A method of manufacturing a CMP conditioning disc, includes: a primary forming layer forming step of forming a primary forming layer on an outer surface of a shank base and arranging a plurality of diamonds on the primary forming layer; and a secondary forming layer forming step of forming a secondary forming layer on an upper surface of the primary forming layer and exposing at least a portion of the diamonds in the secondary forming layer.

Objects can be produced using an additive manufacturing process and the objects can be removed from the substrates on which the objects are formed. An object can include a plurality of layers of a polymeric material that includes units of a diacid component and units of a glycol component. A process can be used to form the object that includes depositing a plurality of layers of the polymeric material onto a substrate to form the object. In some cases, the plurality of layers are deposited onto the substrate according to a predetermined design.

The present invention relates to a method for producing a resin sheet containing at least the following step P, Step P: a step of applying pressure (p) to a sheet-shaped resin modeled article formed by a 3D printer while heating, and deforming the sheet-shaped resin modeled article to obtain a compressed sheet; and relates to a polishing pad containing a polishing layer obtained by using the method for producing.

Embodiments of the invention relate generally to protective leaching masks, and methods of manufacturing and using the same for leaching superabrasive elements such as polycrystalline diamond elements. In an embodiment, a protective leaching mask assembly includes a superabrasive element including a central axis and a superabrasive table, and a protective mask formed to protect at least a portion of the superabrasive element. The protective mask includes a base portion and at least one sidewall extending from the base portion and defining an opening generally opposite the base portion. The at least one sidewall includes an inner surface configured to abut with a selected portion of the superabrasive element being chemically resistant to a leaching agent and an outer surface sloping at an oblique angle relative to the central axis.

Methods of processing a superabrasive element may include disposing one or more superabrasive elements in one or more protective leaching cups and exposing the leaching tray to a leaching agent such that at least some of the leaching agent contacts the one or more superabrasive elements while disposed in the one or more protective leaching cups.

The present invention provides a chemical mechanical polishing pad dresser, which comprises: a substrate having an upper surface; and an abrasive layer covering the upper surface of the substrate, and the abrasive layer including a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a tip height (H), which is a distance between the highest point of each abrasive particle and a surface of the bonding layer, and the abrasive particles have a particle size(S) of 40 m to 800 m; wherein the dresser has a leveling value (R) of 0.1 to 0.7 for the ratio of the tip height (H) to the particle size(S). The chemical mechanical polishing pad dresser of the present invention controls the ratio of the tip height to the particle size of the abrasive particles, thereby preventing the abrasive particles with different particle sizes referenced the same tip height as a baseline, and causing the polishing pad dresser to have incorrect working points of the abrasive particles, which further reduce defects such as scratch the wafer during processing.

The present invention provides a chemical mechanical polishing pad dresser, which comprises: a substrate having an upper surface; and a abrasive layer covering the upper surface of the substrate, and the abrasive layer including a bonding layer and a plurality of abrasive particles embedded in the bonding layer. Each of the abrasive particles has a tip height (H), which is a distance between the highest point of each abrasive particle and a surface of the bonding layer, and there is an average pitch (P) between these abrasive particles; wherein the dresser has a leveling value (R), which is a ratio (H/P) of the tip height (H) to the average pitch (P) of 0.05 to 0.3. The chemical mechanical polishing pad dresser of the present invention can be adjusted for different roughness requirements by controlling the ratio between the tip height and the pitch between the abrasive particles, and different dressers can be manufactured using tip height differences at different pitch, thereby dressing the polishing pad to the appropriate surface roughness.