The present application provides a grinding control method, a grinding control apparatus and a storage medium, and is applied in the field of semiconductor manufacturing processes. The method includes: acquiring a target resistance value of a metal film of a grinding object set by a user, determining a target output value of an eddy current sensor according to the target resistance value, acquiring an output value of the eddy current sensor in real time, and stopping a grinding task when the output value reaches the target output value.

A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.

A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.

A chemical mechanical polishing system includes a platen to support a polishing pad, a carrier head to hold a substrate and bring a lower surface of the substrate into contact with the polishing pad, and an in-situ friction monitoring system including a friction sensor. The friction sensor includes a pad portion having a substrate contacting portion with an upper surface to contact the lower surface of the substrate, and a pair of capacitive sensors positioned below and on opposing sides of the substrate contacting portion.

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

In a scheme in which a top ring is held to an end portion of a swing arm, the present invention improves accuracy of polishing end point detection. A polishing apparatus for polishing between a polishing pad 10 and a semiconductor wafer 16 disposed opposed to the polishing pad 10 includes a polishing table 30A for holding the polishing pad 10 and a top ring 31A for holding the semiconductor wafer 16. A swing shaft motor 14 swings a swing arm 110 for holding the top ring 31A. The arm torque detection section 26 detects arm torque applied to the swing arm 110. An end point detection section 28 detects a polishing end point indicating an end of polishing based on the detected arm torque.

A tool includes a prime mover, switch, operation member for the switch, first accessory, second accessory, third intermediate member moved in conjunction with displacement of the operation member, first intermediate member configured to be displaced from a first blocking position of blocking a displacement route of the third intermediate member to a first non-blocking position of not blocking the displacement route by attachment of the first accessory, and second intermediate member configured to be displaced from a second blocking position of blocking the displacement route to a second non-blocking position of not blocking the displacement route by attachment of the second accessory. Only when the first intermediate member is located at the first non-blocking position and the second intermediate member is located at the second non-blocking position, the third intermediate member is permitted to be displaced so that the operation member is permitted to be displaced to the ON position.

A tool includes a prime mover, switch, operation member for the switch, first accessory, second accessory, third intermediate member moved in conjunction with displacement of the operation member, first intermediate member configured to be displaced from a first blocking position of blocking a displacement route of the third intermediate member to a first non-blocking position of not blocking the displacement route by attachment of the first accessory, and second intermediate member configured to be displaced from a second blocking position of blocking the displacement route to a second non-blocking position of not blocking the displacement route by attachment of the second accessory. Only when the first intermediate member is located at the first non-blocking position and the second intermediate member is located at the second non-blocking position, the third intermediate member is permitted to be displaced so that the operation member is permitted to be displaced to the ON position.

A grinding or polishing device and a method for treating a workpiece are provided. The grinding or polishing device includes a tool holder for holding a grinding or polishing tool and a mounting head for mounting the tool holder to a multi-axis manipulator. The tool holder is rotatable with respect to the mounting head about a pivot axis. The grinding or polishing device further includes a sensor for converting at least one parameter indicative of an angular position of the tool holder about the pivot axis into an output signal that can be used for determining a control signal for controlling the multi-axis manipulator.

A grinding or polishing device and a method for treating a workpiece are provided. The grinding or polishing device includes a tool holder for holding a grinding or polishing tool and a mounting head for mounting the tool holder to a multi-axis manipulator. The tool holder is rotatable with respect to the mounting head about a pivot axis. The grinding or polishing device further includes a sensor for converting at least one parameter indicative of an angular position of the tool holder about the pivot axis into an output signal that can be used for determining a control signal for controlling the multi-axis manipulator.