Some implementations herein describe a chemical-mechanical planarization tool including a polishing pad. The chemical-mechanical planarization tool including the polishing pad may perform a polishing operation to a semiconductor substrate. The polishing operation may generate, along a perimeter of the semiconductor substrate, a roll-off profile that satisfies a threshold. The polishing pad includes two or more regions, where each region includes a different pad surface pattern. Each region including a different pad surface pattern may correspond to a different polishing rate. Techniques using the polishing pad having such zone and pad surface pattern combinations allow for a focused and a controlled polishing of the semiconductor substrate, including along the perimeter of the semiconductor substrate to tightly control the roll-off profile.

Some implementations herein describe a chemical-mechanical planarization tool including a polishing pad. The chemical-mechanical planarization tool including the polishing pad may perform a polishing operation to a semiconductor substrate. The polishing operation may generate, along a perimeter of the semiconductor substrate, a roll-off profile that satisfies a threshold. The polishing pad includes two or more regions, where each region includes a different pad surface pattern. Each region including a different pad surface pattern may correspond to a different polishing rate. Techniques using the polishing pad having such zone and pad surface pattern combinations allow for a focused and a controlled polishing of the semiconductor substrate, including along the perimeter of the semiconductor substrate to tightly control the roll-off profile.

A system and method for a composite finishing system. The composite finishing system comprises an abrasive bit with an abrasive material on a removal surface of the abrasive bit, where in the abrasive bit has a pilot structure that positions an abrasive surface relative to an edge break intersection of a hole in a composite structure when a pilot structure is placed into the hole.

Apparatus and methods for processing a glass sheet can include a coating chamber including a dispensing port to dispense a coating on a major surface of the glass sheet. In some embodiments, an apparatus can include a fog chamber including an enclosure, a fog generator to provide fog to the enclosure, and a passage in the enclosure from which fog can exit the enclosure to contact a major surface of the glass sheet. In some embodiments a method can include providing a glass sheet to a coating chamber, and dispensing a coating on a major surface of the glass sheet. In some embodiments, a method can include providing a glass sheet to a fog chamber, providing fog to an enclosure of the fog chamber, and contacting a major surface of the glass sheet with the fog by passing the fog from the enclosure through a passage in the enclosure.

A grinding wheel used for grinding of a work piece is provided. The grinding wheel includes a circular disc-shaped base having a fixed end surface in contact with a mount of grinding apparatus and a free end surface on the opposite side to the fixed end surface, and plural abrasive stone chips arranged in a ring manner on the free end surface of the base. The abrasive stone chips are each formed into a block shape having a surface in which two or more kinds of plate-shaped abrasive stone members containing abrasive grains and a binder are exposed to the outside by overlapping the two or more kinds of abrasive stone members. The surfaces exposed to the outside in the abrasive stone chips serve as grinding processing surfaces that get contact with the work piece.

A grinding wheel used for grinding of a work piece is provided. The grinding wheel includes a circular disc-shaped base having a fixed end surface in contact with a mount of grinding apparatus and a free end surface on the opposite side to the fixed end surface, and plural abrasive stone chips arranged in a ring manner on the free end surface of the base. The abrasive stone chips are each formed into a block shape having a surface in which two or more kinds of plate-shaped abrasive stone members containing abrasive grains and a binder are exposed to the outside by overlapping the two or more kinds of abrasive stone members. The surfaces exposed to the outside in the abrasive stone chips serve as grinding processing surfaces that get contact with the work piece.

A rotatable grinding tool (1) comprising a disc-like body (2) defining an intended direction of rotation (D), in which the grinding tool (1) is rotatable about a central axis (A) of the disc-like body (2), and a front side (3) intended to face a surface to be grinded, and a back side (4) opposite to the front side. The grinding tool (1) further comprises, on the front side (3) of the body (2), a plurality of teeth (5) each extending radially along said front side (3), wherein said teeth (5) being arranged spaced apart from each other. Particularly, the teeth (5) are formed integral with the body (2).

A rotatable grinding tool (1) comprising a disc-like body (2) defining an intended direction of rotation (D), in which the grinding tool (1) is rotatable about a central axis (A) of the disc-like body (2), and a front side (3) intended to face a surface to be grinded, and a back side (4) opposite to the front side. The grinding tool (1) further comprises, on the front side (3) of the body (2), a plurality of teeth (5) each extending radially along said front side (3), wherein said teeth (5) being arranged spaced apart from each other. Particularly, the teeth (5) are formed integral with the body (2).

A method for finishing a spherically curved surface portion of a workpiece with a finishing tool having a machining surface includes the steps of finishing the surface portion of the workpiece, whereby the finishing tool, with at least one part of the machining surface, is brought into contact with at least one part of the surface portion of the workpiece. The workpiece and the finishing tool are rotatably driven; and dressing the finishing tool with a dressing tool having a curved dressing surface, whereby the dressing tool, with at least one part of the dressing surface, is brought into contact with at least one part of the finishing surface of the finishing tool. The finishing tool and/or the dressing tool are rotatably driven, whereby the dressing surface of the dressing tool has a different curvature than the spherically curved surface portion of the workpiece.

An improved buffer/polisher for treated painted surfaces, including painted cars, automobiles, vehicles and the like, including surfaces with state-of-the-art, hardened coats of paint or finish, includes built-in source of illumination, disposed on the housing, direct light downwardly and toward the work surface. The source of illumination emits light with a color temperature above 4500 degrees Kelvin, more preferably at 5000 degrees Kelvin or greater. Even more preferably, the source of illumination is switchable to include light with a color temperature including 5000 degrees Kelvin (mimicking daylight at 10-11 am) and 6500K (mimicking daylight at 12 noon). The source of illumination may comprise one or more LEDs, and the polishing pad may assume a random orbital motion.