An electroplated steel wire segment-combined grinding wheel includes a base component for connecting an external device, and steel wire segments, wherein the steel wire segments are combined and assembled on the base component in a ring, and outer walls of the steel wire segments are plated with diamonds to form a grinding surface. The steel wire segments are combined and assembled mechanically on a support base, wherein the support base is a reusable tool, and replacing the grinding surface combined by the steel wire segments is convenient for reducing a renovation cost of the electroplated steel wire segment-combined grinding wheel. For the electroplated steel wire segment-combined grinding wheel, drainage channels are naturally formed between the steel wire segments and segment arcs, and thus, internally cooled type cooling and rapid chip removal are facilitated.