A method of making polycrystalline diamond material includes providing a fraction of diamond particles or grains and a sintering additive, the sintering additive comprising a carbon source of nano-sized particles or grains, forming the diamond particles and sintering additive into an aggregated mass, consolidating the aggregated mass and a binder material to form a green body, and subjecting the green body to conditions of pressure and temperature at which diamond is more thermodynamically stable than graphite and for a time sufficient to consume the sintering additive, sintering it and forming polycrystalline diamond material that is thermodynamically and crystallographically stable and is substantially devoid of any nano-structures.

Cutting elements for earth-boring applications may include a substrate and a polycrystalline diamond material secured to the substrate. A first region of the polycrystalline diamond material may exhibit a first volume percentage of nanoparticles bonded to diamond grains within the first region. A second region of the polycrystalline diamond material adjacent to the first region may exhibit a second, different volume percentage of nanoparticles bonded to diamond grains within the second region. Methods of making cutting elements for earth-boring applications may involve positioning a first mixture of particles having a first volume percentage of nanoparticles and a second mixture of particles having a second, different volume percentage of nanoparticles within a container. The first and second mixtures of particles may be sintered in the presence of a catalyst material to form a polycrystalline diamond material including intergranular bonds among diamond grains and nanoparticles of the polycrystalline diamond material.

The present invention relates to a polishing pad comprising a polishing surface. The polishing surface comprises a first polishing area and a second polishing area. The first polishing area comprises a plurality of first foaming holes, and the second polishing area comprises a plurality of second foaming holes, and an average pore diameter of the first foaming holes is less than an average pore diameter of the second foaming holes. The polishing pad according to the present invention uses the polishing areas with the different pore diameters of the holes to avoid unevenly removing the edge and central part of a substrate when polishing, so that a thickness of the substrate becomes uniform.

A superabrasive compact and a method of making the superabrasive compact are disclosed. A superabrasive compact may include a diamond table and a substrate. The diamond table may be attached to the substrate. The substrate may have a metric of being defined as a ratio of carbon content over tungsten carbide content, wherein the metric ranges from about 6.13% to about 7.5%.

Superabrasive compacts and methods of making superabrasive compacts are disclosed. A superabrasive compact includes a polycrystalline diamond table and a substrate attached to the polycrystalline diamond table. The substrate includes a hard metal carbide and a binder having a compound with a composition of A.sub.xB.sub.yC.sub.z, where A and B are transition metals, where C is carbon, and where 0≦x≦7, 0≦y≦7, x+y=7, and 0≦z≦3.

A method of processing a superabrasive element includes providing a superabrasive element including a polycrystalline diamond table that includes a metallic material disposed in interstitial spaces defined within the polycrystalline diamond table. The polycrystalline diamond table includes a superabrasive face and a superabrasive side surface extending around an outer periphery of the superabrasive face. The method also includes leaching the metallic material from at least a volume of the polycrystalline diamond table to produce a leached volume in the polycrystalline diamond table by (1) exposing at least a portion of the polycrystalline diamond table to a processing solution, (2) exposing an electrode to the processing solution, and (3) applying a charge to the electrode such that a voltage is generated between the polycrystalline diamond table and the electrode and the voltage is applied to the processing solution.

Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.

Embodiments of the invention relate to polycrystalline diamond (“PCD”) fabricated by sintering a mixture including diamond particles and a selected amount of graphite particles, polycrystalline diamond compacts (“PDCs”) having a PCD table comprising such PCD, and methods of fabricating such PCD and PDCs. In an embodiment, a method includes providing a mixture including graphite particles present in an amount of about 0.1 weight percent (“wt %”) to about 20 wt % and diamond particles. The method further includes subjecting the mixture to a high-pressure/high-temperature process sufficient to form PCD.

A chemical mechanical polishing pad is provided, comprising: a chemical mechanical polishing layer having a polishing surface; wherein the chemical mechanical polishing layer is formed by combining (a) a poly side (P) liquid component, comprising: an amine-carbon dioxide adduct; and, at least one of a polyol, a polyamine and a alcohol amine; and (b) an iso side (I) liquid component, comprising: polyfunctional isocyanate; wherein the chemical mechanical polishing layer has a porosity of ≧10 vol %; wherein the chemical mechanical polishing layer has a Shore D hardness of <40; and, wherein the polishing surface is adapted for polishing a substrate. Methods of making and using the same are also provided.

A cutting element and a method of providing the cutting element are provided. The cutting element may include a substrate, a first polycrystalline diamond zone, and a second polycrystalline diamond zone. The first polycrystalline diamond zone may be substantially free of a catalyst material. The second polycrystalline diamond zone rich in the catalyst material may be bonded to the substrate along an interface. The second polycrystalline diamond zone may be bonded to the first polycrystalline diamond zone along an effective transition zone. The effective transition zone may have a plurality of irregular projections toward the first polycrystalline diamond zone and the second polycrystalline diamond zone.