Patent classifications
B24B53/12
DRESSING BOARD, USE METHOD OF DRESSING BOARD, AND CUTTING APPARATUS
A dressing board having, on a surface, a two-dimensional code including information relating to properties of the dressing board and a barcode including identification information associated with the information relating to the properties is provided. Furthermore, there is provided a cutting apparatus including a determining part that determines whether or not the properties of the dressing board read out from an information registration part based on the identification information match the kind of dressing board suitable for dressing of a cutting blade.
ABRASIVE TOOL
An abrasive tool has an abrasive grain layer comprising a plurality of hard abrasive grains bonded by a binder, with a plurality of the hard abrasive grains each having a working surface formed to contact a workpiece, a ratio of a total area of a plurality of such working surfaces to an area of an imaginary plane smoothly connecting the plurality of working surfaces being 5% or more and 30% or less.
ABRASIVE TOOL
An abrasive tool has an abrasive grain layer comprising a plurality of hard abrasive grains bonded by a binder, with a plurality of the hard abrasive grains each having a working surface formed to contact a workpiece, a ratio of a total area of a plurality of such working surfaces to an area of an imaginary plane smoothly connecting the plurality of working surfaces being 5% or more and 30% or less.
Grinding tool
A grinding tool includes a substrate having a surface provided with a plurality of openings, and a plurality of grinding studs. Each of the grinding studs includes a stud portion and an abrasive particle attached to each other, the stud portions being respectively attached into the openings, and the abrasive particles protruding outward from the surface, each of the abrasive particles having a pattern cut across a tip thereof to define multiple apexes adjacent to one another.
CMP pad conditioner
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
CMP pad conditioner
The present invention relates to a CMP pad conditioner having a substrate and a cutting tip pattern formed on at least one surface of the substrate, and more particularly to a CMP pad conditioner having cutting tip patterns, in which the cutting tip patterns have an improved structure that can increase the productivity of the CMP pad conditioner and that can sufficiently ensure the strength and safety of the cutting tip patterns.
Dressing tool and method for the production thereof
Dressing tool including a main body having a working surface covered with hard-material grains distributed on the main body. Recesses for accommodating the hard-material grains are created in the main body and then filled with an adhesive, the excess adhesive is removed across the main body, and thereafter the hard-material grains are flung onto the main body so that only the grains located in the recesses remain adherent to the working surface of the tool. The hard-material grains can then be bonded to the main body by a physical and/or chemical bond. Thus, a distribution of the grains over the working surface of the tool that can be precisely defined in advance is ensured.
Dressing tool and method for the production thereof
Dressing tool including a main body having a working surface covered with hard-material grains distributed on the main body. Recesses for accommodating the hard-material grains are created in the main body and then filled with an adhesive, the excess adhesive is removed across the main body, and thereafter the hard-material grains are flung onto the main body so that only the grains located in the recesses remain adherent to the working surface of the tool. The hard-material grains can then be bonded to the main body by a physical and/or chemical bond. Thus, a distribution of the grains over the working surface of the tool that can be precisely defined in advance is ensured.
ABRASIVE MACHINING
A rotary abrasive machining tool (101) is shown. The tool comprises a hub (103) having plurality of axially-oriented radial slots in the outer circumference thereof, and plurality of abrasive segments each of which is located in a respective slot in the hub and which form an abrading surface (102). The abrasive segments comprise a tab for location in a slot in the hub, and an abrading edge defining a plurality of abrasive elements.
ABRASIVE MACHINING
A rotary abrasive machining tool (101) is shown. The tool comprises a hub (103) having plurality of axially-oriented radial slots in the outer circumference thereof, and plurality of abrasive segments each of which is located in a respective slot in the hub and which form an abrading surface (102). The abrasive segments comprise a tab for location in a slot in the hub, and an abrading edge defining a plurality of abrasive elements.