CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a support substrate and a plurality of superabrasive particles secured to the support substrate with each superabrasive particle extending away from the support substrate to a protrusion distance, where a highest protruding tip of each of the plurality of superabrasive particles align along a designated profile with a tip variation of from about 5 microns to about 100 microns.

CMP pad dressers having leveled tips and associated methods are provided. In one aspect, for example, a CMP pad dresser can include a support substrate and a plurality of superabrasive particles secured to the support substrate with each superabrasive particle extending away from the support substrate to a protrusion distance, where a highest protruding tip of each of the plurality of superabrasive particles align along a designated profile with a tip variation of from about 5 microns to about 100 microns.

A chemical mechanical polishing conditioner comprises a substrate and at least one abrasive unit. The abrasive unit is provided on the substrate, and the abrasive unit comprises a supporting layer, an abrasive layer and a stress-relief layer. The supporting layer is provided with a working face far away from the substrate and a non-working face opposite to the working face. The abrasive layer is provided on the working face of the supporting layer, and the abrasive layer is a first diamond-plated film formed by chemical vapor deposition method. The first diamond-plated film is provided with a plurality of abrasive tips. The stress-relief layer is provided on the non-working face of the supporting layer, and the stress-relief layer is a second diamond-plated film formed by chemical vapor deposition method. A thermal stress-relieving effect may be exerted by the stress-relief layer, so as to reduce warpage or deformation of the supporting layer.

A chemical mechanical polishing conditioner comprises a substrate and at least one abrasive unit. The abrasive unit is provided on the substrate, and the abrasive unit comprises a supporting layer, an abrasive layer and a stress-relief layer. The supporting layer is provided with a working face far away from the substrate and a non-working face opposite to the working face. The abrasive layer is provided on the working face of the supporting layer, and the abrasive layer is a first diamond-plated film formed by chemical vapor deposition method. The first diamond-plated film is provided with a plurality of abrasive tips. The stress-relief layer is provided on the non-working face of the supporting layer, and the stress-relief layer is a second diamond-plated film formed by chemical vapor deposition method. A thermal stress-relieving effect may be exerted by the stress-relief layer, so as to reduce warpage or deformation of the supporting layer.

A dressing tool, to be used in dressing a plurality of grindstones arrayed in an annular pattern on one surface side of a grinding wheel, includes a dressing section for dressing the plurality of grindstones, a support plate that is located on a side opposite to a front surface side of the dressing section making contact with the plurality of grindstones and that supports a back surface side of the dressing section, and an RFID tag from and in which information concerning the dressing tool is read and written. One of or both the support plate and the dressing section are provided with a recess, and the RFID tag is disposed in the recess and is fixed by a non-conductive material provided in the recess.

A dressing tool, to be used in dressing a plurality of grindstones arrayed in an annular pattern on one surface side of a grinding wheel, includes a dressing section for dressing the plurality of grindstones, a support plate that is located on a side opposite to a front surface side of the dressing section making contact with the plurality of grindstones and that supports a back surface side of the dressing section, and an RFID tag from and in which information concerning the dressing tool is read and written. One of or both the support plate and the dressing section are provided with a recess, and the RFID tag is disposed in the recess and is fixed by a non-conductive material provided in the recess.

A rotary dresser includes a cored bar, an electroformed layer, and superabrasive grains fixed to an outer circumferential surface of the electroformed layer, and a plurality of island regions in which a plurality of superabrasive grains is gathered is provided at certain intervals. Since a plurality of the island regions in which a plurality of the superabrasive grains is gathered is provided at certain intervals, the same degree of dressing accuracy can be obtained as in a case in which expensive large superabrasive grains are fixed at a low density using cheap and small superabrasive grains, it is possible to decrease the contact area of a single superabrasive grain, and favorable cutting quality can be obtained.

A rotary dresser includes a cored bar, an electroformed layer, and superabrasive grains fixed to an outer circumferential surface of the electroformed layer, and a plurality of island regions in which a plurality of superabrasive grains is gathered is provided at certain intervals. Since a plurality of the island regions in which a plurality of the superabrasive grains is gathered is provided at certain intervals, the same degree of dressing accuracy can be obtained as in a case in which expensive large superabrasive grains are fixed at a low density using cheap and small superabrasive grains, it is possible to decrease the contact area of a single superabrasive grain, and favorable cutting quality can be obtained.

Systems and methods are disclosed herein for dressing and trueing grinding wheels. A laser may be directed substantially tangential to a grinding surface of a grinding wheel. The laser may be a continuous wave laser and may ablate material from the grinding surface. The laser may move relative to the grinding wheel in order to ablate shaped surface profiles into the grinding surface.

Systems and methods are disclosed herein for dressing and trueing grinding wheels. A laser may be directed substantially tangential to a grinding surface of a grinding wheel. The laser may be a continuous wave laser and may ablate material from the grinding surface. The laser may move relative to the grinding wheel in order to ablate shaped surface profiles into the grinding surface.