A method includes depositing a slurry onto a polishing pad of a chemical mechanical polishing (CMP) station. A workpiece is polished and polishing by-products and slurry are removed from the polishing pad by a vacuum head. A CMP apparatus includes a polishing pad configured to rotate during a CMP process. The apparatus also includes a slurry dispenser configured to deposit a slurry onto a polishing surface of the polishing pad. The apparatus further includes a momentum vacuum assembly including a slotted opening facing the polishing surface of the polishing pad. The apparatus also includes a first suction line coupled to an upper portion of the momentum vacuum assembly and leading to a first vacuum source, the first suction line configured to transport polishing products which have been removed from the polishing pad through the slotted opening.

This groove shape measurement method has a coordinate data acquisition step of acquiring a plurality of pieces of three-dimensional coordinate data (three-dimensional coordinate data set (60)) indicating a shape of a machined groove (9) formed in a machining target object (workpiece (W)) in a machining feed direction (X direction) by a machining device (dicing device (10)) (Step S1), a projection data generation step of generating two-dimensional projection data (62) of the machined groove (9) by projecting the three-dimensional coordinate data onto a two-dimensional plane (two-dimensional plane (61)) perpendicular to the machining feed direction (Step S2), and a cross-sectional profile calculation step of calculating a cross-sectional profile (64) of the machined groove (9) on the basis of the two-dimensional projection data (62) (Step S3).