A conditioning disk replacement apparatus includes; a detacher configured to separate a conditioning disk from to a holder, a transfer part configured to transfer the conditioning disk, and a container configured to store the conditioning disk. The detacher includes a detachment body and a rotary part coupled to the detachment body, the rotary part includes a key protruding outward from the rotary part in a first horizontal direction, and the rotary part is configured to rotate about a central axis extending in the first horizontal direction.

A conditioning disk replacement apparatus includes; a detacher configured to separate a conditioning disk from to a holder, a transfer part configured to transfer the conditioning disk, and a container configured to store the conditioning disk. The detacher includes a detachment body and a rotary part coupled to the detachment body, the rotary part includes a key protruding outward from the rotary part in a first horizontal direction, and the rotary part is configured to rotate about a central axis extending in the first horizontal direction.

An end effector for a robotic sanding system includes a sanding head including a sander configured to sand a surface of a workpiece. A motor is operatively coupled to the sander. The motor is configured to rotate the sander to sand the surface of the workpiece. The motor includes a first central longitudinal axis. A coupler is configured to removably secure the end effector to an attachment interface of an arm of the robotic sanding system. The coupler includes a second central longitudinal axis. The first central longitudinal axis is offset from the second central longitudinal axis. One or more sensors are coupled to the sanding head. The one or more sensors are configured to detect presence of a metal within the predefined range.

An end effector for a robotic sanding system includes a sanding head including a sander configured to sand a surface of a workpiece. A motor is operatively coupled to the sander. The motor is configured to rotate the sander to sand the surface of the workpiece. The motor includes a first central longitudinal axis. A coupler is configured to removably secure the end effector to an attachment interface of an arm of the robotic sanding system. The coupler includes a second central longitudinal axis. The first central longitudinal axis is offset from the second central longitudinal axis. One or more sensors are coupled to the sanding head. The one or more sensors are configured to detect presence of a metal within the predefined range.

A dresser includes a main body having a stepped surface comprising a plurality of steps, wherein a thickness of the main body at a first step of the plurality of steps is a largest thickness of the main body, and a thickness of the main body at a last step of the plurality of steps is a smallest thickness of the main body; and a plurality of superhard particles disposed on each of the plurality of steps of the stepped surface. The plurality of steps of the stepped surface are different in area, and particle diameters of the superhard particles increase stepwise from the first step of the plurality of steps to the last step of the plurality of steps.

A dresser includes a main body having a stepped surface comprising a plurality of steps, wherein a thickness of the main body at a first step of the plurality of steps is a largest thickness of the main body, and a thickness of the main body at a last step of the plurality of steps is a smallest thickness of the main body; and a plurality of superhard particles disposed on each of the plurality of steps of the stepped surface. The plurality of steps of the stepped surface are different in area, and particle diameters of the superhard particles increase stepwise from the first step of the plurality of steps to the last step of the plurality of steps.

The present disclosure describes an apparatus and a method for a chemical mechanical polishing (CMP) process that recycles used slurry as another slurry supply. The apparatus includes a pad on a rotation platen, a first feeder and a second feeder where each of the first and the second feeder is configured to dispense a slurry on the pad, and a flotation module configured to process a first fluid sprayed from the pad. The flotation module further includes an outlet fluidly connected to the second feeder and configured to output a second fluid, and a first tank configured to store a plurality of chemicals where the plurality of chemicals include a frother and a collector configured to chemically bond with chemicals in the first fluid.

The present disclosure describes an apparatus and a method for a chemical mechanical polishing (CMP) process that recycles used slurry as another slurry supply. The apparatus includes a pad on a rotation platen, a first feeder and a second feeder where each of the first and the second feeder is configured to dispense a slurry on the pad, and a flotation module configured to process a first fluid sprayed from the pad. The flotation module further includes an outlet fluidly connected to the second feeder and configured to output a second fluid, and a first tank configured to store a plurality of chemicals where the plurality of chemicals include a frother and a collector configured to chemically bond with chemicals in the first fluid.

A method comprises planarizing a substrate material with a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional groups are configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups. The pad is regenerated by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material. The removed material is complexed in a dissolved complexing agent to form dissolved material in an effluent phase.

A method comprises planarizing a substrate material with a functionalized chemical planarization pad. The functionalized chemical planarization pad includes a plurality of functional groups bonded to a material of the pad. The functional groups are configured to chemically react with the substrate material such that a portion of substrate material bonds to the functional groups. The pad is regenerated by applying a regeneration solution configured to break bonds between the functional groups and substrate material bonded to the functional groups to form removed material. The removed material is complexed in a dissolved complexing agent to form dissolved material in an effluent phase.