A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed over the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having an obliquely truncated pyramid shape. Some embodiments described herein also include a method of manufacturing the grinding tool.

A grinding tool includes a substrate having a working surface, and a plurality of abrasive particles distributed over the working surface and protruding outward from the working surface, wherein at least some of the abrasive particles are machined to form abrasive particles respectively having an obliquely truncated pyramid shape. Some embodiments described herein also include a method of manufacturing the grinding tool.

A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation.

A grinding wheel includes an annular base having a free end portion and a plurality of segment grindstones fixed on the free end portion of the annular base in a state of being spaced from one another in a circumferential direction. The plurality of segment grindstones are divided into a plurality of grindstone groups each including a predetermined number of segment grindstones. Each of the segment grindstones included in each of the grindstone groups has a grinding surface formed into a rectangular shape having a long side and a short side. The segment grindstones of the grindstone group are sequentially fixed on the free end portion of the annular base from an outer circumferential side toward an inner circumferential side such that directions in which the long sides of the segment grindstones extend are changed from the circumferential direction to a diametric direction of the free end portion.

A semiconductor wafer is processed by grinding the semiconductor wafer so as to remove material using a grinding tool while delivering a coolant into a contact region between the rotating semiconductor wafer and the grinding tool. The grinding tool has grinding teeth having a height. While grinding, first and second coolant flow rates are respectively applied onto first and second regions on one side of the semiconductor wafer by one or more nozzles. The first region is bounded by a lower right quadrant of the semiconductor wafer and the second region is bounded by a lower left quadrant. A ratio of the first coolant flow rate and a sum of the first coolant flow rate and the second coolant flow rate is no more than 35% and no less than 25%.

The present disclosure provides a carrier disk for holding at least one cutting, grinding or polishing element in a floor grinding machine. The carrier disk comprises a carrier body having a downwardly exposed face, at which the grinding element is arranged, a opening formed in the carrier body and a plurality of flanges extending axially from the carrier body and between the opening and a radially outer edge of the carrier body.

Disclosed herein is a grinding tool, which includes a plate, a plurality of holders formed on the plate and having sliding grooves, a shoe coupled to the sliding groove of each of the holders, and grinding tips arranged on the shoe. The shoe includes a fastening part fastened to the sliding groove, and an upper plate part formed on the fastening part and located on an upper surface of the holder outside the sliding groove. The shoe can be fastened to the holder in two or more directions, and the grinding tips can be arranged in two or more forms when viewed from the plane.

A tool (U) for polishing and/or lapping stone material surfaces, comprising a member (1) made of abrasive material, a support member (2) for handling said tool (U), a cushioning layer (3) arranged between said abrasive member (1) and said support member (2); also provided are attachment and fixing means (F) to firmly and removably secure said abrasive member (1), support member (2) and cushioning layer (3) to each other.

A multi-abrasive tool is constituted by a support on which abrasive elements are present. Such abrasive elements are arranged in a manner so as to form one or more paths along which the successive abrasive elements have grain size sequentially increasing or decreasing by an arbitrary quantity when passing from on element to the next. Such principle gives rise to abrasive tools with different conformation both for polishing machines and for grindstones. For roto-orbital and planetary polishing machines, and optionally orbital, such support is circular and the grain sequence is circumferential, or radial, or in both directions. A first tool is constituted by contiguous (or non-contiguous) circular rings, that are differently abrasive. A second tool comprises differently abrasive elements arranged along the circular peripheral edge. A third tool comprises differently abrasive elements arranged along a spiral path of 360 starting from the edge. A fourth tool comprises two 180 spiral paths with reversed roughness sequences. A fourth tool comprises pairs of differently abrasive small cylinders fixed to a plate on concentric circumferences. A fifth tool is obtained directly on the plate of the polishing machine by means of reliefs and spacers for fixing differently abrasive sectors. For linear polishing machines, the abrasive support is a belt along which differently abrasive rectangular or oblique zones follow each other. For alternative polishing machines, the abrasive support is a plate shaped like the aforesaid belt. For tools to use with grindstones, the multi-abrasive element has a cylindrical rotation symmetry, or conical with rounded tip, or spherical symmetry.

A multi-abrasive tool is constituted by a support on which abrasive elements are present. Such abrasive elements are arranged in a manner so as to form one or more paths along which the successive abrasive elements have grain size sequentially increasing or decreasing by an arbitrary quantity when passing from on element to the next. Such principle gives rise to abrasive tools with different conformation both for polishing machines and for grindstones. For roto-orbital and planetary polishing machines, and optionally orbital, such support is circular and the grain sequence is circumferential, or radial, or in both directions. A first tool is constituted by contiguous (or non-contiguous) circular rings, that are differently abrasive. A second tool comprises differently abrasive elements arranged along the circular peripheral edge. A third tool comprises differently abrasive elements arranged along a spiral path of 360 starting from the edge. A fourth tool comprises two 180 spiral paths with reversed roughness sequences. A fourth tool comprises pairs of differently abrasive small cylinders fixed to a plate on concentric circumferences. A fifth tool is obtained directly on the plate of the polishing machine by means of reliefs and spacers for fixing differently abrasive sectors. For linear polishing machines, the abrasive support is a belt along which differently abrasive rectangular or oblique zones follow each other. For alternative polishing machines, the abrasive support is a plate shaped like the aforesaid belt. For tools to use with grindstones, the multi-abrasive element has a cylindrical rotation symmetry, or conical with rounded tip, or spherical symmetry.