Apparatus and method for polishing objects uses a layer of diamond slurry on a polishing surface of a polishing structure that is formed by dispensing a set amount of diamond slurry onto the polishing surface. The thickness of the layer of diamond slurry is maintained by periodically dispensing another set amount of diamond slurry onto the polishing surface of the polishing structure.

Apparatus and method for polishing objects uses a layer of diamond slurry on a polishing surface of a polishing structure that is formed by dispensing a set amount of diamond slurry onto the polishing surface. The thickness of the layer of diamond slurry is maintained by periodically dispensing another set amount of diamond slurry onto the polishing surface of the polishing structure.

The various described embodiments provide a CMP system and a method of using the same. The CMP system includes an imaging device, such as a laser scanner, that obtains an image of a dresser of the CMP system in real time or in-situ with a CMP process. A processing device of the CMP system compares the obtained image with one or more of reference images to determine whether or not the dresser has a defect. The processing device then adjusts the CMP process based on whether or not the dresser includes a defect.

The various described embodiments provide a CMP system and a method of using the same. The CMP system includes an imaging device, such as a laser scanner, that obtains an image of a dresser of the CMP system in real time or in-situ with a CMP process. A processing device of the CMP system compares the obtained image with one or more of reference images to determine whether or not the dresser has a defect. The processing device then adjusts the CMP process based on whether or not the dresser includes a defect.

The present disclosure describes a method and apparatus to remove consumable (e.g., sacrificial) polishing pad layers from a multilayer polishing pad. For example, the method includes measuring a thickness profile of a top polishing pad layer of a multilayer polishing pad and comparing the thickness profile to a threshold. The method, in response to the thickness profile being above the threshold, rinses the top polishing pad layer of the multilayer polishing pad and removes, after the top polishing pad layer has been rinsed, the top polishing pad layer to expose an underlying polishing pad layer of the multilayer polishing pad.

The present disclosure describes a method and apparatus to remove consumable (e.g., sacrificial) polishing pad layers from a multilayer polishing pad. For example, the method includes measuring a thickness profile of a top polishing pad layer of a multilayer polishing pad and comparing the thickness profile to a threshold. The method, in response to the thickness profile being above the threshold, rinses the top polishing pad layer of the multilayer polishing pad and removes, after the top polishing pad layer has been rinsed, the top polishing pad layer to expose an underlying polishing pad layer of the multilayer polishing pad.

According to one embodiment, there is provided a top ring for holding a substrate. The top ring comprises a substrate supporting surface, a retainer member disposed to surround an outer periphery of the substrate supporting surface, and a retainer guiding device configured to guide the retainer member so as to allow the retainer member to be displaced in a direction perpendicular to the substrate supporting surface, and support the retainer member so as to inhibit the retainer member from being displaced in a direction parallel to and away from the substrate supporting surface. The retainer guiding device is disposed in an inner side of the retainer member surrounding the substrate supporting surface.

A method is disclosed for grinding grooves on workpieces using a profiled grinding wheel, the profile of which is crushed. A reshaping crush process includes driven crush rollers, each being controlled on the basis of a rotational speed and current consumption. Thus, relative advancement between the grinding wheel and crush roller is controlled according to the speed and current consumption. A grinding machine is also disclosed for grinding a workpiece, wherein the workpiece is held by means of a workpiece spindle head. A crush device comprising a crush roller with a dedicated rotary drive is provided on the grinding machine. The grinding wheel is applied to the crush roller in order to dress the grinding wheel profile. The crush roller has a profile-crushing portion for profile-crushing the grinding wheel with a first dressing volume and a reshaping profile-crushing portion for profile-crushing the grinding wheel with a second dressing volume.

A method is disclosed for grinding grooves on workpieces using a profiled grinding wheel, the profile of which is crushed. A reshaping crush process includes driven crush rollers, each being controlled on the basis of a rotational speed and current consumption. Thus, relative advancement between the grinding wheel and crush roller is controlled according to the speed and current consumption. A grinding machine is also disclosed for grinding a workpiece, wherein the workpiece is held by means of a workpiece spindle head. A crush device comprising a crush roller with a dedicated rotary drive is provided on the grinding machine. The grinding wheel is applied to the crush roller in order to dress the grinding wheel profile. The crush roller has a profile-crushing portion for profile-crushing the grinding wheel with a first dressing volume and a reshaping profile-crushing portion for profile-crushing the grinding wheel with a second dressing volume.

A processing apparatus includes a chuck table that holds a workpiece by a holding face, a processing unit that processes the workpiece with a grinding whetstone or a polishing pad, a movement unit for moving the chuck table and the processing unit parallel to the holding face, a processing feeding unit for moving the chuck table and the processing unit in a direction orthogonal to the holding face, an inspection unit to inspect a process mark of the workpiece during processing, a dressing unit to dress the grinding whetstone or the polishing pad of the processing unit, and a control unit. When a process mark of a size exceeding a threshold value is detected on the process face of the workpiece, the control unit stops processing of the workpiece, and after the grinding whetstone or the polishing pad is dressed, restarts processing.