Patent classifications
B24D18/0045
POLYURETHANE CMP PADS HAVING A HIGH MODULUS RATIO
A chemical-mechanical polishing pad comprising a polyurethane polishing layer having a high storage modulus at low temperatures and a low storage modulus at high temperatures is disclosed. For example, the disclosed pad embodiments may be fabricated from a thermoplastic polyurethane having a ratio of storage modulus at 25 degrees C. to storage modulus at 80 degrees C. of 50 or more. The thermoplastic polyurethane polishing layer may further optionally have a Shore D hardness of 70 or more, a tensile elongation of 320 percent or less, a storage modulus at 25 degrees C. of 1200 MPa or more, and/or a storage modulus at 80 degrees C. of 15 MPa or less.
BUFFING PAD AND METHODS OF MAKING AND USING THE SAME
A buffing pad having a front surface portion, a moisture barrier upon which the front surface is disposed, a compressible foam portion disposed below the moisture barrier, and a rear surface. The front surface portion has a plurality of indentations formed by RF welding and the rear surface has an attachment portion capable of attaching the buffing pad to a power tool. Methods of manufacturing and using a buffing pad.
ABRASIVE ASSEMBLY WITH ABRASIVE SEGMENTS
Aspects of the present disclosure relate to an abrasive assembly and a method of making an abrasive assembly. The method can include receiving a segmented adhesive-backed abrasive article that includes a release liner and a plurality of abrasive segments disposed on the release liner. Each abrasive segment comprises a segment abrasive layer and a segment adhesive layer that each have a smaller planar surface area than a planar surface area of an adhesive-backed abrasive sheet. The release liner of the segmented adhesive-backed abrasive article is continuous and connects the plurality of abrasive segments which are discrete from each other. The method can include applying transfer film assembly to the segmented adhesive-backed abrasive article. A second adhesive layer of the transfer film assembly adheres to the segment abrasive layer and the segment abrasive layer is sandwiched between the segment adhesive layer of a first adhesive layer and the second adhesive layer.
Porous abrasive article
An abrasive article comprising an attachment layer and an abrasive layer. The attachment layer comprises a porous backing having a first major surface, an opposed second major surface, and a first plurality of voids extending from the first major surface to the second major surface. The abrasive layer has a third major surface and an opposed fourth major surface and comprises a cured composition, abrasive particles at least partially embedded in the cured composition, and a second plurality of voids extending from the third major surface to the fourth major surface. The first major surface of the attachment layer is adjacent the third major surface of the abrasive layer, and the pattern of the second plurality of voids is independent of the pattern of the first plurality of voids.
POROUS ABRASIVE ARTICLE
An abrasive article comprising an attachment layer and an abrasive layer. The attachment layer comprises a porous backing having a first major surface, an opposed second major surface, and a first plurality of voids extending from the first major surface to the second major surface. The abrasive layer has a third major surface and an opposed fourth major surface and comprises a cured composition, abrasive particles at least partially embedded in the cured composition, and a second plurality of voids extending from the third major surface to the fourth major surface. The first major surface of the attachment layer is adjacent the third major surface of the abrasive layer, and the pattern of the second plurality of voids is independent of the pattern of the first plurality of voids.