Patent classifications
B24D5/12
ADDITIVE MANUFACTURING METHOD, ADDITIVE MANUFACTURING SYSTEM, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
An additive manufacturing method includes cutting a cutting region in a workpiece to heat the workpiece so that a temperature of an additive manufacturing region which is in the cutting region becomes a preheating lower limit temperature or above, and adding melted metal to the additive manufacturing region whose temperature has been a preheating lower limit temperature or above.
ADDITIVE MANUFACTURING METHOD, ADDITIVE MANUFACTURING SYSTEM, AND NON-TRANSITORY COMPUTER-READABLE RECORDING MEDIUM
An additive manufacturing method includes cutting a cutting region in a workpiece to heat the workpiece so that a temperature of an additive manufacturing region which is in the cutting region becomes a preheating lower limit temperature or above, and adding melted metal to the additive manufacturing region whose temperature has been a preheating lower limit temperature or above.
CEMENTED CARBIDE AND CUTTING TOOL
A cemented carbide comprising a first phase, a second phase and a third phase, wherein: the first phase consists of a plurality of tungsten carbide particles; the second phase consists of cobalt; the cobalt content C5 in the cemented carbide is 3% to 15%; the third phase consists of at least one element selected from the group consisting of titanium, tantalum, niobium, zirconium and tungsten, and at least any of carbon and nitrogen; the Vickers hardness a of the cemented carbide is 12.5 GPa to 14.5 GPa; the cemented carbide includes a first region; the first region has a second region; in the first region, a point P2 indicating the Vickers hardness b, which is the maximum value of the Vickers hardness, exists in the second region; and the difference ba between the Vickers hardness b and the Vickers hardness a is 1.8 GPa or more.
CEMENTED CARBIDE AND CUTTING TOOL
A cemented carbide comprising a first phase, a second phase and a third phase, wherein: the first phase consists of a plurality of tungsten carbide particles; the second phase consists of cobalt; the cobalt content C5 in the cemented carbide is 3% to 15%; the third phase consists of at least one element selected from the group consisting of titanium, tantalum, niobium, zirconium and tungsten, and at least any of carbon and nitrogen; the Vickers hardness a of the cemented carbide is 12.5 GPa to 14.5 GPa; the cemented carbide includes a first region; the first region has a second region; in the first region, a point P2 indicating the Vickers hardness b, which is the maximum value of the Vickers hardness, exists in the second region; and the difference ba between the Vickers hardness b and the Vickers hardness a is 1.8 GPa or more.
Grinding tool including a matrix and at least one wear-promoting particle embedded in the matrix
A grinding tool, such as a cutting disc, includes a matrix, in particular a sintered metal matrix, and diamonds embedded in the matrix. At least the majority of the diamonds are each assigned at least one wear-promoting particle. The at least one wear-promoting particle is likewise embedded in the matrix.
Grinding tool including a matrix and at least one wear-promoting particle embedded in the matrix
A grinding tool, such as a cutting disc, includes a matrix, in particular a sintered metal matrix, and diamonds embedded in the matrix. At least the majority of the diamonds are each assigned at least one wear-promoting particle. The at least one wear-promoting particle is likewise embedded in the matrix.
Dicing blade
An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.
Dicing blade
An object of the present invention is to provide a dicing blade which does not cause cracking and breaking even in a workpiece formed from a brittle material, and can stably perform cutting process in a ductile mode on the workpiece with high precision. A dicing blade 26 which performs the cutting process on the workpiece is integrally formed of a diamond sintered body 80 which is formed by sintering diamond abrasive grains 82 so as to have a discoid shape, and a content of the diamond abrasive grains 82 of the diamond sintered body 80 is 80 vol % or more. It is preferable that recessed parts which are formed on a surface of the diamond sintered body 80 are continuously provided in an outer circumferential part of the dicing blade 26 along a circumferential direction.
Wafer edge trim blade with slots
A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.
Wafer edge trim blade with slots
A wafer edge trim blade includes a round blade body and at least one slot formed inward from an outside edge of the round blade body. The at least one slot is configured to remove debris generated during wafer edge trimming using the wafer edge trim blade.