Abrasive preforms include a frame having first and second opposed parallel major surfaces. The first major surface has a plurality of first cavities formed therein. The second major surface optionally has a plurality of second cavities formed therein. The frame comprises a binder precursor material. Abrasive particles are disposed in at least a portion of the plurality of first cavities and optional plurality of second cavities. Methods of making abrasive articles using the abrasive preforms and bonded abrasive articles preparable thereby are also disclosed.

An Si substrate manufacturing method includes a separation band forming step of forming a separation band through positioning a focal point of a laser beam with a wavelength having transmissibility with respect to Si to a depth, equivalent to a thickness of an Si substrate to be manufactured, from a flat surface of an Si ingot and irradiating the Si ingot with the laser beam while relatively moving the focal point and the Si ingot in a direction <110> parallel to a cross line at which a crystal plane {100} and a crystal plane {111} intersect or a direction [110] orthogonal to the cross line, and an indexing feed step of executing indexing feed of the focal point and the Si ingot relatively in a direction orthogonal to a direction in which the separation band is formed.

There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

There are provided a cutting/polishing tool that may be readily manufactured and have an improved cutting performance, and a manufacturing method thereof. The method for manufacturing the cutting/polishing tool including at least one cutting/polishing body may comprise preparing a tool body, and forming a cladding layer including cutting material particles by spraying, onto an outer surface of the tool body, the cutting material particles and a metal powder having a specific gravity greater than a specific gravity of the cutting material particles while heating the outer surface of the tool body using a heating device installed in a lower side of the outer surface of the tool body so that the metal powder is deposited on the outer surface of the tool body, wherein the cladding layer configures the at least one cutting/polishing body.

An adapter clip to be used to mate an abrasive support plate to the drive plate of a floor finishing machine used to grind and/or polish concrete and stone flooring is designed with an internal aperture shaped to conform to and clip onto a protuberance on an upper surface of an abrasive support plate and an external shape to mate with a mounting recess formed on the machine's drive plate.

A method of processing a wafer having a first surface and a second surface opposite the first surface is provided. The method includes the steps of: holding the second surface of the wafer such that the first surface thereof is exposed; processing an exposed first surface side of an outer circumferential edge portion of the wafer with a processing tool including a grinding stone made of abrasive grains bound together by a bonding material, thereby forming on the outer circumferential edge portion a slanted surface that is inclined to the first surface so as to be progressively closer to the second surface in a direction from a central area of the wafer toward an outer circumferential edge thereof; and coating the first surface of the wafer with a liquid material according to a spin coating process, thereby forming a resist film on the first surface of the wafer.

A coated abrasive disc includes an abrasive layer disposed on a major surface of a disc backing. The abrasive layer comprises triangular abrasive platelets secured to a major surface of the disc backing by at least one binder material. The triangular abrasive platelets are outwardly disposed from the major surface at contiguous intersections of horizontal and vertical lines of a rectangular grid pattern, wherein the intersections of the rectangular grid pattern have an areal density defined by C/(LT) where C is a unitless coverage factor having a value between 0.1 and 0.4, L is the average major triangular abrasive platelet side length and T is the average triangular abrasive platelet thickness. At least 70 percent of the intersections have a triangular abrasive platelet disposed thereat. Each one of the triangular abrasive platelets has respective top and bottom surfaces connected to each other, and separated by, three sidewalls, and, on a respective basis, one sidewall facing the disc backing of at least 90 percent of the triangular abrasive platelets has a Z-axis rotational orientation within 10 degrees of the vertical lines. Methods of making and using the coated abrasive discs are also disclosed.

A grinding tool and a manufacturing method thereof are disclosed. The grinding tool includes a plurality of thin teeth (2) which are sequentially spliced and stacked to form an annular structure, wherein every two adjacent thin teeth (2) are fixedly connected, and a groove body (4) is formed between every two adjacent thin teeth (2). The narrower and the more the groove bodies of the grinding tool are, the better the cooling effect is, thus the better the chip-removal effect is. Meanwhile, the manufacturing method for the grinding tool features a machining process having low difficulty and is easy for mass production, thereby facilitating the high-speed and high-efficiency machining of grinding tools with an organic bond and an inorganic bond.

A grinding tool and a manufacturing method thereof are disclosed. The grinding tool includes a plurality of thin teeth (2) which are sequentially spliced and stacked to form an annular structure, wherein every two adjacent thin teeth (2) are fixedly connected, and a groove body (4) is formed between every two adjacent thin teeth (2). The narrower and the more the groove bodies of the grinding tool are, the better the cooling effect is, thus the better the chip-removal effect is. Meanwhile, the manufacturing method for the grinding tool features a machining process having low difficulty and is easy for mass production, thereby facilitating the high-speed and high-efficiency machining of grinding tools with an organic bond and an inorganic bond.

A grinding wheel for grinding a workpiece containing a ductile material, the grinding wheel including an annular wheel base having a fixed end adapted to be fixed to a lower end of a spindle and having a free end adapted to face the workpiece to be ground, and a plurality of grindstones each shaped as a rectangular plate, disposed on the free end of the annular wheel base, and arrayed at predetermined intervals with respective longer sides disposed along circumferential directions of the wheel base. Each of the grindstones includes an electroformed grindstone shaped as a rectangular plate and made up of abrasive grains secured together by nickel plating, and has a thickness of 1 mm or smaller and a value ranging from 5 inclusive to 35 exclusive that is represented by a ratio of a height from the free end to the thickness.