A dressing method of a cutting blade includes a first cutting step of causing the cutting blade to cut into a dressing board held by a holding surface of a chuck table with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to form a cut groove in the dressing board, and a second cutting step of causing the cutting blade to further cut into the groove bottom of the cut groove formed in the first cutting step with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to carry out cutting on the groove bottom with tracing of the cut groove.

A dressing method of a cutting blade includes a first cutting step of causing the cutting blade to cut into a dressing board held by a holding surface of a chuck table with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to form a cut groove in the dressing board, and a second cutting step of causing the cutting blade to further cut into the groove bottom of the cut groove formed in the first cutting step with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to carry out cutting on the groove bottom with tracing of the cut groove.

A dressing apparatus 1 includes a regulating body 13 which has a ridge portion 12 with a surface having a shape corresponding to the shape of a grinding surface 6 of a grinding wheel 5, the surface being brought into face-to-face contact, over a required length, with the grinding surface 6 of the grinding wheel 5 which rotates; a jetting abrasive grain generating device 11 serving as a device for generating a pressure fluid with abrasive grains mixed therein; and a jetting port 15 for jetting abrasive grain-mixed compressed air, the jetting port 15 serving as a jetting device for jetting the mixed compressed air as a pressure fluid with the abrasive grains mixed therein from the jetting abrasive grain generating device 11 into a space between the grinding surface 6 and the surface of the ridge portion 12 of the regulating body 13 which are brought into face-to-face contact with each other.

A dressing apparatus 1 includes a regulating body 13 which has a ridge portion 12 with a surface having a shape corresponding to the shape of a grinding surface 6 of a grinding wheel 5, the surface being brought into face-to-face contact, over a required length, with the grinding surface 6 of the grinding wheel 5 which rotates; a jetting abrasive grain generating device 11 serving as a device for generating a pressure fluid with abrasive grains mixed therein; and a jetting port 15 for jetting abrasive grain-mixed compressed air, the jetting port 15 serving as a jetting device for jetting the mixed compressed air as a pressure fluid with the abrasive grains mixed therein from the jetting abrasive grain generating device 11 into a space between the grinding surface 6 and the surface of the ridge portion 12 of the regulating body 13 which are brought into face-to-face contact with each other.

A dressing board for sharpening and/or shaping blades for manufacture of semiconductor devices can include a working surface configured to sharpen and/or shape a cutting surface of a dicing or edging blade for manufacture of a semiconductor device. The working surface can be configured to contact the cutting surface of the blade when sharpening or shaping the cutting surface. The dressing board can include a support substrate configured to support the working surface with respect to a floor of an enclosure in which the dressing board is positioned. In some embodiments, the working surface includes a first portion that is not parallel to the floor.

A microbial dressing method for super abrasive tools includes a kind of microbe which is capable of consuming the bond in a certain manner is selected to perform the microbial dressing. Specifically, the microbe is inoculated and cultured in the culture medium to a certain concentration, then the dressing area of the abrasive tool is immersed into the culture liquid to remove the bond in the surface by the action of the microbe, and the control of the dressing amount is realized by controlling the microbe concentration and the soaking time. Precise dressing for super abrasive products, particularly for fine grained abrasive tools can be realized using the present method.

A microbial dressing method for super abrasive tools includes a kind of microbe which is capable of consuming the bond in a certain manner is selected to perform the microbial dressing. Specifically, the microbe is inoculated and cultured in the culture medium to a certain concentration, then the dressing area of the abrasive tool is immersed into the culture liquid to remove the bond in the surface by the action of the microbe, and the control of the dressing amount is realized by controlling the microbe concentration and the soaking time. Precise dressing for super abrasive products, particularly for fine grained abrasive tools can be realized using the present method.

A method of shaping a cutting blade, includes a modified layer forming step of forming a plurality of modified layers at different heights within a dressing member by irradiating the dressing member with a laser beam having a wavelength transmissible through the dressing member from one surface of the dressing member a plurality of times while a focusing point of the laser beam is positioned within the dressing member, and a blade shaping step of shaping the cutting blade into a predetermined shape formed by the plurality of modified layers by cutting the dressing member by the cutting blade until the cutting blade reaches the modified layers after performing the modified layer forming step.

A dressing method of a cutting blade includes a first cutting step of causing the cutting blade to cut into a dressing board held by a holding surface of a chuck table with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to form a cut groove in the dressing board, and a second cutting step of causing the cutting blade to further cut into the groove bottom of the cut groove formed in the first cutting step with a cutting depth that does not surpass the length of the region of roundness in the radial direction of the cutting blade to carry out cutting on the groove bottom with tracing of the cut groove.

When a work W rotates counterclockwise about an axis O.sub.w and is subjected to infeed grinding by a regulating wheel (1) which rotates clockwise about an axis O.sub.1 and a grinding wheel (2) which rotates clockwise about an axis O.sub.2, a load F acting on a blade (4), a load acting on the work W supported by the blade (4), and a load operating position y in the blade (4) at any given time are measured by a controller (20) based on the outputs of a first stress sensor S.sub.1 and a second stress sensor S.sub.2 and according to the correlation information stored in a storage device. If the component of a specified frequency extracted by performing frequency analysis of the time series of the load exceeds a threshold value, then designation processing is carried out to reduce the component of the designated frequency to the threshold value or less.