An elastic self-lubricating polishing tool includes an elastic grinding layer including an abrasive member and an elastic base layer affixed to the abrasive member, an absorbing layer absorbing and sustainedly releasing liquid inside of the absorbing layer, and an adhesive layer overlappedly connected with the elastic base layer of the elastic grinding layer and the absorbing layer. The elastic self-lubricating polishing tool is elastic and self-lubricating to sand and polish a surface of a workpiece.

An elastic self-lubricating polishing tool includes an elastic grinding layer including an abrasive member and an elastic base layer affixed to the abrasive member, an absorbing layer absorbing and sustainedly releasing liquid inside of the absorbing layer, and an adhesive layer overlappedly connected with the elastic base layer of the elastic grinding layer and the absorbing layer. The elastic self-lubricating polishing tool is elastic and self-lubricating to sand and polish a surface of a workpiece.

A brush-like grinding stone (3) in a polishing brush (1) includes a brush holder (6) and a linear member aggregate (7) detachably held in the brush holder (6). The linear member aggregate (7) includes a large number of bundles (51) of the linear members (50) obtained by hardening aggregated yarn of inorganic filaments impregnated with a resin, and a brush holder (70) holding ends of the bundles (51). A linear member holder (70) in the linear member aggregate (7) is detachably attached to each of a plurality of holding holes (68) that is open in one side in an axial line direction L. In a case where any of the linear member aggregates has a failure, such as breakage, only the failed linear member aggregate needs to be replaced. Thus, it is not necessary to discard the entire brush-like grinding stone. Consequently, the polishing cost can be reduced.

A brush-like grinding stone (3) in a polishing brush (1) includes a brush holder (6) and a linear member aggregate (7) detachably held in the brush holder (6). The linear member aggregate (7) includes a large number of bundles (51) of the linear members (50) obtained by hardening aggregated yarn of inorganic filaments impregnated with a resin, and a brush holder (70) holding ends of the bundles (51). A linear member holder (70) in the linear member aggregate (7) is detachably attached to each of a plurality of holding holes (68) that is open in one side in an axial line direction L. In a case where any of the linear member aggregates has a failure, such as breakage, only the failed linear member aggregate needs to be replaced. Thus, it is not necessary to discard the entire brush-like grinding stone. Consequently, the polishing cost can be reduced.

A brush-like grinding stone (3) in a polishing brush (1) includes a brush holder (6) and a linear member aggregate (7) detachably held in the brush holder (6). The linear member aggregate (7) includes a large number of bundles (51) of the linear members (50) obtained by hardening aggregated yarn of inorganic filaments impregnated with a resin, and a brush holder (70) holding ends of the bundles (51). A linear member holder (70) in the linear member aggregate (7) is detachably attached to each of a plurality of holding holes (68) that is open in one side in an axial line direction L. In a case where any of the linear member aggregates has a failure, such as breakage, only the failed linear member aggregate needs to be replaced. Thus, it is not necessary to discard the entire brush-like grinding stone. Consequently, the polishing cost can be reduced.

A brush-like grinding stone (3) in a polishing brush (1) includes a brush holder (6) and a linear member aggregate (7) detachably held in the brush holder (6). The linear member aggregate (7) includes a large number of bundles (51) of the linear members (50) obtained by hardening aggregated yarn of inorganic filaments impregnated with a resin, and a brush holder (70) holding ends of the bundles (51). A linear member holder (70) in the linear member aggregate (7) is detachably attached to each of a plurality of holding holes (68) that is open in one side in an axial line direction L. In a case where any of the linear member aggregates has a failure, such as breakage, only the failed linear member aggregate needs to be replaced. Thus, it is not necessary to discard the entire brush-like grinding stone. Consequently, the polishing cost can be reduced.

In one embodiment, the present invention provides a buffer brush. When rotating, the buffer brush acts as a centrifugal pump. The buffer brush contains a core having a first side and a second side and the brush extends racially from the surface of the core. The first and second sides have at least one opening configured to allow air to flow laterally through the core. Vents on the surface of the cure are configured to allow air flowing laterally through the core to also flow radially through the vents into the brush.

In one embodiment, the present invention provides a buffer brush. When rotating, the buffer brush acts as a centrifugal pump. The buffer brush contains a core having a first side and a second side and the brush extends racially from the surface of the core. The first and second sides have at least one opening configured to allow air to flow laterally through the core. Vents on the surface of the cure are configured to allow air flowing laterally through the core to also flow radially through the vents into the brush.

The present disclosure provides a wafer grinding device comprising: a chuck table to suction the wafer thereon, a grinding wheel to grind the wafer by a predetermined thickness, wherein the grinding wheel includes a grinding body, and grinding teeth arranged along and on a bottom outer periphery of the grinding body, wherein the grinding teeth are segmented; and a cooling unit at least partially extending along a region between a departure point of the grinding teeth from the wafer during rotation of the teeth, and a re-encounter point of the teeth with the wafer during rotation of the teeth, wherein the region extends along rotation path of the grinding teeth.

The present disclosure provides a wafer grinding device comprising: a chuck table to suction the wafer thereon, a grinding wheel to grind the wafer by a predetermined thickness, wherein the grinding wheel includes a grinding body, and grinding teeth arranged along and on a bottom outer periphery of the grinding body, wherein the grinding teeth are segmented; and a cooling unit at least partially extending along a region between a departure point of the grinding teeth from the wafer during rotation of the teeth, and a re-encounter point of the teeth with the wafer during rotation of the teeth, wherein the region extends along rotation path of the grinding teeth.