There is provided an apparatus for polishing an object to be polished using a polishing pad having a polishing surface, the apparatus including a polishing table for supporting the polishing pad, the polishing table being configured to be rotatable, a substrate holding unit configured to hold the object to be polished and pressing the object to be polished against the polishing pad, and a polishing-liquid removing unit configured to remove polishing liquid from the polishing surface. The polishing-liquid removing unit includes a rinse unit configured to jet cleaning liquid onto the polishing surface and a sucking unit configured to suck the polishing liquid on the polishing surface onto which the cleaning liquid is jetted. The rinse unit includes a cleaning space surrounded by a sidewall. The sidewall includes an opening section for opening the cleaning space toward a radial direction outer side of the polishing table.

A glass polishing device has a casing adapted for operative engagement with the exterior surface of a powered drill motor. The casing includes a handle extending from a second side opposite an opening in an opposite first side thereof from which a handle of the engaged drill motor projects. A triggerable fluid supply is coupled to the casing and projects fluid to a tool or a section of glass being resurfaced by the tool.

A glass polishing device has a casing adapted for operative engagement with the exterior surface of a powered drill motor. The casing includes a handle extending from a second side opposite an opening in an opposite first side thereof from which a handle of the engaged drill motor projects. A triggerable fluid supply is coupled to the casing and projects fluid to a tool or a section of glass being resurfaced by the tool.

A wafer polishing head is provided. The wafer polishing head includes a carrier head, a plurality of piezoelectric actuators disposed on the carrier head, and a membrane disposed over the plurality of piezoelectric actuators. The plurality of piezoelectric actuators is configured to provide mechanical forces on the membrane and generate an electrical charge when receiving counterforces of the mechanical forces through the membrane. A wafer polishing system and a method for polishing a substrate using the same are also provided.

A wafer polishing head is provided. The wafer polishing head includes a carrier head, a plurality of piezoelectric actuators disposed on the carrier head, and a membrane disposed over the plurality of piezoelectric actuators. The plurality of piezoelectric actuators is configured to provide mechanical forces on the membrane and generate an electrical charge when receiving counterforces of the mechanical forces through the membrane. A wafer polishing system and a method for polishing a substrate using the same are also provided.

A low viscosity polish kit for a robotic repair unit. The kit includes a sealed container containing a low viscosity polish. The sealed container has a coupling mechanism. The kit also includes a connector configured to couple to the coupling mechanism, on a first end, and to a dispenser of a robotic repair unit, on a second end. The sealed container and the connector are single-use articles.

A low viscosity polish kit for a robotic repair unit. The kit includes a sealed container containing a low viscosity polish. The sealed container has a coupling mechanism. The kit also includes a connector configured to couple to the coupling mechanism, on a first end, and to a dispenser of a robotic repair unit, on a second end. The sealed container and the connector are single-use articles.

A fluid dispensing system for a robotic repair unit that includes a fluid container. The system also includes a fluid dispenser associated with a robotic repair unit. The system also contains a fluid coupler that connects the polish container to the polish dispenser. The system also contains a mounting mechanism configured to couple the polish container to a robotic repair unit.

A fluid dispensing system for a robotic repair unit that includes a fluid container. The system also includes a fluid dispenser associated with a robotic repair unit. The system also contains a fluid coupler that connects the polish container to the polish dispenser. The system also contains a mounting mechanism configured to couple the polish container to a robotic repair unit.

Some embodiments of the present application disclose a polishing liquid supply system. In the present application, the polishing liquid supply system includes: a polishing liquid preparation device, a cleaning liquid supply device and a filtering device, and further includes a supply pipeline connected with the polishing liquid preparation device and the filtering device and a cleaning pipeline connected with the cleaning liquid supply device and the filtering device. The polishing liquid preparation device is configured to prepare a polishing liquid and convey the prepared polishing liquid to the filtering device through the supply pipeline. The filtering device is configured to filter the polishing liquid and convey the filtered polishing liquid to a polishing device connected with the filtering device. The cleaning liquid supply device is configured to convey a cleaning liquid to the filtering device through the cleaning pipeline.