Abrasive articles comprising at least one layer of fibrous nonwoven fabric, woven fabrics and combinations thereof are disclosed. The fabrics or combinations of fabrics may have a hardened adherent coating. The adherent coating may comprise a first coating and a second coating. The second coating may be formed on top of the first coating. The first coating may comprise a crosslinked binder and the second coating may comprise an abrasive particle and a lubricant.

A polishing layer is provided. The polishing layer have a surface pattern, a cross section of the surface pattern along a direction has a plurality of grooves and a plurality of polishing portions, each of the grooves is disposed between every two adjacent polishing portions, and the polishing layer comprises a body layer and a surface layer. The surface layer is disposed on a surface of the body layer, and a top of at least one of the polishing portions has at least one flattened region exposing the body layer.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

A system and method for a grinding disc, the grinding disc made out of three discs, capable of grinding in three positions such as the bottom, side, and top instead of only one position, the top disc and middle disc having an aperture such that a shaft having a washer and bar is connected to the discs by sliding the through the top disc whereby the washer is then received by the middle disc, the discs are then fastened together with the bar protruding from the discs whereby the bar may be connected to a tool such as drill, the grinding disc may then be used at multiple angles when connected to the tool.

An abrasive article comprising an attachment layer and an abrasive layer. The attachment layer comprises a porous backing having a first major surface, an opposed second major surface, and a first plurality of voids extending from the first major surface to the second major surface. The abrasive layer has a third major surface and an opposed fourth major surface and comprises a cured composition, abrasive particles at least partially embedded in the cured composition, and a second plurality of voids extending from the third major surface to the fourth major surface. The first major surface of the attachment layer is adjacent the third major surface of the abrasive layer, and the pattern of the second plurality of voids is independent of the pattern of the first plurality of voids.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

The polishing pad is suitable for polishing or planarizing a wafer of at least one of semiconductor, optical and magnetic substrates. The polishing pad includes radial feeder grooves in a polishing layer separating the polishing layer into polishing regions. The radial feeder grooves extend at least from a location adjacent the center to a location adjacent the outer edge of the polishing pad. Each polishing region including a series of biased grooves that connects a pair of adjacent radial feeder grooves. A majority of the biased grooves having either an inward bias toward the center of the polishing pad or an outward bias for directing polishing fluid toward the outer edge of the polishing pad.

A nonwoven abrasive wheel includes a nonwoven abrasive body having opposed first and second major surfaces and a moisture barrier layer arranged on at least one of the first and second major surfaces. Methods of making are also described.

Disc-shaped sanding element (1) and method for manufacturing this sanding element (1) with a circular circumference with at least two layers (4,5,6) bonded to each other containing abrasive grains (11, 12), wherein these layers (4,5,6) extend at least to the circumference of the sanding element (1) in order to form a sanding edge (8) on this circumference (7), wherein each of these layers (4,5,6) has layer properties including compressibility, abrasive grain density, abrasive grain size and grain material. The layers (4,5,6) contain a three-dimensional thread or fibre structure in which said abrasive grains (11,12) are distributed, wherein adjacent layers (4,5,6) have at least one different layer property.