A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions which work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. Such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.

Disclosed is a method for dressing a single- or multi-thread grinding worm (34) in which a main rolling movement between the grinding worm and a gear-like dressing tool (90) is brought about. In order to create flank modifications on the grinding worm, an additional relative movement is superimposed on the main rolling movement. In addition, an auxiliary drive specifically designed for such a method, a correspondingly designed machine tool and a dressing tool for carrying out the method are disclosed.

Disclosed is a method for dressing a single- or multi-thread grinding worm (34) in which a main rolling movement between the grinding worm and a gear-like dressing tool (90) is brought about. In order to create flank modifications on the grinding worm, an additional relative movement is superimposed on the main rolling movement. In addition, an auxiliary drive specifically designed for such a method, a correspondingly designed machine tool and a dressing tool for carrying out the method are disclosed.

A substrate processing apparatus has a table on which a polishing surface for polishing a substrate is provided, and a discharge suction section which has a discharge port which communicates with a fluid supply source and through which a fluid is discharged to the polishing surface and a suction opening which communicates with a vacuum source and through which the fluid existing on the polishing surface is sucked.

A substrate processing apparatus has a table on which a polishing surface for polishing a substrate is provided, and a discharge suction section which has a discharge port which communicates with a fluid supply source and through which a fluid is discharged to the polishing surface and a suction opening which communicates with a vacuum source and through which the fluid existing on the polishing surface is sucked.

A chemical mechanical polishing system includes a platen, a slurry introduction device and at least one polishing head. The platen is configured to allow a polishing pad to be disposed thereon. The slurry introduction device is configured to supply slurry onto the polishing pad. The polishing head includes a main body and at least one grinding piece. The main body has an accommodation space for accommodating a wafer. The grinding piece is disposed on the main body. The grinding piece has a grinding surface configured to grind against the polishing pad.

A chemical mechanical polishing system includes a platen, a slurry introduction device and at least one polishing head. The platen is configured to allow a polishing pad to be disposed thereon. The slurry introduction device is configured to supply slurry onto the polishing pad. The polishing head includes a main body and at least one grinding piece. The main body has an accommodation space for accommodating a wafer. The grinding piece is disposed on the main body. The grinding piece has a grinding surface configured to grind against the polishing pad.

The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic exterior surface, including at least one of (i) a plurality of individual diamond particles and (ii) a plurality of engineered features having a conformable diamond layer and; a conformable hydrophobic layer in contact with and at least partially coating at least one of the plurality of individual diamond particles and the conformable diamond layer and, wherein the conformable hydrophobic layer includes diamond like glass and forms the hydrophobic exterior surface and the contact angle of the hydrophobic exterior surface is greater than 110 degrees.

The present disclosure relates to abrasive articles including conformable coatings, e.g. a hydrophobic coating, methods of making and polishing systems therefrom. The present disclosure provides an abrasive layer, having a hydrophobic exterior surface, including at least one of (i) a plurality of individual diamond particles and (ii) a plurality of engineered features having a conformable diamond layer and; a conformable hydrophobic layer in contact with and at least partially coating at least one of the plurality of individual diamond particles and the conformable diamond layer and, wherein the conformable hydrophobic layer includes diamond like glass and forms the hydrophobic exterior surface and the contact angle of the hydrophobic exterior surface is greater than 110 degrees.

The present disclosure includes one or more resilient members for use in an apparatus used to form lapping plates. The resilient members can permit processing members such as charging elements and shaving blades to conform to irregularities in surface topography of lapping plate platens.