A polishing device includes a rotatable platen; a polishing pad placed on an upper surface of the platen and having a polishing surface; a polishing head disposed above the polishing pad and configured for mounting a substrate on a bottom surface of the polishing head; a driver configured to rotate the platen with respect to an axis perpendicular to the polishing surface of the polishing pad; a slurry supply outlet configured to supply slurry to the polishing surface of the polishing pad; a polishing pad conditioner for conditioning the polishing surface of the polishing pad; and a polishing pad conditioner position detection module configured to detect whether a disk of the polishing pad conditioner is correctly aligned.

A gin blade sharpening system for sharpening a blank into a blade disk. The gin blade sharpening system comprises two or more grinding stations, a controller, and one or more upper grinders. The one or more upper grinders comprise at least a first upper grinder. The two or more grinding stations comprise at least a first grinding station and a second grinding station. Each among the two or more grinding stations comprise a clamp assembly configured to selectively hold the blade disk in a substantially horizontal position. A portion of the one or more upper grinders can be configured to sharpen an outer perimeter edge of the blade disk using an abrasive pad.

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against the polishing pad, a conditioner including a conditioner head to hold a conditioner disk against the polishing pad, a motor to move the conditioner head laterally movable relative to the platen, a conditioning disk cleaning station positioned adjacent the platen to clean the conditioning disk, and a controller configured to cause the motor to, during polishing of the substrate, move the conditioner head back and forth between a first position with the conditioner head over the polishing pad and a second position with the conditioner head in the conditioner disk cleaning station.

A grinding apparatus and a method for manufacturing a semiconductor device using the same are provided. A grinding apparatus includes a chuck unit configured to receive a substrate, a grinding unit on a part of the chuck unit and configured to grind the substrate, and a dressing unit under a part of the grinding unit adjacent to the chuck unit and including a dressing board configured to dress the grinding unit and magnets under the dressing board.

A finishing tool, includes: a housing having a cylindrical holder chamber that opens toward a distal end and located along a central axis; a slide sleeve disposed coaxially with the central axis in the holder chamber and rotates only in a first direction; a drive sleeve disposed coaxially with the central axis in the holder chamber and rotates only in the first direction; a tool chip having a spherical surface at a distal end; and a chip holder penetrating the slide sleeve and the drive sleeve, reciprocable between a forward end and a rearward end, capable of mounting the tool chip at a distal end, axially slidable relative to the slide sleeve, and rotates in the first direction as the chip holder moves forward relative to the drive sleeve.