An object of the present invention is to provide a polishing table capable of preventing peeling or detachment of a coating of the polishing table, thereby to enable an operation for replacement of a polishing pad to be easily conducted. One embodiment of the present invention provides a polishing table having a support surface configured to support a polishing pad, the polishing pad being adapted to be used for polishing a substrate, the polishing table comprising: a stacked body comprising a stack of a porous layer and a non-porous layer, the porous layer including open pores formed in a surface thereof disposed to face a polishing pad; and a resin-based coating material disposed in the open pores so as to form at least a part of the support surface of the polishing table.

A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a supply unit that supplies grinding water to at least the grindstone when grinding the workpiece; and a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table. The light applying unit includes a light emission section that emits light, and a diffusion preventive wall that surrounds the light emission section and prevents diffusion of the light.

A grinding apparatus includes a table that holds a workpiece, and a grinding unit including a grinding wheel mounted to a spindle. The grinding wheel has a grindstone formed by binding abrasive grains with a bonding agent. In addition, the grinding apparatus further includes: a supply unit that supplies grinding water to at least the grindstone when grinding the workpiece; and a light applying unit that is disposed adjacent to the table and that applies light to a grinding surface of the grindstone grinding the workpiece held by the table. The light applying unit includes a light emission section that emits light, and a diffusion preventive wall that surrounds the light emission section and prevents diffusion of the light.

Provided is a method for preventing metal contamination during cutting of a polycrystalline silicon rod. A method for cutting a polycrystalline silicon rod (S) includes the step of cutting the polycrystalline silicon rod (S) by using a cutting tool (133). The step of cutting includes: delivering a liquid (L1) to a cutting position of the polycrystalline silicon rod (S) through a first nozzle (14); and delivering a liquid (L2) to a surface of the polycrystalline silicon rod (S) through a second nozzle (15).

Provided is a method for preventing metal contamination during cutting of a polycrystalline silicon rod. A method for cutting a polycrystalline silicon rod (S) includes the step of cutting the polycrystalline silicon rod (S) by using a cutting tool (133). The step of cutting includes: delivering a liquid (L1) to a cutting position of the polycrystalline silicon rod (S) through a first nozzle (14); and delivering a liquid (L2) to a surface of the polycrystalline silicon rod (S) through a second nozzle (15).

An air guider disposed in a grinding machine tool. The grinding machine tool comprises a casing and a motor disposed in the casing. The casing comprises a head for disposing the motor and a body formed with at least one air inlet. The air guider comprises a main body, and an ascending diversion portion integrally formed with the main body, the main body is disposed at a junction between the head and the body, the ascending diversion portion comprises a main guide surface to guide a first heat dissipation airflow entering from the air inlet to flow toward a top of the motor, and two auxiliary guide surfaces respectively disposed on two sides of the main guide surface to generate a second heat dissipation airflow.

A grinding apparatus includes: a grinding stone in which an outer circumferential surface thereof is pressed against the workpiece while being rotated and driven; and a fluid injection apparatus that has a fluid injection nozzle including an injection port from which a fluid is injected to the outer circumferential surface of the grinding stone, and a grinding oil supply apparatus that supplies a grinding oil to a processing point and that includes a grinding oil supply nozzle separate from the fluid injection nozzle, the processing point being an abutting section of the grinding stone and the workpiece, wherein the injection port is arranged so as to face the outer circumferential surface of the grinding stone in a state capable of injecting the fluid to a position different from the processing point in a radial direction of the grinding stone among the outer circumferential surface of the grinding stone.

A grinding apparatus includes: a grinding stone in which an outer circumferential surface thereof is pressed against the workpiece while being rotated and driven; and a fluid injection apparatus that has a fluid injection nozzle including an injection port from which a fluid is injected to the outer circumferential surface of the grinding stone, and a grinding oil supply apparatus that supplies a grinding oil to a processing point and that includes a grinding oil supply nozzle separate from the fluid injection nozzle, the processing point being an abutting section of the grinding stone and the workpiece, wherein the injection port is arranged so as to face the outer circumferential surface of the grinding stone in a state capable of injecting the fluid to a position different from the processing point in a radial direction of the grinding stone among the outer circumferential surface of the grinding stone.

A method of removing material from a workpiece includes moving a coated abrasive over a receiving surface of a platen, the receiving surface having at least one opening configured for the flow of an ejection material therethrough, moving the platen and workpiece relative to each other to contact the coated abrasive to the workpiece and removing material from the workpiece, and controlling a flow pressure for the ejection material through the at least one opening during removing material from the workpiece, where the flow pressure of the ejection material can be adjusted based on at least one of the operation parameters such as a translation rate of the coated abrasive over the receiving surface, the weight of the coated abrasive, a material removal rate, a coefficient of friction between the coated abrasive and the platen, or a combination thereof.

A method of removing material from a workpiece includes moving a coated abrasive over a receiving surface of a platen, the receiving surface having at least one opening configured for the flow of an ejection material therethrough, moving the platen and workpiece relative to each other to contact the coated abrasive to the workpiece and removing material from the workpiece, and controlling a flow pressure for the ejection material through the at least one opening during removing material from the workpiece, where the flow pressure of the ejection material can be adjusted based on at least one of the operation parameters such as a translation rate of the coated abrasive over the receiving surface, the weight of the coated abrasive, a material removal rate, a coefficient of friction between the coated abrasive and the platen, or a combination thereof.