According to one embodiment, a method of making an abrasive article is disclosed. The method can comprise: providing a surface; disposing magnetizable abrasive particles on the surface; and varying a magnetic field relative to the magnetizable abrasive particles to impart a non-random orientation and/or alignment to the magnetizable abrasive particles relative to the surface.

According to one embodiment, a method of making an abrasive article is disclosed. The method can comprise: providing a surface; disposing magnetizable abrasive particles on the surface; and varying a magnetic field relative to the magnetizable abrasive particles to impart a non-random orientation and/or alignment to the magnetizable abrasive particles relative to the surface.

It is an object of the present invention to provide an abrasive material which enables: processing efficiency and finished planarity of a substrate material to be simultaneously improved at a high level; polishing costs to be reduced; and a difficult-to-process substrate composed of sapphire or silicon carbide to be polished efficiently and precisely. An abrasive material comprises a substrate and an abrasive layer laminated on a front face side of the substrate, wherein the abrasive layer includes a binder containing an inorganic substance as a principal component, and abrasive particles dispersed in the binder, wherein a front face of the abrasive layer comprises a plurality of regions provided through dividing by grooves, and wherein a maximum peak height (Rp) on the front face of the abrasive layer is no less than 2.5 m and no greater than 70 m.

Provided are a quartz glass member with an increased exposure area, which has an increased exposure area to a film formation treatment gas as compared to a member having a flat surface and has the increased exposure area controlled so that a constant adsorption amount of the film formation treatment gas onto a surface thereof is achieved, a method for manufacturing the quartz glass member with an increased exposure area, and a blade with multiple peripheral cutting edges to be used for the method. The quartz glass member with an increased exposure area is a quartz glass member for exposure to a film formation treatment gas to be, in film formation treatment of a semiconductor substrate, placed in a reaction chamber together with the semiconductor substrate to be subjected to the film formation treatment and exposed to the film formation treatment gas, the quartz glass member including: a quartz glass member main body; and a plurality of irregularities formed on a surface of the quartz glass member main body, the exposure area of the quartz glass member to the film formation treatment gas being controlled and increased.

Embodiments relate to a porous polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors and a process for preparing the same. According to the embodiments, the size and distribution of the plurality of pores contained in the porous polishing pad can be adjusted in light of the volume thereof. Thus, the plurality of pores have an apparent volume-weighted average pore diameter in a specific range, thereby providing a porous polishing pad that is excellent in such physical properties as polishing rate and the like.

A method for the surface treatment of workpieces by means of abrasive media, and a surface treatment composition. The method comprises the steps of providing a treatment tool, providing an abrasive medium, supplying a workpiece having a surface to be treated, surface treating the workpiece, involving removal of material and producing waste products, and processing the waste products, wherein at least one of said steps comprises adding an additive to lower a self-ignition tendency on the part of the waste products, the additive comprising a salt, composed of a carbonate and/or of a halogen anion.

A polishing apparatus includes a shank including a rotation shaft extending in a first direction, a first cushion unit covering a side surface of the shank and having a first hardness, a first film unit adjacent to the first cushion unit in a second direction crossing the first direction and covering a side surface of the first cushion unit, a second cushion unit disposed below the shank, having a second hardness different from the first hardness, and including a first part and a second part. The first part has a cylindrical shape and the second part is disposed below the first part and has a conical shape protruding in a direction opposite to the first part, and a second film unit covering the second part.

A polishing apparatus includes a shank including a rotation shaft extending in a first direction, a first cushion unit covering a side surface of the shank and having a first hardness, a first film unit adjacent to the first cushion unit in a second direction crossing the first direction and covering a side surface of the first cushion unit, a second cushion unit disposed below the shank, having a second hardness different from the first hardness, and including a first part and a second part. The first part has a cylindrical shape and the second part is disposed below the first part and has a conical shape protruding in a direction opposite to the first part, and a second film unit covering the second part.

An abrasive agglomerate particle includes fused aluminum oxide mineral bonded in a vitreous matrix. The fused aluminum oxide mineral is present in a range from 70 percent by weight to 95 percent by weight and the vitreous matrix is present at least at five percent by weight, based on the weight of the abrasive agglomerate particle. The fused aluminum oxide mineral has an average particle size of up to 300 micrometers, and the abrasive agglomerate particle has a frusto-pyramidal shape with side walls having a taper angle in a range from 2 to 15 degrees and a dimension of at least 400 micrometers. The abrasive agglomerate particles are useful in abrasive articles. The method includes contacting the workpiece with an abrasive article and moving the workpiece and the abrasive article relative to each other to abrade the workpiece.

A gimbal for a conditioning system for a CMP tool is configured to maintain a conditioning disk in contact with a polishing pad of the CMP tool. The gimbal includes an arm coupling for coupling to a conditioning swing arm of the CMP tool; and a disk holder for holding the conditioning disk. A flexible diaphragm extends between the arm coupling and the disk holder. The flexible diaphragm allows the disk holder to flex relative to the arm coupling. The flexible diaphragm is made of a metal or metal alloy.