A grinding wheel includes a plurality of wheel tips. The plurality of wheel tips include a plurality of diamond abrasive grains and a bonding material mixed with the diamond abrasive grains. The plurality of diamond abrasive grains have a ratio of a length in a long axis direction to a width in a short axis direction of 1:2.5 to 1:3.5 and includes edges or vertices having a grinding angle of 90 or less.

A grinding wheel includes a plurality of wheel tips. The plurality of wheel tips include a plurality of diamond abrasive grains and a bonding material mixed with the diamond abrasive grains. The plurality of diamond abrasive grains have a ratio of a length in a long axis direction to a width in a short axis direction of 1:2.5 to 1:3.5 and includes edges or vertices having a grinding angle of 90 or less.

An abrasive tool comprises an arbor having a body formed with an internal bore, a mounting plate disposed on the arbor, a cover plate, an abrasive article disposed between the mounting plate and the cover plate, and at least one internal resilient member disposed within the internal bore of the arbor.

An abrasive tool comprises an arbor having a body formed with an internal bore, a mounting plate disposed on the arbor, a cover plate, an abrasive article disposed between the mounting plate and the cover plate, and at least one internal resilient member disposed within the internal bore of the arbor.

Disclosed are an orderly-micro-grooved PCD grinding wheel for positive rake angle processing and a preparation method thereof. A PCD film is deposited on the outer circumferential surface of a wheel hub, and a plurality of microgrooves with high depth-width ratio and micro-grinding units with positive rake angles are orderly provided on the outer circumferential surface of the entire PCD film. The method includes: depositing the PCD film on the outer circumferential surface of the wheel hub by a HFCVD technique; and manufacturing a plurality of microgrooves with a high depth-width ratio (circumferential width: dozens of micrometers; depth: hundreds of micrometers) and an axial length that is equal to the thickness of the grinding wheel and a plurality of micro-grinding units with positive rake angles on the outer circumferential surface of the entire PCD film by water-jet guided laser technique, where the micro-grinding units and the microgrooves are orderly arranged.

Disclosed are an orderly-micro-grooved PCD grinding wheel for positive rake angle processing and a preparation method thereof. A PCD film is deposited on the outer circumferential surface of a wheel hub, and a plurality of microgrooves with high depth-width ratio and micro-grinding units with positive rake angles are orderly provided on the outer circumferential surface of the entire PCD film. The method includes: depositing the PCD film on the outer circumferential surface of the wheel hub by a HFCVD technique; and manufacturing a plurality of microgrooves with a high depth-width ratio (circumferential width: dozens of micrometers; depth: hundreds of micrometers) and an axial length that is equal to the thickness of the grinding wheel and a plurality of micro-grinding units with positive rake angles on the outer circumferential surface of the entire PCD film by water-jet guided laser technique, where the micro-grinding units and the microgrooves are orderly arranged.

An abrasive article can include a wear detection sensor embedded within the abrasive body or extending along an exterior surface of the abrasive body. The wear detection sensor can include at least one conductive lead and be designed to create one or more wear signals corresponding to the wear stage of the abrasive body. The at least one conductive lead can be coupled to a logic device, which may control the wear detection sensor and register the wear signal(s).

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers.

A skate blade sharpening system used to sharpen the blades of ice skates. The skate sharpener can include a housing that includes an elongated slot for receiving the blade of an ice skate for sharpening, and clamp jaws for retaining the skate. The housing can include at least one slot cover to engage the skate blade. Engagement of the skate blade can be sensed by a controller to enable sharpening operations to proceed. The skate blade sharpening system can automatically operate a grinding wheel and move the rotating grinding wheel back and forth along the lower face of the skate blade a desired number of times to sharpen the skate blade.