An omni-directional conditioner device includes a carrier that includes a holding part for holding and rotating an object for polishing purpose; a conditioner disposed around the carrier; and a transmission mechanism connected with the carrier on one side and the conditioner on the other side, the transmission mechanism including at least one directional adjustment unit that controls the rotational direction of the conditioner. When the directional adjustment unit is set in one position, the carrier and the conditioner rotate in a same direction, and when the directional adjustment unit is set in another position, the carrier and the conditioner rotate in opposite directions.

An omni-directional conditioner device includes a carrier that includes a holding part for holding and rotating an object for polishing purpose; a conditioner disposed around the carrier; and a transmission mechanism connected with the carrier on one side and the conditioner on the other side, the transmission mechanism including at least one directional adjustment unit that controls the rotational direction of the conditioner. When the directional adjustment unit is set in one position, the carrier and the conditioner rotate in a same direction, and when the directional adjustment unit is set in another position, the carrier and the conditioner rotate in opposite directions.

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

An embodiment of the present invention provides a buff process module. The buff process module includes: a buff table on which a processing target object is mounted; a buff head that holds a buff pad for applying a predetermined process to the processing target object; a buff arm that supports and swings the buff head; a dresser for dressing the buff pad; and a cleaning mechanism that is disposed between the buff table and the dresser and is for cleaning the buff pad.

An advanced substrate rotation device is provided. A substrate rotation device is disclosed. The substrate rotation device includes an outer cylinder, an inner cylinder positioned inside the outer cylinder, a motor for rotating the inner cylinder, a magnetic bearing for magnetically levitating the inner cylinder, and a substrate holder disposed on the inner cylinder. The motor is a radial motor including a motor stator mounted on the outer cylinder, and a motor rotor mounted on the inner cylinder. The magnetic bearing is a radial magnetic bearing including a magnetic bearing stator mounted on the outer cylinder, and a magnetic bearing rotor mounted on the inner cylinder. The magnetic bearing is configured to magnetically levitate the inner cylinder with an attractive force between the magnetic bearing stator and the magnetic bearing rotor.

An advanced substrate rotation device is provided. A substrate rotation device is disclosed. The substrate rotation device includes an outer cylinder, an inner cylinder positioned inside the outer cylinder, a motor for rotating the inner cylinder, a magnetic bearing for magnetically levitating the inner cylinder, and a substrate holder disposed on the inner cylinder. The motor is a radial motor including a motor stator mounted on the outer cylinder, and a motor rotor mounted on the inner cylinder. The magnetic bearing is a radial magnetic bearing including a magnetic bearing stator mounted on the outer cylinder, and a magnetic bearing rotor mounted on the inner cylinder. The magnetic bearing is configured to magnetically levitate the inner cylinder with an attractive force between the magnetic bearing stator and the magnetic bearing rotor.

The present disclosure describes an apparatus and a method for a chemical mechanical polishing (CMP) process that recycles used slurry as another slurry supply. The apparatus includes a pad on a rotation platen, a first feeder and a second feeder where each of the first and the second feeder is configured to dispense a slurry on the pad, and a flotation module configured to process a first fluid sprayed from the pad. The flotation module further includes an oulet fluidly connected to the second feeder and configured to output a second fluid, and a first tank configured to store a plurality of chemicals where the plurality of chemicals include a frother and a collector configured to chemically bond with chemicals in the first fluid.

The present disclosure describes an apparatus and a method for a chemical mechanical polishing (CMP) process that recycles used slurry as another slurry supply. The apparatus includes a pad on a rotation platen, a first feeder and a second feeder where each of the first and the second feeder is configured to dispense a slurry on the pad, and a flotation module configured to process a first fluid sprayed from the pad. The flotation module further includes an oulet fluidly connected to the second feeder and configured to output a second fluid, and a first tank configured to store a plurality of chemicals where the plurality of chemicals include a frother and a collector configured to chemically bond with chemicals in the first fluid.

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.

A method of temperature control for a chemical mechanical polishing system includes directing a gas that includes steam from an orifice onto the component in the polishing system while the component is spaced away from a polishing pad of the polishing system to raise a temperature of the component to an elevated temperature, and before the component returns to an ambient temperature, moving the component into contact with the polishing pad.