A grinding apparatus includes: a grinding stone in which an outer circumferential surface thereof is pressed against the workpiece while being rotated and driven; and a fluid injection apparatus that has a fluid injection nozzle including an injection port from which a fluid is injected to the outer circumferential surface of the grinding stone, and a grinding oil supply apparatus that supplies a grinding oil to a processing point and that includes a grinding oil supply nozzle separate from the fluid injection nozzle, the processing point being an abutting section of the grinding stone and the workpiece, wherein the injection port is arranged so as to face the outer circumferential surface of the grinding stone in a state capable of injecting the fluid to a position different from the processing point in a radial direction of the grinding stone among the outer circumferential surface of the grinding stone.

A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.

A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.

A floor sander comprising a drive motor, a horizontal rotating drum having a top and a bottom driven by the drive motor and a housing covering the top of the rotating drum, wherein the rotating drum supports and drives sandpaper continuously, and the bottom of the rotating drum is exposed to sand a floor; wherein the floor sander has a blower impeller driven by the shaft of the drive motor to create an air flow that is fluidly conducted by a channel mounted on the outside of the housing and the air flow is directed toward the rotating drum to cool the drum.

A floor sander comprising a drive motor, a horizontal rotating drum having a top and a bottom driven by the drive motor and a housing covering the top of the rotating drum, wherein the rotating drum supports and drives sandpaper continuously, and the bottom of the rotating drum is exposed to sand a floor; wherein the floor sander has a blower impeller driven by the shaft of the drive motor to create an air flow that is fluidly conducted by a channel mounted on the outside of the housing and the air flow is directed toward the rotating drum to cool the drum.

A grinding apparatus includes a chuck, a housing, a tool driving unit, a nozzle, a sensor and a sensor cover. The chuck is configured to hold a substrate. The housing accommodates the chuck therein. The tool driving unit is configured to drive a grinding tool pressed against the substrate within the housing. The nozzle is configured to supply a grinding liquid to the substrate within the housing. The sensor is disposed at an inside of the housing and is configured to detect a liquid level of a liquid collected within the housing. The sensor cover is located between the chuck and the sensor.

A conditioning device includes: an ejector for ejecting steam to a rotating polishing pad; and an ejector support supporting the ejector. The ejector includes a plurality of nozzles for ejecting the steam to the polishing pad and a nozzle heater for heating the plurality of nozzles. The nozzle heater is configured to heat nozzles disposed to correspond to a peripheral region of the polishing pad, among the plurality of nozzles, to a higher temperature than nozzles disposed to correspond to a central region of the polishing pad among the plurality of nozzles.

The present disclosure relates to a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a machine comprises a machine frame, a grinding head 2, supported by and being rotatable relative to the machine frame, a grinding head hood 2, which defines a space in which the grinding head 1 is rotatable, a hollow and resilient member 4, arranged in the space, and a pressurized fluid source, operatively connected to the hollow member 4 to supply said pressurized fluid, whereby the hollow member 4 is resiliently expandable upon supply of said fluid.

The present disclosure relates to a floor grinding machine for grinding floor surfaces of stone or stone-like material. Such a machine comprises a machine frame, a grinding head 2, supported by and being rotatable relative to the machine frame, a grinding head hood 2, which defines a space in which the grinding head 1 is rotatable, a hollow and resilient member 4, arranged in the space, and a pressurized fluid source, operatively connected to the hollow member 4 to supply said pressurized fluid, whereby the hollow member 4 is resiliently expandable upon supply of said fluid.

An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.