Patent classifications
B24D18/0009
Polycrystalline Diamond Cutting Elements Having Lead or Lead Alloy Additions
Polycrystalline diamond cutting elements having enhanced thermal stability, drill bits incorporating the same, and methods of making the same are disclosed herein. In one embodiment, a cutting element includes a substrate having a metal carbide and a polycrystalline diamond body bonded to the substrate. The polycrystalline diamond body includes a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds and a plurality of interstitial regions positioned between adjacent diamond grains. At least a portion of the plurality of interstitial regions comprise lead or lead alloy, a catalyst material, metal carbide, or combinations thereof. At least a portion of the plurality of interstitial regions comprise lead or lead alloy that coat portions of the adjacent diamond grains such that the lead or lead alloy reduces contact between the diamond and the catalyst.
Thermally stable polycrystalline diamond and methods of making the same
A method of making a cutting element includes subjecting a mixture of diamond particles and a carbonate material to high-pressure high-temperature sintering conditions to form a sintered carbonate-polycrystalline diamond body having a diamond matrix of diamond grains bonded together and carbonates residing in the interstitial regions between the diamond grains, the carbonate material having a non-uniform distribution throughout the diamond matrix. The carbonate-polycrystalline diamond body is subjected to a controlled temperature, a controlled pressure condition or a combination thereof, to effect an at least partial decomposition of the carbonate material.
Group II metal salts in electrolytic leaching of superabrasive materials
A method of processing a superabrasive element includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode such that a voltage is generated between the polycrystalline diamond table and the electrode and the voltage is applied to the processing solution. The method includes the use of an improved processing solution, including an organic acid and a divalent (e.g., Group II) metal salt, to increase the leaching depth.
Production tool to make abrasive particles with grooves
Abrasive particles comprising shaped abrasive particles each having a sidewall, each of the shaped abrasive particles comprising alpha alumina and having a first face and a second face separated by a sidewall and having a maximum thickness, T; and the shaped abrasive particles further comprising a plurality of grooves on the second face.
Polishing pad, preparation method thereof and method for preparing semiconductor device using same
The embodiments relate to a polishing pad for use in a chemical mechanical planarization (CMP) process of semiconductors, to a process for preparing the same, and to a process for preparing a semiconductor device using the same. The polishing pad according to the embodiment adjusts the surface roughness characteristics of the polishing pad after polishing, whereby the polishing rate can be enhanced, and the surface residues, surface scratches, and chatter marks of the wafer can be remarkably reduced.
Fixed abrasive articles and methods of forming same
A fixed abrasive article having a body including abrasive particles contained within a bond material, the abrasive particles including shaped abrasive particles or elongated abrasive particles having an aspect ratio of length:width of at least 1.1:1, each of the shaped abrasive particles or elongated abrasive particles having a predetermined position or a predetermined three-axis orientation, including a placement angle ranging from +90 degrees to −90 degrees and a rake angle ranging from +90 degrees to −90 degrees.
Embedded electronic circuit in grinding wheels and methods of embedding
A bonded abrasive wheel is disclosed comprising a plurality of abrasive particles disposed in a binder, a first grinding surface, a second surface opposing the first grinding surface, and an outer circumference. The wheel comprises a rotational axis extending through a central hub and a circuit configured as a Radio Frequency Identification (RFID) unit coupled to the abrasive wheel. The circuit comprises an antenna configured to communicate with one or more external devices and comprising a first end and a second end, wherein antenna has a radius of curvature about an axis along at least a portion thereof such that the first end is disposed adjacent to but is spaced from the second end, and an integrated circuit (IC) operably coupled to the antenna and configured to store at least a first data.
ELONGATE ABRASIVE ARTICLE WITH ORIENTATIONALLY ALIGNED FORMED ABRASIVE PARTICLES
Abrasive articles are disclosed comprising at least one primary elongate abrasive element extending along an element axis. The primary elongate abrasive element comprises a plurality of formed abrasive particles, wherein at least 50% of the formed abrasive particles are orientationally aligned along the element axis.
Additive raw material composition and additive for superhard material product, preparation method of the additive, composite binding agent and superhard material product, self-sharpening diamond grinding wheel and preparation method of the same
Disclosed are an additive raw material composition and an additive for superhard material product, a composite binding agent, a superhard material product, a self-sharpening diamond grinding wheel and a method for manufacturing the same. The raw material composition consisting of components in following mass percentage: Bi.sub.2O.sub.3 25%˜40%, B.sub.2O.sub.3 25%˜40%, ZnO 5%˜25%, SiO.sub.2 2%˜10%, Al.sub.2O.sub.3 2%˜10%, Na.sub.2CO.sub.3 1%˜5%, Li.sub.2CO.sub.3 1%˜5%, MgCO.sub.3 0%˜5%, and CaF.sub.2 1%˜5%. The composite binding agent is prepared from the additive and a metal composite binding agent. The self-sharpening diamond grinding wheel prepared from the composite binding agent has high self-sharpness, high strength, and fine texture, is uniformly consumed during the grinding process, does not need to be trimmed during the process of being used, and maintains good grinding force all the time, fundamentally solving the problems of long trimming time and high trimming cost of the diamond grinding wheel (FIG. 1).
Polycrystalline diamond compacts, methods of making same, and applications therefor
Embodiments of the invention relate to polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table that bonded to a cobalt-nickel alloy cemented carbide substrate. The cobalt-nickel alloy cemented carbide substrate provides both erosion resistance and corrosion resistance to the cemented carbide substrate. In an embodiment, a PDC includes a cemented carbide substrate including cobalt-nickel alloy cementing constituent. The PDC further includes a PCD table bonded to the cemented carbide substrate.