An application device is configured to clean grinding surfaces in a machine for grinding ophthalmic lenses, the application device including: a central portion having so as to mount the application device in the grinding machine; and a peripheral edge configured to receive an application surface to cooperate with the grinding surface of the grinding wheel so as to clean the grinding surface. It also relates to a cleaning kit including an application device and a cleaning solution, and to a method for cleaning grinding surfaces.

The present invention relates to a grinding device for machining an, in particular plate-shaped workpiece (W). The grinding device comprises an emitter (31) for emitting electromagnetic waves in the direction of the abrasive belt (10) and a detector (32) for detecting electromagnetic waves which are reflected by the abrasive belt (10).

An apparatus, system, and a method for sharpening a cutting tool. The system sharpens cutting tools by manipulating the tool, measuring the three dimensional profile of the tool, and then grinding the tool. The apparatus consists of a robot capable of six degrees of motion, a gripping mechanism, a force-torque sensor capable of at least two directions of force and/or torque, a three dimensional scanning subsystem, a loading subsystem, a user interface, an initial orientation scan subsystem, a data processing and robot control subsystem, and at least one grinding system comprising two counter-rotating grinding wheels. The method automates the grinding process so that dull cutting tools can be placed into the loading system, sharpened by the system, and then ejected fully honed.

An apparatus, system, and a method for sharpening a cutting tool. The system sharpens cutting tools by manipulating the tool, measuring the three dimensional profile of the tool, and then grinding the tool. The apparatus consists of a robot capable of six degrees of motion, a gripping mechanism, a force-torque sensor capable of at least two directions of force and/or torque, a three dimensional scanning subsystem, a loading subsystem, a user interface, an initial orientation scan subsystem, a data processing and robot control subsystem, and at least one grinding system comprising two counter-rotating grinding wheels. The method automates the grinding process so that dull cutting tools can be placed into the loading system, sharpened by the system, and then ejected fully honed.

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

A polishing method is used for polishing a surface of a substrate such as a semiconductor wafer. The polishing method includes a polishing process for polishing a surface of the substrate in accordance with a preset polishing recipe, a pad cleaning process for removing foreign matters on the polishing pad by ejecting a cleaning fluid onto the polishing pad, and a substrate transferring process in which the polished substrate is removed from the top ring at a substrate transferring position, a subsequent substrate to be polished is loaded onto the top ring, and then the top ring holding the subsequent substrate to be polished is returned to the polishing table. The pad cleaning process is started after the completion of the polishing recipe is detected, and the pad cleaning process is terminated by detecting a position of the subsequent substrate to be polished which is undergoing the substrate transferring process.

A conditioner of a chemical mechanical polishing (CMP) apparatus includes a disk to polish a polishing pad of the CMP apparatus, a driver to rotate the disk, a lifter to lift the driver, an arm to rotate the lifter, and a connector to connect the driver to the lifter, the driver being tiltable with respect to the lifter.

A method for polishing fibers implements a fiber polishing system. The method includes manipulating a disk, spraying water using a first water pressure, and spraying air using an air pressure. The method further includes misting low pressure water using a second water pressure, manipulating a handle, and manipulating one or more dogs.

A method for polishing fibers implements a fiber polishing system. The method includes manipulating a disk, spraying water using a first water pressure, and spraying air using an air pressure. The method further includes misting low pressure water using a second water pressure, manipulating a handle, and manipulating one or more dogs.

The method of the present invention comprises the steps of: previously obtaining correlation data between surface properties of the polishing pad dressed under a plurality of stages of dressing conditions and polishing effects of the work polished by the polishing pad dressed under the dressing conditions; determining an assumed dressing condition capable of achieving an object polishing effect from the correlation data; dressing the polishing pad under the assumed dressing condition determined; polishing the work; cleaning the polishing pad which has been used for polishing the work; and measuring a surface property of the cleaned polishing pad.