing, may be performed using a single floor treatment machine having a motor, the speed of which is governed by a controller that responds to sensor signals indicative of the type of floor treatment pad or pads operatively coupled to the motor.

Multiple floor treatment operations, such as burnishing, polishing, and scrubbing, may be performed using a single floor treatment machine having a motor, the speed of which is governed by a controller that responds to sensor signals indicative of the type of floor treatment pad or pads operatively coupled to the motor.

Multiple floor treatment operations, such as burnishing, polishing, and scrubbing, may be performed using a single floor treatment machine having a motor, the speed of which is governed by a controller that responses to sensor signals indicative of the type of floor treatments pad or pads operatively coupled to the motor.

A power tool is provided including a motor case and a handle portion. An electric motor having a drive shaft is mounted within the motor case. A circuit board is disposed in the handle portion to accommodate a motor drive circuit. The motor drive circuit includes a rectifier configured to receive an alternating current from an alternating current (AC) power source and convert it to a direct current supplied to a DC power bus, and a bridge circuit having motor switches connected between the rectifier and the electric motor. A bus capacitor is mounted on the circuit board and coupled across the DC power bus. An auxiliary capacitor having higher capacitance than the bus capacitor is switchably coupled across the DC power bus. The handle portion includes a support member protruding radially outwardly to accommodate the auxiliary capacitor.

A power tool is provided including a motor case and a handle portion. An electric motor having a drive shaft is mounted within the motor case. A circuit board is disposed in the handle portion to accommodate a motor drive circuit. The motor drive circuit includes a rectifier configured to receive an alternating current from an alternating current (AC) power source and convert it to a direct current supplied to a DC power bus, and a bridge circuit having motor switches connected between the rectifier and the electric motor. A bus capacitor is mounted on the circuit board and coupled across the DC power bus. An auxiliary capacitor having higher capacitance than the bus capacitor is switchably coupled across the DC power bus. The handle portion includes a support member protruding radially outwardly to accommodate the auxiliary capacitor.

To terminate polishing at an appropriate position, an end point position of the polishing is sensed. According to one embodiment, a method that chemomechanically polishes a substrate including a functional chip is provided. The method includes: a step of disposing the functional chip on the substrate; a step of disposing an end point sensing element on the substrate; a step of sealing the substrate on which the functional chip and the end point sensing element are disposed with an insulating material; a step of polishing the insulating material; and a step of sensing an end point of the polishing based on the end point sensing element while the insulating material is polished.

A tool includes a first accessory, at least two first attachment portions for detachably and selectively attaching the first accessory, and a single first intermediate member provided in common for the at least two first attachment portions. The first intermediate member includes at least one pressed portion configured to, when the first accessory is attached to one first attachment portion arbitrarily selected from the at least two first attachment portions, be directly or indirectly pressed by the first accessory. The first intermediate member is configured to be displaced when the at least one pressed portion is pressed. The tool further includes a single first sensor configured to detect that the first intermediate member is displaced.