A polishing pad comprising a textile layer, a compressible layer, and a water impermeable layer disposed between the textile layer and the compressible layer. The polishing pad reduces slurry use by improving slurry transport and requires no diamond conditioning to maintain slurry transport.

An abrasive article comprising a first group including a plurality of shaped abrasive particles overlying a backing, wherein the plurality of shaped abrasive particles of the first group define a first non-shadowing distribution relative to each other.

An abrasive article comprising a first group including a plurality of shaped abrasive particles overlying a backing, wherein the plurality of shaped abrasive particles of the first group define a first non-shadowing distribution relative to each other.

An abrasive article including a bonded abrasive body coupled to a core, the core includes a composite material including an organic material and a metallic material, and the composite material includes at least a first filler that can include nitrides, carbides, borides, oxides, silicates, or a combination thereof.

According to one aspect, an abrasive article includes a backing and an abrasive layer comprising shaped structures comprising abrasive particles and a binder, and an interlayer between the backing and the abrasive layer. The interlayer can have at least one of the following: an ILT.sub.ave of at least 4 microns, an ILT.sub.max of at least 5 microns, or an ILT.sub.min of at least 3 microns.

The disclosure provides a UV-cured sub-pad for chemical-mechanical planarization comprising (a) a (meth)acrylate monomer unit and (b) an oligomer unit selected from a difunctional (meth)acrylate-capped polyether urethane oligomer unit, a difunctional (meth)acrylate-capped polyester urethane oligomer unit, a difunctional (meth)acrylate-capped urethane oligomer unit, and a combination thereof. The disclosure also provides a polishing pad for chemical-mechanical planarization comprising a top sheet and a UV-cured sub-pad, a method of preparing the polishing pad, and an apparatus for performing the method of preparing the polishing pad for chemical-mechanical planarization.