A chemical mechanical polishing apparatus is provided. The chemical mechanical polishing apparatus includes a polishing pad, a pad conditioner, a measurement tool, and a controller. The polishing pad is provided in a processing chamber for polishing a wafer placed on the polishing surface of the polishing pad. The pad conditioner is configured to condition the polishing surface. The measurement tool is provided in the processing chamber and configured to measure the downward force of the pad conditioner. The controller is coupled to the pad conditioner and the measurement tool, and is configured to adjust the downward force of the pad conditioner in response to an input from the measurement tool.

A process for retruing a profile in an abrasive wheel is provided. A lathe table including an edged cutting tool is used for fixturing a grinding wheel having an outside metal edge and an abrasive matrix adjacent thereto for rotation along an axis compatible for lathe removal of material at at least the outside edge of said wheel. A predetermined amount of material along said edge with the edged lathe cutting tool is removed using the lathe cutting tool. A rotating electrical discharge profiling tool which is attached to an electrical discharge machine is used for profiling of the wheel by electrical discharge machining of the abrasive surface with the rotating electrode. The process uses a machine specifically designed for electrical discharge machining of the profile. The machine also has a mechanism cutting a predetermined profile into the electrode without removing it from the machine.

A chemical mechanical polishing (CMP) apparatus is provided, including a polishing pad and a polishing head. The polishing pad has a polishing surface. The polishing head is configured to hold a wafer in contact with the polishing surface during the polishing process. The polishing head includes a retaining ring, at least one fluid channel, and a vacuum pump. The retaining ring is arranged along the periphery of the polishing head and configured to retain the wafer. The at least one fluid channel is provided inside the polishing head, wherein the retaining ring includes a bottom surface facing the polishing surface and a plurality of holes in fluid communication with the bottom surface and the at least one fluid channel. The vacuum pump is fluidly coupled to the at least one fluid channel.

Systems and methods are disclosed herein for adding surface features to grinding wheels. A laser may be directed substantially perpendicular to a grinding surface of a grinding wheel. The laser may be pulsed and may ablate material from the grinding surface. The laser may move relative to the grinding wheel in order to ablate shaped surface features into the grinding surface.