A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

A substrate polishing apparatus includes a polishing table 30 having a polishing surface 10 in the upper surface, a substrate holding portion 31 that holds a substrate W having a surface to be polished in the lower surface, and a holding portion cover 36 that covers the outer side of the substrate holding portion 31. Between the lower portion of the holding portion cover 36 and the upper surface of the polishing table 30, a gap portion for intake 37 is provided, and in the upper portion of the holding portion cover 36, a pipe for exhaust 39 connected to an exhaust mechanism 38 is provided. By operating the exhaust mechanism 38, a rising air current from the gap portion 37 toward the pipe 39 is formed between the outer surface of the substrate holding portion 31 and the inner surface of the holding portion cover 36.

A chip suction cover is used for a machine tool including: a spindle configured to rotate a tool; and a suction mechanism unit configured to suck chips of a workpiece that are produced in accordance with rotation of the tool. The chip suction cover includes: a hollow body that is provided with an opening through which a rotation central axis of the spindle extends and that is arranged so as to surround the tool; and a cover body that is provided in the hollow body so as to partially close the opening and that is configured to cover a part of a tip end portion of the tool while exposing a remaining part of the tip end portion of the tool. A chip suction cover having such a configuration that improves the efficiency of sucking chips produced due to workpiece machining is provided.

A chip suction cover is used for a machine tool including: a spindle configured to rotate a tool; and a suction mechanism unit configured to suck chips of a workpiece that are produced in accordance with rotation of the tool. The chip suction cover includes: a hollow body that is provided with an opening through which a rotation central axis of the spindle extends and that is arranged so as to surround the tool; and a cover body that is provided in the hollow body so as to partially close the opening and that is configured to cover a part of a tip end portion of the tool while exposing a remaining part of the tip end portion of the tool. A chip suction cover having such a configuration that improves the efficiency of sucking chips produced due to workpiece machining is provided.

Disclosed is a technology being implemented in an apparatus for coating a substrate with swarf particles. The apparatus facilitates depositing metal coating onto metal surfaces, polymers, and ceramics. In this apparatus, the grinding process is retrofitted to deposit coatings onto substrates that range from soft (e.g., polymers and aluminium) to hard (e.g., glass-ceramic) materials. The apparatus comprises a sample holder, an infeed, and a grinding wheel. The sample holder holds a substrate to be coated with swarf particles. The infeed holding a work piece. The grinding wheel is mounted at a predefined height over the infeed. The apparatus is used to perform metal coating by depositing the swarf materials on surface of the substrate. It may be noted that the swarf materials are generated by grinding the work piece with the grinding wheel.

An oil mist recovery, separation and purification device for a minimum quantity lubricant (MQL) grinding process, including: a pneumatic separation mechanism, a pipeline and a fan fixedly connected with one end of the pipeline, wherein the fan is configured to form a negative pressure in the pipeline, one cone-shaped filter mesh mechanism is disposed in the pipeline, and a tip of the cone-shaped filter mesh mechanism faces the side of an air inlet direction of the pipeline; and a filtering and recovery mechanism connected with the pipeline and including a case body, a filtering mechanism and a recovery mechanism, wherein the case body is connected with the pipeline through a connecting part, and the filtering mechanism is connected with the recovery mechanism. The device can separate, recover and reuse oil mist particles in the air.

An oil mist recovery, separation and purification device for a minimum quantity lubricant (MQL) grinding process, including: a pneumatic separation mechanism, a pipeline and a fan fixedly connected with one end of the pipeline, wherein the fan is configured to form a negative pressure in the pipeline, one cone-shaped filter mesh mechanism is disposed in the pipeline, and a tip of the cone-shaped filter mesh mechanism faces the side of an air inlet direction of the pipeline; and a filtering and recovery mechanism connected with the pipeline and including a case body, a filtering mechanism and a recovery mechanism, wherein the case body is connected with the pipeline through a connecting part, and the filtering mechanism is connected with the recovery mechanism. The device can separate, recover and reuse oil mist particles in the air.

The present invention is method for polishing silicon wafer, the method including recovering used slurry containing polishing abrasive grains that have been supplied to the silicon wafer and used for polishing, and circulating and supplying the recovered used slurry to the silicon wafer to polish the silicon wafer, wherein mixed alkali solution containing chelating agent and either or both of a pH adjuster and a polishing rate accelerator is added to the recovered used slurry without adding unused polishing abrasive grains, and the recovered used slurry is circulated and supplied to the silicon wafer to polish the silicon wafer. As a result, there is provided a method for polishing a silicon wafer that can suppress the occurrence of metal impurity contamination and stabilize the composition (e.g., the concentration of the chelating agent) of the used slurry when the used slurry is circulated and supplied to the silicon wafer for polishing.

The present invention is method for polishing silicon wafer, the method including recovering used slurry containing polishing abrasive grains that have been supplied to the silicon wafer and used for polishing, and circulating and supplying the recovered used slurry to the silicon wafer to polish the silicon wafer, wherein mixed alkali solution containing chelating agent and either or both of a pH adjuster and a polishing rate accelerator is added to the recovered used slurry without adding unused polishing abrasive grains, and the recovered used slurry is circulated and supplied to the silicon wafer to polish the silicon wafer. As a result, there is provided a method for polishing a silicon wafer that can suppress the occurrence of metal impurity contamination and stabilize the composition (e.g., the concentration of the chelating agent) of the used slurry when the used slurry is circulated and supplied to the silicon wafer for polishing.

A method for the surface treatment of workpieces by means of abrasive media, and a surface treatment composition. The method comprises the steps of providing a treatment tool, providing an abrasive medium, supplying a workpiece having a surface to be treated, surface treating the workpiece, involving removal of material and producing waste products, and processing the waste products, wherein at least one of said steps comprises adding an additive to lower a self-ignition tendency on the part of the waste products, the additive comprising a salt, composed of a carbonate and/or of a halogen anion.