A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A multi-tool positioning and manufacturing system moves a workpiece among many tools, such as grinding wheels, each of which performs a manufacturing operation on the workpiece. The system moves the workpiece automatically, quickly, repeatably, and precisely among the tools, without any manual intervention. It can perform the same manufacturing operations as many separate tools, such as grinding the inner diameter, outer diameter, and rib of a tapered roller bearing cone. Because a machinist does not have to move the workpiece between machines for different operations, the total manufacturing process can be faster and higher yield than with separate tools. The system can also move a single dresser among the tools for dressing and truing, further increasing manufacturing efficiency by eliminating the need for separate dressers for separate tools.

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.

A method of monitoring a chemical mechanical polishing (CMP) apparatus including an arm configured to swing a polishing component includes performing a CMP process; learning at least two positions of the polishing component during a normal swing motion of the polish component by an optical acceptor and a processing unit to determine a plurality of expected positions of the polish component; analyzing at least one real position of the polishing component at predetermined time points during the CMP process by the optical acceptor and the processing unit; inspecting whether an abnormal event occurs based on the analyzed real position of the polishing component and the expected positions by the processing unit during the CMP process; and determining whether to send an alarm and stop the CMP process based on the inspecting result.

According to an aspect of the present disclosure, a substrate polishing apparatus is provided. The substrate polishing apparatus includes a turntable for supporting a polishing pad, a dresser that dresses the polishing pad, a dresser drive module that presses the dresser against the polishing pad and rotates the dresser, a support member that supports the dresser drive module, and a plurality of force sensors which are provided between the dresser drive module and the support member and each of which outputs information related to each of forces in three axis directions.

Provided is a method for determining an accurate height of a polishing pad even when a dressing load applied to the polishing pad is changed. A method for determining a polishing pad height is provided. The method includes measuring a reference dresser height that is a height of a dressing surface (50a) of a dresser (50) when a polishing surface (22a) of a polishing pad (22) in an unused state is being pressed with a reference dressing load for polishing a substrate, calculating a correction amount for a dresser height corresponding to an amount of change in dressing load from the reference dressing load, measuring a current dresser height that is a current height of the dressing surface (50a) of the dresser (50) when the polishing surface (22a) of the polishing pad (22) is being pressed, and correcting the current dresser height using the correction amount.

A conditioner of a chemical mechanical polishing (CMP) apparatus includes a conditioning part to polish a polishing pad, an arm to rotate the conditioning part, and a flexible connector connecting the conditioning part with the arm, the flexible connector being moveable to allow relative movements of the conditioning part with respect to the arm.

A system, a control method and an apparatus for chemical mechanical polishing (CMP) are introduced in the present application. The CMP apparatus may include a polishing pad, a first sensor, a polishing head and a condition. The polishing pad has a plurality of groves arranged randomly or in a specific pattern. The first sensor is configured to measure the pad profile of the polishing pad, where the pad profile includes the depth of each of the grooves on the polishing pad. The polishing head and the conditioner are operated according to at least one polishing condition, and the at least one polishing condition is tuned according to the pad profile.

An apparatus for dressing a grinding wheel mounted thereon by creating structures on the surface of a, in particular cylindrical, grinding surface of the grinding wheel The apparatus includes a dressing tool holder arranged for accommodating a dressing tool in a dressing position, a controllable actuator for adjusting the position of the tool holder within the apparatus in at least one direction, a grinding wheel support for rotatably supporting a grinding wheel to be dressed The apparatus further includes a mechanism for monitoring an individual structure, created by the dressing tool on the surface of the grinding wheel, and a mechanism for monitoring a circumferential position and/or the rotary speed of the grinding wheel, and a mechanism for controlling the actuator, adapted to control the actuator as a function of the monitored structure and the monitored circumferential position and/or rotary speed.