The invention discloses a glass bottle mouth fine grinding device, which includes a working box and a working chamber located in the working box. A placing box is slidably arranged in the working chamber. The placing box is provided with a placing chamber. A glass bottle is slidably disposed in the placement cavity, and first cavities are symmetrically arranged on the left and right sides of the placement cavity. A circular clamping block is slidably disposed in the first cavity. The first cavity is connected by a first spring, and a second cavity is provided at the bottom of the placing box. A sliding block is slidably disposed in the second cavity, and the sliding block and the second cavity are connected by a second spring.

A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.

A floor polishing or grinding pad assembly is provided. In one aspect, a polishing or grinding pad assembly employs a fibrous pad, a reinforcement layer or ring, and multiple floor-contacting disks. In another aspect, the reinforcement layer includes a central hole through which the fibrous pad is accessible and the fibrous pad at the hole has a linear dimension greater than a linear dimension of one side of the adjacent reinforcement layer. In yet another aspect, at least one of the floor-contacting disks has an angle offset from that of a base surface of the disk, the fibrous pad and/or the reinforcement layer. A further aspect employs a smaller set of disks alternating between and/or offset from a larger set of the disks. In another aspect, the reinforcement layer includes a wavy or undulating internal edge shape.

An apparatus for grinding a concrete floor surface, in order to perform grinding with a manual, a pullable or a ride-on concrete trowel machine is provided. The apparatus comprises a concrete trowel organ to be used with the concrete trowel machine and a diamond grinding arrangement, such as one or several diamond disks or like, to be coupled in connection with the concrete trowel organ removably by means of a fastening arrangement. The fastening arrangement for coupling the diamond grinding arrangement in connection with the concrete trowel organ comprises a fastening frame, being in connection with the diamond grinding arrangement that exits on a scrubbing surface of the concrete trowel organ, and a fastening part extending from the fastening frame and, while going through the concrete trowel organ, getting supported against a back surface of the same.

The present disclosure provides bonded abrasive articles including abrasive particles retained in a binder. The abrasive particles are oriented at a predetermined angle greater than 0 degrees and less than 90 degrees with respect to a longitudinal axis of the bonded abrasive article. Fifty percent or more of the abrasive particles are oriented within 15 degrees above or below the angle, as measured using microscopy image analysis under magnification. The present disclosure further provides a method of making a bonded abrasive article, the method comprising sequential steps. The steps include (a) a sub-process comprising sequentially: i) depositing a layer of loose powder particles in a confined region, wherein the loose powder particles comprise matrix particles and abrasive particles; ii) spreading the layer of loose powder particles with a spreading bar or roller to provide a substantially uniform thickness, wherein a gap between the spreading bar or roller and a base plane of the confined region is selected to be shorter than an average length of the abrasive particles; and iii) selectively treating an area of the layer of loose powder particles to bond powder particles together. Step b) includes independently carrying out step a) a number of times to generate a bonded abrasive article preform including the bonded powder particles and remaining loose powder particles. Step c) includes separating remaining loose powder particles from the bonded abrasive article preform. Step d) includes heating the bonded abrasive article preform to provide the bonded abrasive article. Further, methods are provided, including receiving, by a manufacturing device having one or more processors, a digital object comprising data specifying a bonded abrasive article; and generating, with the manufacturing device by an additive manufacturing process, a bonded abrasive article preform based on the digital object. A system is also provided, including a display that displays a 3D model of a bonded abrasive article; and one or more processors that, in response to the 3D model selected by a user, cause a 3D printer to create a physical object of a bonded abrasive article preform.

A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.

A grinding element mounted on a grinding wheel and a grinding wheel containing the same are provided for grinding. The grinding element includes a grinding tooth, and the grinding tooth includes a grinding material having a framework structure and pores distributed in the framework structure. The framework structure includes a bond material and abrasive particles that are bonded by the bond material. A pore size of the pores is larger than 40 microns but smaller than 70 microns. A manufacturing method for semiconductor packages using the same is also provided.

A grindstone includes abrasive grains and a binder for fixing the abrasive grains, and the binder contains a spherical filler for reinforcing the bonding material.

A floor polishing armature including an inner ring having an inner ring upper surface and an inner ring lower surface, an outer ring, spokes extending between the inner ring and the outer ring, a disc retainer formed on the outer ring, a spoke opening extending from the inner ring upper surface to the inner ring lower surface, and a disc insert retained in the disc retainer. The disc is insert adapted for floor treatment. The spoke opening extends to the disc retainer. The disc insert is released by pressing through the spoke opening. Optionally, airflow openings are formed between the spokes. Spoke indents are preferably formed on an underside of the spokes between the inner ring and the disc retainer. The disc inserts and the arc inserts are both retained by interference fit.

The invention relates to a processing section 1 and an adapter system 10 of a floor-processing machine. The processing section 1 comprises a base body 2 with a processing side 3 and a mounting side, wherein the mounting side is arranged on the opposite side of the processing side 3 of the base body 2. The mounting side comprises at least one first mounting element for detachably fastening the processing section to the adapter system. The processing side 3 is formed as a closed processing surface 5. The adapter system 10 has a receiving side 11 which comprises at least one receptacle 12. The receptacle 12 comprises at least one second mounting element for detachably fastening the processing section 1 in the receptacle 12. Finally, the invention relates to a floor-processing machine and a tool.