A cutting apparatus includes a cutting unit including a spindle as a rotational shaft and a mount flange for mounting a cutting blade thereon, the mount flange being fixed to a distal end of the spindle, a support unit for supporting a cutting blade housed in a blade case, the support unit including a blade case support for supporting the blade case for housing the cutting blade therein, a changing mechanism for dismounting a cutting blade that has been mounted on the mount flange from the mount flange and mounting the cutting blade that has been supported on the support unit on the mount flange, and a moving mechanism for moving the changing mechanism between a changing position, a blade transfer position, and a retracted position.

A chip suction cover is used for a machine tool including: a spindle configured to rotate a tool; and a suction mechanism unit configured to suck chips of a workpiece that are produced in accordance with rotation of the tool. The chip suction cover includes: a hollow body that is provided with an opening through which a rotation central axis of the spindle extends and that is arranged so as to surround the tool; and a cover body that is provided in the hollow body so as to partially close the opening and that is configured to cover a part of a tip end portion of the tool while exposing a remaining part of the tip end portion of the tool. A chip suction cover having such a configuration that improves the efficiency of sucking chips produced due to workpiece machining is provided.

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.

An integrated machine for automatic cutting, polishing, stacking, and unloading of substrates, including a laser cutting machine, a mechanical laser arm, a polishing machine, a polishing device, a first finished product placement rack, a second finished product placement rack, and an automatic stacking device. The mechanical laser arm is fixed on the frame of the laser cutting machine, the polishing device is fixed on the polishing machine, and the first finished product placement rack and the second finished product placement rack are arranged on both sides of the automatic stacking device. The present disclosure can achieve cutting the substrates of any size, and can automatically polish the edges of the cut substrates. The present disclosure has the characteristics of automation, integration, and multi-functionality, effectively reducing the number of supporting equipment and occupying space.

A polishing apparatus includes a polishing device, a polishing fixing device, and a controller. The polishing fixing device includes a rotating mechanism, a sensor, a movement compensation assembly, a first moving assembly and a second moving assembly. The sensor in the polishing fixing device senses pressure applied to the workpiece during polishing, the movement compensation assembly can drive the rotating mechanism to move in compensation, so as to keep the polishing pressure within a certain range for uniformity in polishing, improving the polishing quality and production efficiency of the workpiece.

A polishing apparatus includes a polishing device, a polishing fixing device, and a controller. The polishing fixing device includes a rotating mechanism, a sensor, a movement compensation assembly, a first moving assembly and a second moving assembly. The sensor in the polishing fixing device senses pressure applied to the workpiece during polishing, the movement compensation assembly can drive the rotating mechanism to move in compensation, so as to keep the polishing pressure within a certain range for uniformity in polishing, improving the polishing quality and production efficiency of the workpiece.

To reduce, in processing in which grinding is performed after additive manufacturing, an amount of coating formed by additive manufacturing that exceeds a thickness required for a product. A composite grinding machine includes a holding unit that is configured to hold and rotate a workpiece, an additive manufacturing unit that is configured to move with respect to the holding unit, and that fuses a material while supplying the material to a surface of the workpiece that is held by the holding unit, thereby causing adhesion of the material to the surface, a grinding unit that is configured to move with respect to the holding unit and that includes a grindstone and rotates the grindstone, and a coolant supply unit that supplies a coolant to a portion where the workpiece held by the holding unit and the grindstone come into contact.

To reduce, in processing in which grinding is performed after additive manufacturing, an amount of coating formed by additive manufacturing that exceeds a thickness required for a product. A composite grinding machine includes a holding unit that is configured to hold and rotate a workpiece, an additive manufacturing unit that is configured to move with respect to the holding unit, and that fuses a material while supplying the material to a surface of the workpiece that is held by the holding unit, thereby causing adhesion of the material to the surface, a grinding unit that is configured to move with respect to the holding unit and that includes a grindstone and rotates the grindstone, and a coolant supply unit that supplies a coolant to a portion where the workpiece held by the holding unit and the grindstone come into contact.