A slurry dispersion system is provided, and includes a slurry source system, an in-line analyzer and a controller. The slurry source system provides a slurry for a chemical mechanical polishing (CMP) process. The in-line analyzer measures at least one parameter of a sampled slurry sampled from the slurry dispersion system, and generates an indication signal based on the parameter, in which the indication signal indicates at lease one characteristic of the slurry. The controller receives the indication signal, and generates a control signal based on the indication signal for performing a real time control on the slurry dispersion system for controlling quality of the slurry.

When a polishing liquid is supplied while moving a polishing liquid supply head including a plurality of polishing liquid supply ports above a polishing pad, a uniformity of a polishing liquid supply range is improved. A polishing apparatus 1 includes a polishing table for supporting a polishing pad 100, a polishing head 30 for holding an object, and a polishing liquid supply device 40 for supplying a polishing liquid between the polishing pad 100 and the object. The polishing liquid supply device 40 includes a polishing liquid supply head 41 including a plurality of polishing liquid supply ports 414, a link mechanism 60 configured to move the polishing liquid supply head 41 along a polishing surface of the polishing pad 100, and a drive mechanism 90 configured to drive the link mechanism 60. The drive mechanism 90 is configured to drive the link mechanism 60 such that the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a first state 450 where the polishing liquid supply head 41 is disposed to be opposed to a center side of the polishing pad 100 and the plurality of polishing liquid supply ports 414 are arranged along a radial direction of the polishing pad 100 in a second state 460 where the polishing liquid supply head 41 is disposed to be opposed to an outer edge side of the polishing pad 100 compared with the first state 450.

Disclosed herein are systems and methods for polishing internal surfaces of apertures in semiconductor processing chamber components. A method includes providing a ceramic article having at least one aperture, the ceramic article being a component for a semiconductor processing chamber. The method further includes polishing the at least one aperture based on flowing an abrasive media through the at least one aperture of the ceramic article, the abrasive media including a polymer base and a plurality of abrasive particles.

A process for polishing and grinding a copper foil surface comprises implementing a main roller made of soft, porous, fibrous and compressible materials, and placing a plurality of metallic-glass particles injected, impinged or applied to the peripheral surface of the main roller, whereby upon rotation of the main roller to contact and brush the copper foil surface, each metallic-glass particle as cushioned by the main roller may simultaneously polish and grind the copper foil surface for efficiently reducing roughness of copper foil.

A process for polishing and grinding a copper foil surface comprises implementing a main roller made of soft, porous, fibrous and compressible materials, and placing a plurality of metallic-glass particles injected, impinged or applied to the peripheral surface of the main roller, whereby upon rotation of the main roller to contact and brush the copper foil surface, each metallic-glass particle as cushioned by the main roller may simultaneously polish and grind the copper foil surface for efficiently reducing roughness of copper foil.

The invention relates to a method for adjusting or operating a particle-metering system for a particle blasting installation, in particular a blasting installation for the working of surfaces, the abrasive throughput of which is preset by means of a passing-through opening that can be varied on the basis of time and/or variables and is determined by means of a downstream throughput sensor as a throughput sensor signal (DS), wherein the throughput sensor signal (DS) is used for controlling a manipulated variable (SG) for the degree of setting of the passing-through opening, wherein to adjust the metering system for at least one value of the manipulated variable (SG) the actual throughput (D) through the passing-through opening is determined by means of a measurement of the weight of abrasive material (M) allowed through within a defined time period (Dt), and the manipulated variable (SG), the actual throughput (D) and the corresponding throughput sensor signal (DS) are stored in an assignment table, wherein the relations between the actual throughput (D), the manipulated variable (SG) and the throughput sensor signal (DS) are used during subsequent operation.

An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be subjected to the polishing process, said mechanical workpieces (4) being clamped to said working plane (3) by clamping means (5), said apparatus further comprising vibration generating means (6) cooperating with resilient components (7) adapted to transmit a vibration motion and amplify the action of said vibrating means (6), said apparatus (1) comprising furthermore a closed loop distributing system for distributing a mixture (8) containing a polishing and buffing cleansing material and a micro-abrading material, said mixture (8) being fed within said mechanical workpieces (4) together with metal bodies (9) having a ball shape and a different size and mass, adapted to move and stir said mixture (8) against the inner walls of the cavity of said mechanical workpieces (4) being processed.

An apparatus (1) for polishing cavities in mechanical components (4), characterized in that said apparatus (1) comprises a supporting framework (2) supporting a working plane (3) thereon are housed the mechanical workpieces (4) to be subjected to the polishing process, said mechanical workpieces (4) being clamped to said working plane (3) by clamping means (5), said apparatus further comprising vibration generating means (6) cooperating with resilient components (7) adapted to transmit a vibration motion and amplify the action of said vibrating means (6), said apparatus (1) comprising furthermore a closed loop distributing system for distributing a mixture (8) containing a polishing and buffing cleansing material and a micro-abrading material, said mixture (8) being fed within said mechanical workpieces (4) together with metal bodies (9) having a ball shape and a different size and mass, adapted to move and stir said mixture (8) against the inner walls of the cavity of said mechanical workpieces (4) being processed.

A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device. A device for dispensing solid compound pastes for surface treatment to a machining tool comprises a heating device that is arranged to heat a solid compound paste for surface treatment that contains abrasives, wherein at least a partial amount of the solid compound paste is arranged to be softened by supplying thermal energy, a conveyor device having a pump unit comprising at least one pump and at least one conveyor path for the softened solid compound paste, wherein the pump is arranged for conveying abrasive media, and a dosing device arranged for applying the softened solid compound paste to a machining tool.

A method for dispensing solid compound pastes for surface treatment to a machining tool comprises the steps of providing a solid compound paste for surface treatment that contains abrasives, softening at least a partial amount of the solid compound paste by supplying thermal energy, feeding the softened solid compound paste to a dosing device by means of a conveyor device that is adapted for abrasive media, and applying the softened solid compound paste to a machining tool by means of the dosing device. A device for dispensing solid compound pastes for surface treatment to a machining tool comprises a heating device that is arranged to heat a solid compound paste for surface treatment that contains abrasives, wherein at least a partial amount of the solid compound paste is arranged to be softened by supplying thermal energy, a conveyor device having a pump unit comprising at least one pump and at least one conveyor path for the softened solid compound paste, wherein the pump is arranged for conveying abrasive media, and a dosing device arranged for applying the softened solid compound paste to a machining tool.