A machining apparatus machines an end face of a tapered roller with a grinding wheel. The machining apparatus includes a support mechanism configured to support the tapered roller, a wheel unit on which the grinding wheel is mounted, and a base configured to support the wheel unit so that the wheel unit is swivelable about a center line in a vertical direction. A machining point where the grinding wheel is brought into contact with the end face of the tapered roller supported by the support mechanism is located on an extension of the center line serving as a swivel center of the wheel unit.

An orderly-micro-grooved PCD grinding wheel includes a wheel hub, a polycrystalline diamond (PCD) film, a number of micro-grinding units and a number of microgrooves. The PCD film is deposited on an outer circumferential surface of the wheel hub. The PCD film is processed by a water-jet guided laser device to form the microgrooves with high depth-width ratio and micro-grinding units with positive rake angles on the entire outer circumferential surface of the PCD film. An axial length of each micro-grinding unit and an axial length of each microgroove are equal to a thickness of the grinding wheel, respectively. The microgrooves are spaced apart by the micro-grinding units.

An orderly-micro-grooved PCD grinding wheel includes a wheel hub, a polycrystalline diamond (PCD) film, a number of micro-grinding units and a number of microgrooves. The PCD film is deposited on an outer circumferential surface of the wheel hub. The PCD film is processed by a water-jet guided laser device to form the microgrooves with high depth-width ratio and micro-grinding units with positive rake angles on the entire outer circumferential surface of the PCD film. An axial length of each micro-grinding unit and an axial length of each microgroove are equal to a thickness of the grinding wheel, respectively. The microgrooves are spaced apart by the micro-grinding units.

A composite machining tool includes a tool body with at least one cutting edge and at least one grinding region. The grinding region is located adjacent to the cutting edge such that there is a gap between the grinding region and the cutting edge and such that when the tool performs a machining action the cutting edge and the grinding region act together on a material surface.

A composite machining tool includes a tool body with at least one cutting edge and at least one grinding region. The grinding region is located adjacent to the cutting edge such that there is a gap between the grinding region and the cutting edge and such that when the tool performs a machining action the cutting edge and the grinding region act together on a material surface.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers. An apparatus includes a stage configured to receive one of a device wafer or a carrier wafer having a device wafer mounted thereto thereon, a laser tool located above the stage and oriented to direct a laser beam downwardly toward the stage, and a vertically movable blade rotatable about a horizontal axis along a radius from a vertical axis at a center of the device wafer and positionable proximate to and radially inward of an outer periphery of the device wafer.

Methods and apparatus for pre-treating semiconductor wafers before edge trimming to enhance wafer edge quality prior to thinning the semiconductor wafers from an initial thickness, and increasing yield post-thinning of the pre-treated, edge trimmed semiconductor wafers. An apparatus includes a stage configured to receive one of a device wafer or a carrier wafer having a device wafer mounted thereto thereon, a laser tool located above the stage and oriented to direct a laser beam downwardly toward the stage, and a vertically movable blade rotatable about a horizontal axis along a radius from a vertical axis at a center of the device wafer and positionable proximate to and radially inward of an outer periphery of the device wafer.

A bonded abrasive article can include a body including a bond material, abrasive particles contained within the bond material, and pores contained within the body. At least a portion of the pores of the body can include a coating. In one aspect, the coating can be a poly(p-xylylene) polymer applied via vapor deposition. The coated abrasive body can maintain a high permeability and pore volume after coating, and the coating can provide an increase in flexural strength and corrosion resistance to the abrasive article, thereby greatly enhancing its life time.

A bonded abrasive article can include a body including a bond material, abrasive particles contained within the bond material, and pores contained within the body. At least a portion of the pores of the body can include a coating. In one aspect, the coating can be a poly(p-xylylene) polymer applied via vapor deposition. The coated abrasive body can maintain a high permeability and pore volume after coating, and the coating can provide an increase in flexural strength and corrosion resistance to the abrasive article, thereby greatly enhancing its life time.

A forming tool for forming leading edges of turbine blades is disclosed. In various embodiments, a forming tool may comprise a cylindrically-shaped body having a notch around the circumference of the cylindrically-shaped body. The notch may be positioned perpendicularly to a center axis of the cylindrically-shaped body. Further, the notch may have a notch contour with an upper notch contour and a lower notch contour, and where the notch contour is a relief of a selected turbine blade leading edge. The forming tool may be a grinding tool or a cutting tool. Moreover, a forming process may comprise forming, by a forming tool, a first portion of a turbine blade leading edge with a rough edge result, and forming, by a milling cutter, a second portion of the turbine blade leading edge with a rough edge result.