The present invention relates to a polishing apparatus and a polishing method for polishing a workpiece, such as a wafer on which a pattern is formed, on a polishing pad, and more particularly, relates to a polishing apparatus and a polishing method for detecting a geometric element of a pattern, such as a pitch. The polishing apparatus includes: a polishing table (3) configured to support a polishing pad (2); a polishing head (1) configured to press a workpiece (W), having a pattern formed therein, against the polishing pad (2) and polish a surface of the workpiece (W), an imaging device (20) disposed in the polishing table (3) and configured to generate an image including at least the pattern of the workpiece (W), and an image analysis system (30) configured determining a geometric element of the pattern of the workpiece (W) based on the image.

A break-in processing apparatus is disclosed, which can reliably perform a break-in process for an elastic membrane without reducing a utilization rate of a polishing apparatus. The break-in processing apparatus includes a stage to which an elastic membrane assembly including a carrier and an elastic membrane attached to the carrier is placed; a break-in determination module facing the elastic membrane placed to the stage; a fluid supply unit configured to supply a pressurized fluid into a pressure chamber formed between the outermost periphery portion of the elastic membrane and the carrier; and a controller configured to control operations of the break-in determination module and the fluid supply unit. The controller determines a completion of a break-in process of the elastic membrane based on a load applied to the break-in determination module by the elastic membrane which is expanded by the pressurized fluid supplied into the pressure chamber.

A break-in processing apparatus is disclosed, which can reliably perform a break-in process for an elastic membrane without reducing a utilization rate of a polishing apparatus. The break-in processing apparatus includes a stage to which an elastic membrane assembly including a carrier and an elastic membrane attached to the carrier is placed; a break-in determination module facing the elastic membrane placed to the stage; a fluid supply unit configured to supply a pressurized fluid into a pressure chamber formed between the outermost periphery portion of the elastic membrane and the carrier; and a controller configured to control operations of the break-in determination module and the fluid supply unit. The controller determines a completion of a break-in process of the elastic membrane based on a load applied to the break-in determination module by the elastic membrane which is expanded by the pressurized fluid supplied into the pressure chamber.

A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.

A chemical mechanical polishing apparatus includes a platen to support a polishing pad, the platen having a recess, a flexible membrane in the recess, and an in-situ vibration monitoring system to generate a signal. The in-situ acoustic monitoring system includes a vibration sensor supported by the flexible membrane and positioned to couple to an underside of the polishing pad.

In an automatic wet sanding apparatus including a disc and a cushion pad, a disc center hole is formed at a central portion of the disc and a pad center hole is formed at a central portion of the cushion pad. Water having been supplied to an introduction space inside a skirt is stirred as an eccentric head rotates eccentrically and thereby pushed out toward a painted surface via the disc center hole and the pad center hole with enhanced pressure. Thus, sanding dust resulting from automatic wet sanding can be washed away toward an outer circumferential side by the water that is pushed out toward the outer circumferential side, so that the likelihood of clogging due to sanding dust can be reduced and high sanding efficiency can be maintained.

A processing apparatus includes a chuck table having a holding surface for holding a workpiece; a horizontal moving mechanism that moves the chuck table in a horizontal direction and is supplied with a first oil; and a vertical moving mechanism that moves a processing unit in a vertical direction and is supplied with a second oil. Before mounting the workpiece on the holding surface, the holding surface is imaged by a camera while being irradiated with light, and it is examined whether or not the picked-up image is emitting light. If there is a light-emitting part in the picked-up image, it is determined that oil is adhered to the light-emitting part.

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

There is disclosed a substrate processing apparatus which can align a center of a substrate with a central axis of a process stage with high accuracy to prevent a defective substrate from being produced. The substrate processing apparatus includes: an eccentricity detecting mechanism configured to obtain an amount of eccentricity and an eccentricity direction of a center of the substrate, held on the centering stage, from a central axis of the centering stage; and an aligner configured to align the center of the substrate with a central axis of a process stage. The aligner obtains, after the substrate is transferred from the centering stage to the process stage, an amount of eccentricity and an eccentricity direction of the center of the substrate from the central axis of the process stage by use of the eccentricity detecting mechanism; and confirms that the obtained amount of eccentricity of the center of the substrate from the central axis of the process stage is within a predetermined allowable range.

There is provided a quantitative method for determining a level of a sanding surface preparation of a carbon fiber composite surface, prior to the carbon fiber composite surface undergoing a post-processing operation. The quantitative method includes fabricating a ladder panel of levels of sanding correlating to an amount of sanding of sanding surface preparation standards for a reference carbon fiber composite surface of reference carbon fiber composite structure(s); using surface analysis tools to create target values for quantifying the levels of sanding; measuring, with the surface analysis tools, sanding surface preparation location(s) on the carbon fiber composite surface of a test carbon fiber composite structure, to obtain test result measurement(s); comparing the test result measurement(s) to the levels, to obtain test result level(s); determining if the test result level(s) meet the target values; and determining whether the carbon fiber composite surface is acceptable to proceed with the post-processing operation.