A glass grinding apparatus includes a base unit assembly having a work-piece support assembly and a motor housing assembly. The work-piece support assembly includes a work-piece support grating and a water basin. The motor housing assembly includes a motor housing containing a grinding motor and a power supply. The grinding motor has a rotatable motor shaft whose upper end is configured to receive a glass grinding bit operable to grind a glass work-piece situated on the work-piece support grating. In one aspect, the grinding motor operates on direct current provided by an AC/DC power supply that is directly operable with different utility mains. In another aspect, the work-piece support assembly is a discrete unit having lifting handles. In another aspect, the work-piece support grating has water-restriction baffles and/or a water-level view port. In another aspect, an integrated lamp-shield assembly is provided. In another aspect, a self-contained pedestal assembly is provided.

An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

An apparatus for performing a polishing process includes: a rotatable polishing pad; a temperature sensor configured to monitor a temperature on a top surface of the rotatable polishing pad; a first dispenser configured to dispense a first slurry that is maintained at a first temperature on the rotatable polishing pad; and a second dispenser configured to dispense a second slurry that is maintained at a second temperature on the rotatable polishing pad, wherein the second temperature is different from the first temperature so as to maintain the temperature on the top surface of the rotatable polishing pad at a substantially constant value.

A cooling device for a rotating machine has a fan assembly coupled with a backing plate. A hub, on the backing plate, secures the cooling device with a shaft. The backing plate includes one or more vents to enable air to exit the cooling device. The fan includes an opening to enable air to enter the cooling device. A chamber is formed between the fan assembly and the backing plate. During rotation, air is drawn into the opening. The air is passed into the chamber and exits through the vents to cool a work surface or working pad attached to the backing plate.

A cooling device for a rotating machine has a fan assembly coupled with a backing plate. A hub, on the backing plate, secures the cooling device with a shaft. The backing plate includes one or more vents to enable air to exit the cooling device. The fan includes an opening to enable air to enter the cooling device. A chamber is formed between the fan assembly and the backing plate. During rotation, air is drawn into the opening. The air is passed into the chamber and exits through the vents to cool a work surface or working pad attached to the backing plate.

A method cuts semiconductor wafers. The method includes: cutting a semiconductor ingot into a workpiece; and sawing the workpiece into slices using a wire grid having a fixed abrasive grain wire, while moving workpiece towards the wire grid. At a first contact of the workpiece with the wire grid, an initial cutting speed is less than 2 mm/min, coolant flow is less than 0.1 l/h and a wire speed is greater than 20 m/s. The workpiece is then guided through the wire grid until a first cutting depth is reached, and then the coolant flow is increased to at least 2000 l/h. The cutting speed is reduced to less than 70% of the initial cutting speed between the first contact of the workpiece with the wire grid up to a cutting depth of half a diameter of the cylinder, and is then increased.

A method cuts semiconductor wafers. The method includes: cutting a semiconductor ingot into a workpiece; and sawing the workpiece into slices using a wire grid having a fixed abrasive grain wire, while moving workpiece towards the wire grid. At a first contact of the workpiece with the wire grid, an initial cutting speed is less than 2 mm/min, coolant flow is less than 0.1 l/h and a wire speed is greater than 20 m/s. The workpiece is then guided through the wire grid until a first cutting depth is reached, and then the coolant flow is increased to at least 2000 l/h. The cutting speed is reduced to less than 70% of the initial cutting speed between the first contact of the workpiece with the wire grid up to a cutting depth of half a diameter of the cylinder, and is then increased.

A cutting tool includes an electric motor supported by a housing, an accessory mounting portion including an output member connected to a saw blade, a transmission mechanism connecting the electric motor to the output member, a base plate disposed at the bottom of the housing and having a mounting hole for the saw blade to pass through, a battery pack interface configured to be detachably connected to a battery pack, a liquid storage system including a liquid storage device configured to store a liquid and detachably mounted on the housing, and a system control member disposed on a liquid flow path of the liquid storage system and used for controlling the flow state of the liquid in the liquid storage device. The electric motor is a brushless motor, and a rotational speed of the electric motor is not lower than 7000 revolutions per minute.

Provided is an electric work machine in which it is possible to limit the risk of contact between a control unit and wiring provided inside a motor housing. In the electric work machine (1A), a motor (6) and a control unit (13) are housed inside a motor housing (2). A gear case (4) is connected in front of the motor housing (2) and a handle housing (3) is connected behind the motor housing (2). The motor housing (2) is an integrally molded cylinder. Electrical connection between the wiring of the motor (6) and the wiring of the control unit (13) is accomplished by connectors (23), which are inside the handle housing (3) that is outside of and behind the motor housing (2). The control unit (13) has a switching element for conducting electricity to the motor (6).

Provided is an electric work machine in which it is possible to limit the risk of contact between a control unit and wiring provided inside a motor housing. In the electric work machine (1A), a motor (6) and a control unit (13) are housed inside a motor housing (2). A gear case (4) is connected in front of the motor housing (2) and a handle housing (3) is connected behind the motor housing (2). The motor housing (2) is an integrally molded cylinder. Electrical connection between the wiring of the motor (6) and the wiring of the control unit (13) is accomplished by connectors (23), which are inside the handle housing (3) that is outside of and behind the motor housing (2). The control unit (13) has a switching element for conducting electricity to the motor (6).