A polishing apparatus comprises: a generation unit configured to generate time-series data of a feature value up to a target time point by using data regarding a frictional force between a polishing member and a target substrate up to the target time point during polishing or a temperature measurement data of the polishing member or the target substrate; and an prediction unit configured to input at least the time-series data of the feature value generated by the generation unit to a machine learning model trained with a training data set, and output an predicted value of a polishing amount or a residual film amount at the target time point during polishing of the target substrate.

A polishing apparatus comprises: a generation unit configured to generate time-series data of a feature value up to a target time point by using data regarding a frictional force between a polishing member and a target substrate up to the target time point during polishing or a temperature measurement data of the polishing member or the target substrate; and an prediction unit configured to input at least the time-series data of the feature value generated by the generation unit to a machine learning model trained with a training data set, and output an predicted value of a polishing amount or a residual film amount at the target time point during polishing of the target substrate.

An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

A method of monitoring the surface temperatures of wafers in real time by measuring them according to the present invention monitors the surface temperatures of a polishing pad in real time by measuring them, and can thus actively deal with irregular variations in temperature on the surface of the wafer attributable to chemical reaction and friction in the process of cleaning the wafer. A sensor for measuring the surface temperatures of a wafer according to the present invention can be used in an environment in which there is fume generated from a cleaning solution, and is responsible for temperatures at respective points of an infrared camera and allows the correction of temperatures in respective sections.

An automated gem polishing system comprising a computer-controlled polishing wheel; robotic apparatus, comprising multiple axis controllers and a gem holder; a digital microscope; and a computer having a processor and a memory, the memory including instructions that when executed by the processor implement the steps of registering and polishing a gem in the gem holder.

An automated gem polishing system comprising a computer-controlled polishing wheel; robotic apparatus, comprising multiple axis controllers and a gem holder; a digital microscope; and a computer having a processor and a memory, the memory including instructions that when executed by the processor implement the steps of registering and polishing a gem in the gem holder.

Feed rate scheduling methods include measuring a topography of a grinding wheel of a machine tool, calculating a topography parameter using the topography, and calculating a feed rate scheduling parameter for a toolpath of the grinding wheel based on the topography parameter. The topography may be measured using microscopy. The topography parameter may include a plurality of parameters including a density of crystals at a given depth (C(h)) of the grinding wheel and/or an area fraction of crystals protruding at a given depth (α(h)) of the grinding wheel. The feed rate scheduling parameter may include a grinding wheel feed rate, a grinding wheel spin rate, and/or a grinding wheel cutting depth, among other parameters.

Grinding a surface of a workpieces is accomplished with a grinding machine having at least two grinding units. First, a target structure of the surface to be achieved is provided. Then, using predetermined grinding parameters, a first of the two grinding units is used to grind the surface of the structure. Then, the surface of the actual structure is captured and compared to the target structure. Based on the comparison, the grinding parameters are adjusted and the surface is then ground, using the adjusted parameters, with the second of the two grinding units.

An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.