Patent classifications
B24D7/18
Polishing pad
A polishing pad including a damping layer made of a resilient material including expanded semi-rigid polyurethane having a microcell structure, an adhesive layer including a layer of a hook-and-loop fastener adapted to interact and connect to a corresponding layer of the hook-and-loop fastener located at a bottom surface of the working element of the machine tool and a polishing layer including microfiber adapted for polishing a surface of a work piece. The polishing layer includes a fabric having a woven mesh of microfibers that define a back side of the polishing layer. The fabric serves as a barrier to the resilient material of the damping layer such that the resilient material does not reach an active side of the polishing layer comprising the microfibers when the damping layer, adhesive layer and polishing layer are combined, and such that the active side of the polishing layer is free of resilient material of the damping layer.
EMBEDDED ELECTRONIC CIRCUIT IN GRINDING WHEELS AND METHODS OF EMBEDDING
A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
EMBEDDED ELECTRONIC CIRCUIT IN GRINDING WHEELS AND METHODS OF EMBEDDING
A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
EMBEDDED ELECTRONIC CIRCUIT IN GRINDING WHEELS AND METHODS OF EMBEDDING
A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
EMBEDDED ELECTRONIC CIRCUIT IN GRINDING WHEELS AND METHODS OF EMBEDDING
A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
Methods and apparatus for processing glass
Apparatus and methods for processing a glass sheet can include a coating chamber including a dispensing port to dispense a coating on a major surface of the glass sheet. In some embodiments, an apparatus can include a fog chamber including an enclosure, a fog generator to provide fog to the enclosure, and a passage in the enclosure from which fog can exit the enclosure to contact a major surface of the glass sheet. In some embodiments a method can include providing a glass sheet to a coating chamber, and dispensing a coating on a major surface of the glass sheet. In some embodiments, a method can include providing a glass sheet to a fog chamber, providing fog to an enclosure of the fog chamber, and contacting a major surface of the glass sheet with the fog by passing the fog from the enclosure through a passage in the enclosure.
Methods and apparatus for processing glass
Apparatus and methods for processing a glass sheet can include a coating chamber including a dispensing port to dispense a coating on a major surface of the glass sheet. In some embodiments, an apparatus can include a fog chamber including an enclosure, a fog generator to provide fog to the enclosure, and a passage in the enclosure from which fog can exit the enclosure to contact a major surface of the glass sheet. In some embodiments a method can include providing a glass sheet to a coating chamber, and dispensing a coating on a major surface of the glass sheet. In some embodiments, a method can include providing a glass sheet to a fog chamber, providing fog to an enclosure of the fog chamber, and contacting a major surface of the glass sheet with the fog by passing the fog from the enclosure through a passage in the enclosure.
Grindstone
A grindstone that enables grinding, polishing, super-finish polishing by using the same grindstone, without clogging even if the grindstone is being used continuously, in which a grinding/polishing section for processing a workpiece has a honeycomb structure formed by arranging polygonal prisms with no clearance therebetween. The grindstone includes the grindstone columns consisting of abrasive grains and binder and having an axis in depth direction of grinding/polishing surface, which are disposed on intersections or wall portions of the honeycomb structure. Porous elastomer is disposed inside the honeycomb structure, thus making it possible to perform a super-finish polishing.
Grindstone
A grindstone that enables grinding, polishing, super-finish polishing by using the same grindstone, without clogging even if the grindstone is being used continuously, in which a grinding/polishing section for processing a workpiece has a honeycomb structure formed by arranging polygonal prisms with no clearance therebetween. The grindstone includes the grindstone columns consisting of abrasive grains and binder and having an axis in depth direction of grinding/polishing surface, which are disposed on intersections or wall portions of the honeycomb structure. Porous elastomer is disposed inside the honeycomb structure, thus making it possible to perform a super-finish polishing.
Electroplated tool, screw-shaped grindstone for grinding gear, method for manufacturing electroplated tool, and method for manufacturing screw-shaped grindstone for grinding gear
Provided are: an electroplated tool; a screw-shaped grindstone for grinding a gear; a method for manufacturing the electroplated tool; and a method for manufacturing the crew-shaped grindstone for grinding a gear. Said tool having a parent material, a plating layer that has a high-level portion and a low-level portion formed as strips on the parent material at different heights along the direction intersecting the processing direction, and electrodeposited abrasive grains exposed from the surface of the plating layer. The difference in height of the plating layer is preferably 50-100% of the average particle diameter of the abrasive grains, the width of the high-level portion of the plating layer is preferably 150-200% of the average particle diameter of the abrasive grains, and the width of the low-level portion of the plating layer is preferably 100-800% of the average particle diameter of the abrasive grains.