Provided is a polishing apparatus and polishing method which can preferably adjust a temperature of a surface of a polishing pad. A polishing apparatus includes: a polishing table configured to be rotatable, and to support the polishing pad; a substrate configured to hold an object to be polished, and to press the object to be polished against the polishing pad; a polishing liquid supplying portion configured to supply a polishing liquid to a polishing surface; a polishing liquid removing portion configured to remove the polishing liquid from the polishing surface; and a temperature adjuster configured to adjust a temperature of the polishing surface. In a rotating direction of the polishing table, the polishing liquid supplying portion, a polishing region where the object to be polished is pressed against the polishing surface by the substrate, the polishing liquid removing portion, and the temperature adjuster are disposed in this order.

A cutting blade mounting mechanism for mounting a cutting blade to a tip portion of a spindle includes: a blade mount mounted to the tip portion of the spindle; and an air supply unit supplying air to the blade mount. The blade mount includes: a columnar boss section inserted into a through-hole provided in an annular base of the cutting blade; a flange section projecting in a radial direction from a side of a base end of the boss section and having a support surface supporting the cutting blade; and an ejector type blade suction section having a first air passage connecting a supply port supplied with air from the air supply unit and a discharge port discharging air, and a second air passage connecting a suction port opening to a side of the support surface of the flange section and the first air passage.

A cutting blade mounting mechanism for mounting a cutting blade to a tip portion of a spindle includes: a blade mount mounted to the tip portion of the spindle; and an air supply unit supplying air to the blade mount. The blade mount includes: a columnar boss section inserted into a through-hole provided in an annular base of the cutting blade; a flange section projecting in a radial direction from a side of a base end of the boss section and having a support surface supporting the cutting blade; and an ejector type blade suction section having a first air passage connecting a supply port supplied with air from the air supply unit and a discharge port discharging air, and a second air passage connecting a suction port opening to a side of the support surface of the flange section and the first air passage.

An apparatus for robot-supported grinding includes: a manipulator; a grinding machine; a linear actuator coupling the grinding machine to a tool center point (TCP) of the manipulator; an extraction system connected to an outlet in a housing of the grinding machine; and a hose connecting the extraction system to the outlet in the housing of the grinding machine. The hose is arranged around the housing of the grinding machine and the linear actuator in a roughly spiral-formed manner and is attached at one end to the manipulator.

A treatment tool for reconditioning the top surfaces of a plurality of projections of a substrate support in a lithographic tool. The treatment tool includes a reconditioning surface which is rough relative to smoothed top surfaces of the projections and which reconditioning surface has material harder than that of the material of the top surfaces of the projections. A reconditioning method involves causing an interaction between the reconditioning surface of the treatment tool and the top surfaces of the projections of the substrate support, so as to leave these top surfaces rougher than they were prior to the interaction.

A grinding apparatus includes: a holding table for holding a workpiece thereon; a grinding unit including a grinding wheel for grinding the workpiece held on the holding table, the grinding wheel including a grinding stone made of abrasive grains and grains of photocatalyst bonded by a vitrified bonding material; a grinding water supply unit configured to supply grinding water to the grinding stone when the workpiece held on the holding table is ground by the grinding unit; and a light applying unit disposed adjacent to the holding table and configured to apply light to a grinding surface of the grinding stone while the workpiece held on the holding table being ground.

A grinding apparatus includes: a holding table for holding a workpiece thereon; a grinding unit including a grinding wheel for grinding the workpiece held on the holding table, the grinding wheel including a grinding stone made of abrasive grains and grains of photocatalyst bonded by a vitrified bonding material; a grinding water supply unit configured to supply grinding water to the grinding stone when the workpiece held on the holding table is ground by the grinding unit; and a light applying unit disposed adjacent to the holding table and configured to apply light to a grinding surface of the grinding stone while the workpiece held on the holding table being ground.

A cooling device for a rotating machine has a fan assembly coupled with a backing plate. A hub, on the backing plate, secures the cooling device with a shaft. The backing plate includes one or more vents to enable air to exit the cooling device. The fan includes an opening to enable air to enter the cooling device. A chamber is formed between the fan assembly and the backing plate. During rotation, air is drawn into the opening. The air is passed into the chamber and exits through the vents to cool a work surface or working pad attached to the backing plate.

A cooling device for a rotating machine has a fan assembly coupled with a backing plate. A hub, on the backing plate, secures the cooling device with a shaft. The backing plate includes one or more vents to enable air to exit the cooling device. The fan includes an opening to enable air to enter the cooling device. A chamber is formed between the fan assembly and the backing plate. During rotation, air is drawn into the opening. The air is passed into the chamber and exits through the vents to cool a work surface or working pad attached to the backing plate.

A sealing portion on a lower end of a cover portion of a spindle cover has an upper side surface and a lower side surface that are inclined toward an outer circumferential surface of a spindle. A larger-diameter disk and the outer circumferential surface of the spindle define therebetween a second gap that is narrower than a first gap defined between the spindle and the cover portion. The second gap is effective to prevent a processing waste liquid from entering between the spindle and the spindle cover to prevent a solid waste contained in the processing waste liquid from sticking to the spindle. The spindle is thus prevented from becoming less liable to rotate smoothly due to solid waste deposits.