A method produces wafers from a cylindrical ingot of semiconductor material having an axis and an indexing notch in an outer surface of the cylindrical ingot and parallel to the axis. The method includes, in the order specified: (a) simultaneous removal of a multiplicity of sliced wafers from the cylindrical ingot by multi-wire slicing in the presence of a cutting agent; (b) etching of the sliced wafers with an alkaline etchant in an etching bath at a temperature of 20 C. to 50 C. and for a residence time, such that the material removed from each of the sliced wafers is less than 5/1000 of an initial wafer thickness; and (c) grinding of the etched wafers by simultaneous double-disk grinding using an annular abrasive covering.

An abrasive article can include a core and an abrasive component attached to the core. The abrasive component may include a body including a leading end and a trailing end, wherein the leading end has a width greater than a width of the trailing end. In an embodiment, the abrasive component may include a body including a first abrasive portion and a second abrasive portion, wherein a radial width of the first abrasive portion is greater than a radial width of the second abrasive portion.

According to some embodiments, a grinding head configured to grind a grinding target, the head includes a wheel including a rotating front surface and a plurality of grindstones arranged in an annular shape on the rotating front surface with a rotation axis of the rotating front surface as a center. Each of the plurality of grindstones includes a first surface configured to be in contact with the grinding target and a second surface inclined at an acute angle with respect to a traveling direction of the grindstone from the rotating front surface to the first surface.

The invention relates to an abrasive article 1 for abrading at least one workpiece, the abrasive article with: a carrier body 2, at least one abrasive layer 3 with a main surface and a predefined thickness, the at least one abrasive layer being arranged on the carrier body, at least two visual indicators 6 with a cross-section in the main surface of the abrasive layer, wherein the size, shape and/or location of the cross-section of the visual indicators in the main surface of the abrasive layer depends on the thickness of the abrasive layer at more than one location of the visual indicators.