The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic exterior surface, including at least one of (i) a plurality of individual diamond particles and (ii) a plurality of engineered features having a conformable diamond layer and; a conformable hydrophobic layer in contact with and at least partially coating at least one of the plurality of individual diamond particles and the conformable diamond layer and, wherein the conformable hydrophobic layer includes diamond like glass and forms the hydrophobic exterior surface and the contact angle of the hydrophobic exterior surface is greater than 110 degrees.

A method of using a laminated dressing board is provided. In the laminated dressing board, a shape adjustment dressing layer containing first abrasive grains and used for shape adjustment of a cutting blade and a setting dressing layer containing second abrasive grains and used for setting of the shape-adjusted cutting blade are laminated. The method includes a holding step of holding the shape adjustment dressing layer side of the laminated dressing board by a chuck table, a setting dressing step of causing the cutting blade to cut into the laminated dressing board from the setting dressing layer side to form a first groove in the setting dressing layer, and a shape adjustment dressing step of causing the cutting blade to cut into the bottom of the first groove along the first groove to form a second groove in the shape adjustment dressing layer.

A method of using a laminated dressing board is provided. In the laminated dressing board, a shape adjustment dressing layer containing first abrasive grains and used for shape adjustment of a cutting blade and a setting dressing layer containing second abrasive grains and used for setting of the shape-adjusted cutting blade are laminated. The method includes a holding step of holding the shape adjustment dressing layer side of the laminated dressing board by a chuck table, a setting dressing step of causing the cutting blade to cut into the laminated dressing board from the setting dressing layer side to form a first groove in the setting dressing layer, and a shape adjustment dressing step of causing the cutting blade to cut into the bottom of the first groove along the first groove to form a second groove in the shape adjustment dressing layer.

A conditioning device for conditioning a polishing pad used in chemical mechanical polishing includes a base having an opening and a conditioning disk removably attached to the base. The conditioning disk includes a conditioning portion disposed on a first surface of the base and a fitting portion removably fitted into or through the opening of the base. The fitting portion is fitted through or into the opening to base to prevent dislodging of the conditioning disk from the base during a process of conditioning a polishing pad for the chemical mechanical polishing process.

A conditioning device for conditioning a polishing pad used in chemical mechanical polishing includes a base having an opening and a conditioning disk removably attached to the base. The conditioning disk includes a conditioning portion disposed on a first surface of the base and a fitting portion removably fitted into or through the opening of the base. The fitting portion is fitted through or into the opening to base to prevent dislodging of the conditioning disk from the base during a process of conditioning a polishing pad for the chemical mechanical polishing process.

According to an aspect of the present disclosure, a substrate polishing apparatus is provided. The substrate polishing apparatus includes a turntable for supporting a polishing pad, a dresser that dresses the polishing pad, a dresser drive module that presses the dresser against the polishing pad and rotates the dresser, a support member that supports the dresser drive module, and a plurality of force sensors which are provided between the dresser drive module and the support member and each of which outputs information related to each of forces in three axis directions.

According to an aspect of the present disclosure, a substrate polishing apparatus is provided. The substrate polishing apparatus includes a turntable for supporting a polishing pad, a dresser that dresses the polishing pad, a dresser drive module that presses the dresser against the polishing pad and rotates the dresser, a support member that supports the dresser drive module, and a plurality of force sensors which are provided between the dresser drive module and the support member and each of which outputs information related to each of forces in three axis directions.

A pad conditioner for conditioning a polishing surface of a polishing pad includes a conditioning disk, a disk holder, and a disk arm. The conditioning disk includes a substrate plate and at least two abrasive segments. The conditioning disk includes at least one channel by which debris and spent slurry may be evacuated. The abrasive segments are on a surface of the substrate plate, and form at least one channel segment therebetween. Each channel segment extends from about the center of the surface to substantially the outer rim of the substrate plate. The disk holder to which the conditioning disk is mounted includes a through hole. The disk arm to which the conditioning disk is mounted includes an opening in fluid communication with the at least one channel segment via the through hole for evacuating the debris and spent slurry by a vacuum module.

A pad conditioner for conditioning a polishing surface of a polishing pad includes a conditioning disk, a disk holder, and a disk arm. The conditioning disk includes a substrate plate and at least two abrasive segments. The conditioning disk includes at least one channel by which debris and spent slurry may be evacuated. The abrasive segments are on a surface of the substrate plate, and form at least one channel segment therebetween. Each channel segment extends from about the center of the surface to substantially the outer rim of the substrate plate. The disk holder to which the conditioning disk is mounted includes a through hole. The disk arm to which the conditioning disk is mounted includes an opening in fluid communication with the at least one channel segment via the through hole for evacuating the debris and spent slurry by a vacuum module.

A coupling mechanism capable of preventing vibration of a rotating body from occurring due to a lower-bearing friction torque is disclosed. The coupling mechanism includes an upper spherical bearing and a lower spherical bearing disposed between a drive shaft and a rotating body. The upper spherical bearing has a first concave contact surface and a second convex contact surface, and the lower spherical bearing has a third concave contact surface and a fourth convex contact surface. The first concave contact surface, the second convex contact surface, the third concave contact surface, and the fourth convex contact surface are arranged concentrically. A lower-bearing radius of the lower spherical bearing is determined so that a lower-restoring torque is equal to or less than 0, the lower-restoring torque being the sum of a rotating-body friction torque generated in the rotating body due to a rotating-body frictional force between a polishing pad and the rotating body, and a lower-bearing friction torque generated in the rotating body due to a frictional force between the third concave contact surface and the fourth convex contact surface.