B24D7/06

Grinding wheel and grinding method
10112285 · 2018-10-30 · ·

Disclosed herein is a grinding wheel including a wheel base to be fixed to a spindle, a plurality of abrasive members fixed to the wheel base, and a plurality of grinding water supply holes for supplying a grinding water to the abrasive members. Each abrasive member is formed as a segment abrasive having an outer surface extending downward from the lower surface of the wheel base so as to be inclined radially outward. The plural abrasive members are arranged annularly at given intervals. The plural grinding water supply holes are formed on the lower surface of the wheel base in the vicinity of the abrasive members so as to each correspond to the abrasive members in the condition where each grinding water supply hole lies on a line connecting the corresponding abrasive member and the axis of rotation of the wheel base.

Grinding wheel and grinding method
10112285 · 2018-10-30 · ·

Disclosed herein is a grinding wheel including a wheel base to be fixed to a spindle, a plurality of abrasive members fixed to the wheel base, and a plurality of grinding water supply holes for supplying a grinding water to the abrasive members. Each abrasive member is formed as a segment abrasive having an outer surface extending downward from the lower surface of the wheel base so as to be inclined radially outward. The plural abrasive members are arranged annularly at given intervals. The plural grinding water supply holes are formed on the lower surface of the wheel base in the vicinity of the abrasive members so as to each correspond to the abrasive members in the condition where each grinding water supply hole lies on a line connecting the corresponding abrasive member and the axis of rotation of the wheel base.

GRINDING WHEEL
20180290265 · 2018-10-11 · ·

A grinding wheel which includes a plurality of vitrified bonded grindstone chips arranged on an outer periphery of an annular base metal thereof, and is configured to grind a workpiece with use of the grindstone chips while rotating the annular base metal, wherein each of the vitrified bonded grindstone chips is configured in such a manner that, in a rectangular parallelepiped including a rectangular grinding surface which is placed on an opposite side of the annular base metal and grinds the workpiece and four side surfaces adjacent to grinding surface, four ridge portions each of which is provided between the side surfaces are C-chamfered, each long side of the grinding surface is arranged along the outer periphery of the annular base metal, and each of the four ridge portions is C-chamfered in a range which is or more of a length of each short side of the grinding surface.

GRINDING WHEEL
20180290265 · 2018-10-11 · ·

A grinding wheel which includes a plurality of vitrified bonded grindstone chips arranged on an outer periphery of an annular base metal thereof, and is configured to grind a workpiece with use of the grindstone chips while rotating the annular base metal, wherein each of the vitrified bonded grindstone chips is configured in such a manner that, in a rectangular parallelepiped including a rectangular grinding surface which is placed on an opposite side of the annular base metal and grinds the workpiece and four side surfaces adjacent to grinding surface, four ridge portions each of which is provided between the side surfaces are C-chamfered, each long side of the grinding surface is arranged along the outer periphery of the annular base metal, and each of the four ridge portions is C-chamfered in a range which is or more of a length of each short side of the grinding surface.

Polishing or grinding pad assembly
10092159 · 2018-10-09 · ·

A floor polishing or grinding pad assembly is provided. In one aspects a polishing or grinding pad assembly employs a flexible pad, a reinforcement layer or ring, and multiple floor-contacting tools such as disks. In yet another aspect, at least one of the floor-contacting tools has a workpiece-contacting bottom plane having angle offset from that of a base surface of the tool, a flexible pad and/or a flexible reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks.

Abrasive article and method of use

An abrasive article includes a body having an annular surface including abrasive segments coupled to the annular surface, and the abrasive segments define an abrasive annular region and a percent abrasive surface area of not greater than 24% for the total surface area of the abrasive annular region.

Abrasive article and method of use

An abrasive article includes a body having an annular surface including abrasive segments coupled to the annular surface, and the abrasive segments define an abrasive annular region and a percent abrasive surface area of not greater than 24% for the total surface area of the abrasive annular region.

Fixed abrasive articles and methods of forming same

A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation.

Fixed abrasive articles and methods of forming same

A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation.

Method of grinding wafer
10076825 · 2018-09-18 · ·

Disclosed herein is a grinding wheel including an annular wheel base and a plurality of grinding stones fixed to an outer circumferential portion of the lower end of the annular wheel base. Each of the grinding stones is made of a mixture of abrasive grains and photocatalytic particles which are held together by a binder. The abrasive grains are diamond abrasive grains, and the photocatalytic particles are titanium oxide (TiO.sub.2) particles.