In a surface grinding method in which a grinding wheel is dressed with a dressing board on a chuck table by advancing the grinding wheel from a dressing start position and a workpiece on the chuck table is ground by advancing the grinding wheel, the dressing start position is calculated by measuring a thickness of the dressing board and a thickness of the grinding wheel, and the grinding start position is calculated by measuring the thickness of the grinding wheel after the dressing of the grinding wheel with the dressing board.

In a surface grinding method in which a grinding wheel is dressed with a dressing board on a chuck table by advancing the grinding wheel from a dressing start position and a workpiece on the chuck table is ground by advancing the grinding wheel, the dressing start position is calculated by measuring a thickness of the dressing board and a thickness of the grinding wheel, and the grinding start position is calculated by measuring the thickness of the grinding wheel after the dressing of the grinding wheel with the dressing board.

The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic exterior surface, including at least one of (i) a plurality of individual diamond particles and (ii) a plurality of engineered features having a conformable diamond layer and; a conformable hydrophobic layer in contact with and at least partially coating at least one of the plurality of individual diamond particles and the conformable diamond layer and, wherein the conformable hydrophobic layer includes diamond like glass and forms the hydrophobic exterior surface and the contact angle of the hydrophobic exterior surface is greater than 110 degrees.

The present invention relates to a grinding device for machining an, in particular plate-shaped workpiece (W). The grinding device comprises an emitter (31) for emitting electromagnetic waves in the direction of the abrasive belt (10) and a detector (32) for detecting electromagnetic waves which are reflected by the abrasive belt (10).

A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

A polishing system includes a platen having a top surface to support an annular polishing pad, a carrier head to hold a substrate in contact with the annular polishing pad, a support structure extending above the platen and to which one or more polishing system components are secured, and a support post. The platen is rotatable about an axis of rotation that passes through approximately a center of the platen. The first support post has an upper end coupled to and supporting the support structure and a lower portion that is supported on the platen or that extends through an aperture in the platen.

Methods and apparatus for shaping workpieces are described in which data representing the surface form of the workpiece is analysed to determine characteristics of curvature of the surface, and these characteristics are used to determine the size and form required for a tool to apply shaping treatment to all parts of the workpiece surface. Measurements of the actual workpiece are then compared with data relating to the required workpiece form, to determine the amount and distribution of material to be removed from the workpiece. A tool path for moving the tool over the workpiece to achieve the required shaping operation is then determined, and the tool and tool path data are provided to a shaping machine to carry out the shaping operation. The shaping tool may comprise an elastomeric body covered in a flexible cloth on which rigid pellets containing abrasive material are fixed. The specification discloses methods of manufacturing such tools, and also discloses methods for conditioning the pelleted cloth. There is also described a method of determining permissible amounts of tool offset to ensure smooth cutting of the workpiece.

A pad conditioning disk configured to condition a polishing pad of a chemical mechanical polishing tool including a plurality of zones comprising cutting elements that selectively engage the polishing pad based on a positioning of the plurality of zones, is provided. An associated chemical mechanical polishing (CMP) tool and method for conditioning a polishing pad during a chemical mechanical polishing process is also provided.

A pad conditioning disk configured to condition a polishing pad of a chemical mechanical polishing tool including a plurality of zones comprising cutting elements that selectively engage the polishing pad based on a positioning of the plurality of zones, is provided. An associated chemical mechanical polishing (CMP) tool and method for conditioning a polishing pad during a chemical mechanical polishing process is also provided.

A microbial dressing method for super abrasive tools includes a kind of microbe which is capable of consuming the bond in a certain manner is selected to perform the microbial dressing. Specifically, the microbe is inoculated and cultured in the culture medium to a certain concentration, then the dressing area of the abrasive tool is immersed into the culture liquid to remove the bond in the surface by the action of the microbe, and the control of the dressing amount is realized by controlling the microbe concentration and the soaking time. Precise dressing for super abrasive products, particularly for fine grained abrasive tools can be realized using the present method.