A surface-treating article, comprising a circular substrate (100) comprising a first major surface, an abrasive disposed on the first major surface, the abrasive having a first concentration at a first radius (110) measured from the center of the substrate, the abrasive having a second concentration not equal to the first concentration at a second radius (120) measured from the center of the substrate, wherein the first radius (110) and the second radius (120) are different lengths.

A polishing pad is provided. The polishing pad, suitable for polishing an object, includes a polishing layer and at least one groove. The polishing layer has a central region and a peripheral region surrounding the central region. The at least one groove is disposed in the polishing layer, wherein the at least one groove has two ends both located in the peripheral region, wherein the two ends include an open end and a closed end.

A polishing pad is provided. The polishing pad, suitable for polishing an object, includes a polishing layer and at least one groove. The polishing layer has a central region and a peripheral region surrounding the central region. The at least one groove is disposed in the polishing layer, wherein the at least one groove has two ends both located in the peripheral region, wherein the two ends include an open end and a closed end.

A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.

A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.

A method of manufacturing a flexible grinding product comprises the steps: a) preparing an open cloth of knitted or woven fabric; b) applying a coating to one surface of the cloth, wherein the coated surface of the cloth has one or more flat portions; c) applying a grinding agent to the coated surface of the cloth. Further, a flexible grinding product has an open cloth, wherein a surface of the cloth is provided with a coating such that the coated surface has one or more flat areas which are at least partially provided with a grinding agent.

A method of manufacturing a flexible grinding product comprises the steps: a) preparing an open cloth of knitted or woven fabric; b) applying a coating to one surface of the cloth, wherein the coated surface of the cloth has one or more flat portions; c) applying a grinding agent to the coated surface of the cloth. Further, a flexible grinding product has an open cloth, wherein a surface of the cloth is provided with a coating such that the coated surface has one or more flat areas which are at least partially provided with a grinding agent.

A polishing pad, a polishing apparatus and a method of manufacturing a semiconductor package using the same are provided. In some embodiments, a polishing pad includes a sub-pad portion and a top pad portion over the sub-pad portion. The top pad portion includes a plurality of grooves having a first width and a plurality of openings having a second width different from the first width, and the openings are located in a center zone of the polishing pad.

A coated abrasive article comprising a backing, an adhesive layer disposed in a discontinuous distribution on at least a portion of the backing, wherein the discontinuous distribution comprises a plurality of adhesive contact regions and at least one shaped abrasive particle is disposed on a majority of each of the discrete adhesive contact regions, wherein at least 50% of the shaped abrasive particles comprise a predetermined side orientation and have a tilt angle of at least 45 degrees, wherein the shaped abrasive particles comprise a polycrystalline material and are free of binder, wherein the first plurality of discrete adhesive contact regions comprise a predetermined two-dimensional shape as viewed from above, and wherein each of the discrete contact regions comprises a length, a width, or a combination thereof that substantially corresponds to a dimension of the at least one abrasive particle.

A coated abrasive article comprising a backing, an adhesive layer disposed in a discontinuous distribution on at least a portion of the backing, wherein the discontinuous distribution comprises a plurality of adhesive contact regions and at least one shaped abrasive particle is disposed on a majority of each of the discrete adhesive contact regions, wherein at least 50% of the shaped abrasive particles comprise a predetermined side orientation and have a tilt angle of at least 45 degrees, wherein the shaped abrasive particles comprise a polycrystalline material and are free of binder, wherein the first plurality of discrete adhesive contact regions comprise a predetermined two-dimensional shape as viewed from above, and wherein each of the discrete contact regions comprises a length, a width, or a combination thereof that substantially corresponds to a dimension of the at least one abrasive particle.