Patent classifications
B24D5/12
ABRASIVE TOOLS AND METHODS FOR FORMING SAME
An abrasive tool can include a bonded abrasive including a body and a barrier layer bonded to a major surface of the body. The body can include abrasive particles contained within a bond material. The barrier material can include a metal-containing film. In an embodiment, the barrier layer may further include a polymer-containing film. In another embodiment, the barrier layer may include a biaxially oriented material. The abrasive tool may be formed such that the barrier layer is formed in-situ with the formation of the bonded abrasive.
ABRASIVE TOOLS AND METHODS FOR FORMING SAME
An abrasive tool can include a bonded abrasive including a body and a barrier layer bonded to a major surface of the body. The body can include abrasive particles contained within a bond material. The barrier material can include a metal-containing film. In an embodiment, the barrier layer may further include a polymer-containing film. In another embodiment, the barrier layer may include a biaxially oriented material. The abrasive tool may be formed such that the barrier layer is formed in-situ with the formation of the bonded abrasive.
Saw blade for an oscillatingly driven saw
A saw blade for a machine tool driven oscillatingly about a longitudinal axis has at least one cutting edge, on which, at least in part, abrasive particles are provided. The saw blade is suitable, in particular, for sawing fiber composites.
GRINDING WHEEL WITH A VIBRATION-DAMPING SUPPORT BODY
The invention relates to a grinding wheel (1) comprising a support body (2, 3) which has a central coupling region (4) for attaching the grinding wheel (1) to a rotary drive for rotating the grinding wheel (1) about a rotational axis (5) running through the coupling region (4) and which has a circumferential surface (6). The grinding wheel also comprises a grinding layer (7) which is applied, in particular sintered, onto the circumferential surface (6) of the support body (2, 3). The support body (2, 3) comprises a first part (2) and a second part (3) connected to the first part. The first part (2) has the circumferential surface (6), and the second part (3) has the coupling region (4) and consists substantially of a vibration-damping material.
GRINDING WHEEL WITH A VIBRATION-DAMPING SUPPORT BODY
The invention relates to a grinding wheel (1) comprising a support body (2, 3) which has a central coupling region (4) for attaching the grinding wheel (1) to a rotary drive for rotating the grinding wheel (1) about a rotational axis (5) running through the coupling region (4) and which has a circumferential surface (6). The grinding wheel also comprises a grinding layer (7) which is applied, in particular sintered, onto the circumferential surface (6) of the support body (2, 3). The support body (2, 3) comprises a first part (2) and a second part (3) connected to the first part. The first part (2) has the circumferential surface (6), and the second part (3) has the coupling region (4) and consists substantially of a vibration-damping material.
MULTI-BLADE AND PROCESSING METHOD OF WORKPIECE
A multi blade that processes semiconductor packages into a desired shape while dividing a package substrate includes plural cutting blades that divide the package substrate into the individual semiconductor packages and a spacer provided between two cutting blades adjacent to each other, and is configured in such a manner that the cutting blades and the spacer have the same rotation axis center. The outer surface of the spacer is formed into a transfer shape of the semiconductor package and is covered by an abrasive grain layer, and the upper surface of the package substrate is ground by the outer surface of the spacer simultaneously with cutting of the package substrate by the plural cutting blades.
CUTTING BLADE AND MOUNTING MECHANISM FOR CUTTING BLADE
A cutting blade is mounted on a fixed flange having a cylindrical blade mounting portion. The cutting blade includes an annular blade main body having an outer circumference serving as a cutting edge and a central through-hole that has a diameter greater than an outer diameter of the blade mounting portion and in which the blade mounting portion is to be fitted, and three or more flexible inner circumferential protrusions that project from an inner circumference of the central through-hole toward the center in a diametrical direction and contact at extremities thereof with the blade mounting portion fitted in the central through-hole to support the annular blade main body.
CUTTING BLADE AND MOUNTING MECHANISM FOR CUTTING BLADE
A cutting blade is mounted on a fixed flange having a cylindrical blade mounting portion. The cutting blade includes an annular blade main body having an outer circumference serving as a cutting edge and a central through-hole that has a diameter greater than an outer diameter of the blade mounting portion and in which the blade mounting portion is to be fitted, and three or more flexible inner circumferential protrusions that project from an inner circumference of the central through-hole toward the center in a diametrical direction and contact at extremities thereof with the blade mounting portion fitted in the central through-hole to support the annular blade main body.
Fixed abrasive articles and methods of forming same
A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation.
Abrasive tools and methods for forming same
An abrasive tool can include a bonded abrasive including a body and a barrier layer bonded to a major surface of the body. The body can include abrasive particles contained within a bond material. The barrier material can include a metal-containing film. In an embodiment, the barrier layer may further include a polymer-containing film. In another embodiment, the barrier layer may include a biaxially oriented material. The abrasive tool may be formed such that the barrier layer is formed in-situ with the formation of the bonded abrasive.