An abrasive tool for machining surfaces, which comprises a support associated with at least one abrasive layer, and a first layer and a second layer, both of which are made of elastically deformable material and are interposed between said support and said abrasive layer; the second layer has a higher stretch modulus than the first layer and is arranged in an intermediate position between the first layer and the abrasive layer, and the first layer is associated with the support.

A slotted retention tool for retaining an abrasive material for use with a power-driven tool that is compact and adaptable for use in confined or hard-to-reach areas, while also allowing for quick and easy replacement of worn abrasive components is provided. The slotted retention tool can include a slot at a first end where the slot can be configured to retain an abrasive material for use during operation of the slotted retention tool. The slot can include a transitional surface configured to minimize sharp edges that can contribute to premature tearing or degradation of the abrasive material during insertion and use. The slotted retention tool can also include a drive portion at a second end configured to be received by a power-driven tool. A method of using a slotted retention tool for retaining an abrasive material is also provided.

A slotted retention tool for retaining an abrasive material for use with a power-driven tool that is compact and adaptable for use in confined or hard-to-reach areas, while also allowing for quick and easy replacement of worn abrasive components is provided. The slotted retention tool can include a slot at a first end where the slot can be configured to retain an abrasive material for use during operation of the slotted retention tool. The slot can include a transitional surface configured to minimize sharp edges that can contribute to premature tearing or degradation of the abrasive material during insertion and use. The slotted retention tool can also include a drive portion at a second end configured to be received by a power-driven tool. A method of using a slotted retention tool for retaining an abrasive material is also provided.

An edge polishing drum for wafers is disclosed. The edge polishing drum includes a body part having a disc shape, and a polishing part extending inclinedly from an edge of the body part toward a first face of the body part. The polishing part includes an inner surface surrounding a polishing area adjacent to the first face of the body part. The inner surface of the polishing part includes a first surface extending from the first face of the body part, and a second surface configured to contact an edge area of a wafer to be polished. The second surface includes a first area having a 2-1th angle with respect to the first face of the body part, and a second area having a 2-2th angle with respect to the first face of the body part. The first area is disposed between the first face of the body part and the second area.

An edge polishing drum for wafers is disclosed. The edge polishing drum includes a body part having a disc shape, and a polishing part extending inclinedly from an edge of the body part toward a first face of the body part. The polishing part includes an inner surface surrounding a polishing area adjacent to the first face of the body part. The inner surface of the polishing part includes a first surface extending from the first face of the body part, and a second surface configured to contact an edge area of a wafer to be polished. The second surface includes a first area having a 2-1th angle with respect to the first face of the body part, and a second area having a 2-2th angle with respect to the first face of the body part. The first area is disposed between the first face of the body part and the second area.