A truer includes: a core formed into a truncated cone; and an abrasive grain layer fixed onto an outer peripheral surface of the core. The core includes: a base that is a small-diameter portion of the truncated cone and has a disc shape; and a tubular member extending from an outer peripheral edge of the base in the direction in which a rotation axis of the truncated cone extends. The tubular member has a hollow tubular shape. The tubular member includes an outer peripheral surface tapered so that a portion of the tubular member opposite to the base and adjacent to an extremity of the tubular member is a large-diameter portion of the truncated cone. A recess opening toward the extremity is defined inward of the tubular member.

A truer includes: a core formed into a truncated cone; and an abrasive grain layer fixed onto an outer peripheral surface of the core. The core includes: a base that is a small-diameter portion of the truncated cone and has a disc shape; and a tubular member extending from an outer peripheral edge of the base in the direction in which a rotation axis of the truncated cone extends. The tubular member has a hollow tubular shape. The tubular member includes an outer peripheral surface tapered so that a portion of the tubular member opposite to the base and adjacent to an extremity of the tubular member is a large-diameter portion of the truncated cone. A recess opening toward the extremity is defined inward of the tubular member.

A dressing member to be used in adjusting a grindstone tool in which abrasive grains are fixed includes a plurality of ceramic particles having cavities therein, and a bonding material that fixes the ceramic particles.

A dressing member to be used in adjusting a grindstone tool in which abrasive grains are fixed includes a plurality of ceramic particles having cavities therein, and a bonding material that fixes the ceramic particles.

A method for conditioning a polishing pad, which is configured to polish a wafer and attached to a rotatable discoid turntable, by using a conditioning head, the method being characterized by: moving the conditioning head in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable; and controlling a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable. Consequently, the method for conditioning a polishing pad which enables appropriately conditioning an entire polishing surface of the polishing pad can be provided.

A method for conditioning a polishing pad, which is configured to polish a wafer and attached to a rotatable discoid turntable, by using a conditioning head, the method being characterized by: moving the conditioning head in a radial direction of the turntable to perform the conditioning while rotating the polishing pad attached to the turntable by rotation of the turntable; and controlling a rotational speed of the turntable and a moving speed of the conditioning head in the radial direction of the turntable in correspondence with a distance of the conditioning head from a center of the turntable. Consequently, the method for conditioning a polishing pad which enables appropriately conditioning an entire polishing surface of the polishing pad can be provided.

A method of using a laminated dressing board is provided. In the laminated dressing board, a shape adjustment dressing layer containing first abrasive grains and used for shape adjustment of a cutting blade and a setting dressing layer containing second abrasive grains and used for setting of the shape-adjusted cutting blade are laminated. The method includes a holding step of holding the shape adjustment dressing layer side of the laminated dressing board by a chuck table, a setting dressing step of causing the cutting blade to cut into the laminated dressing board from the setting dressing layer side to form a first groove in the setting dressing layer, and a shape adjustment dressing step of causing the cutting blade to cut into the bottom of the first groove along the first groove to form a second groove in the shape adjustment dressing layer.

A method of using a laminated dressing board is provided. In the laminated dressing board, a shape adjustment dressing layer containing first abrasive grains and used for shape adjustment of a cutting blade and a setting dressing layer containing second abrasive grains and used for setting of the shape-adjusted cutting blade are laminated. The method includes a holding step of holding the shape adjustment dressing layer side of the laminated dressing board by a chuck table, a setting dressing step of causing the cutting blade to cut into the laminated dressing board from the setting dressing layer side to form a first groove in the setting dressing layer, and a shape adjustment dressing step of causing the cutting blade to cut into the bottom of the first groove along the first groove to form a second groove in the shape adjustment dressing layer.

Disclosed herein is a cutting apparatus including a moving unit for moving a spindle to position a cutting blade, a rotary dressing mechanism for rotating a dressing grindstone on a rotational shaft parallel to the spindle, and an optical sensor for detecting the position of the outer periphery of the dressing grindstone. The cutting blade is positioned with respect to the rotary dressing mechanism depending on the position, detected by the optical sensor, of the outer periphery of the dressing grindstone, and the cutting blade is dressed by cutting into the dressing grindstone by a predetermined cutting distance.

Disclosed herein is a cutting apparatus including a moving unit for moving a spindle to position a cutting blade, a rotary dressing mechanism for rotating a dressing grindstone on a rotational shaft parallel to the spindle, and an optical sensor for detecting the position of the outer periphery of the dressing grindstone. The cutting blade is positioned with respect to the rotary dressing mechanism depending on the position, detected by the optical sensor, of the outer periphery of the dressing grindstone, and the cutting blade is dressed by cutting into the dressing grindstone by a predetermined cutting distance.