B24D99/005

Methods of making a polycrystalline diamond structure
11667011 · 2023-06-06 · ·

Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.

Method of forming polycrystalline compacts including metallic alloy compositions in interstitial spaces between grains of hard material
09790746 · 2017-10-17 · ·

Polycrystalline compacts include a polycrystalline material comprising a plurality of inter-bonded grains of hard material, and a metallic material disposed in interstitial spaces between the inter-bonded grains of hard material. At least a portion of the metallic material comprises a metal alloy that includes two or more elements. A first element of the two or more elements comprises at least one of cobalt, iron, and nickel. A second element of the two or more elements comprises at least one of dysprosium, yttrium, terbium, gadolinium, germanium, samarium, neodymium, and praseodymium. The metal alloys may comprise eutectic or near-eutectic compositions, and may have relatively low melting points. Cutting elements and earth-boring tools include such polycrystalline compacts. Methods include the formation of such polycrystalline compacts, cutting elements, and earth-boring tools.

Method of preparing polycrystalline diamond from derivatized nanodiamond

A method of forming a polycrystalline diamond comprises derivatizing a nanodiamond to form functional groups, and combining the derivatized nanodiamond with a microdiamond having an average particle size greater than that of the derivatized nanodiamond, and a metal solvent-catalyst. A polycrystalline diamond compact is prepared by adhering the polycrystalline diamond to a support, and an article such as a cutting tool may be prepared from the polycrystalline diamond compact.

Polycrystalline diamond compacts
09777537 · 2017-10-03 · ·

Embodiments of the invention relate to polycrystalline diamond (“PCD”) fabricated by sintering a mixture including diamond particles and a selected amount of graphite particles, polycrystalline diamond compacts (“PDCs”) having a PCD table comprising such PCD, and methods of fabricating such PCD and PDCs. In an embodiment, a method includes providing a mixture including graphite particles present in an amount of about 0.1 weight percent (“wt %”) to about 20 wt % and diamond particles. The method further includes subjecting the mixture to a high-pressure/high-temperature process sufficient to form PCD.

ALUMINUM DIAMOND CUTTING TOOL
20170232579 · 2017-08-17 ·

A novel diamond cutting tool and its use in cutting and grinding applications. The cutting surface of the tool is composed of an aluminum/diamond metal matrix composite comprising diamond particles dispersed in a matrix of aluminum or an aluminum alloy, and wherein the diamond particles have thin layers of beta-SiC chemically bonded to the surfaces thereof.

MULTI-CHAMFER CUTTING ELEMENTS HAVING A SHAPED CUTTING FACE AND EARTH-BORING TOOLS INCLUDING SUCH CUTTING ELEMENTS

A cutting element for an earth-boring tool includes a substrate and volume of superabrasive material positioned on the substrate. The volume of superabrasive material includes a cutting face having at least one recess extending into the volume of superabrasive material and/or at least one protrusion extending outward from the volume of superabrasive material. The volume of superabrasive material includes a first chamfer surface having a peripheral edge and a radially innermost edge. The peripheral edge of the first chamfer surface is located proximate a cutting edge of the volume of superabrasive material. A radial width of the first chamfer surface is between about 0.002 inch and about 0.045 inch. The volume of superabrasive material also includes a second chamfer surface having a peripheral edge and a radially innermost edge. The peripheral edge of the second chamfer surface is located adjacent the radially innermost edge of the first chamfer surface.

Method of manufacturing an impregnated structure for abrading
09731404 · 2017-08-15 · ·

A layer of matrix powder is deposited within a mold opening. A layer of super-abrasive particles is then deposited over the matrix powder layer. The super-abrasive particles have a non-random distribution, such as being positioned at locations set by a regular and repeating distribution pattern. A layer of matrix powder is then deposited over the super-abrasive particles. The particle and matrix powder layer deposition process steps are repeated to produce a cell having alternating layers of matrix powder and non-randomly distributed super-abrasive particles. The cell is then fused, for example using an infiltration, hot isostatic pressing or sintering process, to produce an impregnated structure. A working surface of the impregnated structure that is oriented non-parallel (and, in particular, perpendicular) to the super-abrasive particle layers is used as an abrading surface for a tool.

Polycrystalline diamond compacts including a cemented carbide substrate and applications therefor
09732563 · 2017-08-15 · ·

Embodiments relate to a polycrystalline diamond compact (“PDC”) including a polycrystalline diamond (“PCD”) table bonded to a cemented carbide substrate including tungsten carbide grains having a fine average grain size to provide one or more of enhanced wear resistance, corrosion resistance, or erosion resistance, and a PDC with enhanced impact resistance. In an embodiment, a PDC includes a cemented carbide substrate having a cobalt-containing cementing constituent cementing tungsten carbide grains together exhibiting an average grain size of about 1.5 μm or less. The substrate includes an interfacial surface and a depletion zone depleted of the cementing constituent that extends inwardly from the interfacial surface to a depth of, for example, about 30 μm to about 60 μm. The PDC includes a PCD table bonded to the interfacial surface of the substrate. The PCD table includes diamond grains bonded together exhibiting an average grain size of about 40 μm or less.

Methods of forming cutting elements by oxidizing metal in interstitial spaces in polycrystalline material
09724804 · 2017-08-08 · ·

Methods of forming a cutting element include disposing a volume of polycrystalline material adjacent a liquid electrolytic solution and applying an electrical between the polycrystalline material and a cathode in contact with the liquid electrolytic solution to increase an oxidation state of the metal catalyst material. The polycrystalline material includes interbonded grains of hard material and metal catalyst particles in the interstitial spaces between adjacent grains of hard material. Some methods include forming a barrier over a portion of a surface of a volume of polycrystalline material.

Methods of fabricating polycrystalline diamond elements

Embodiments relate to polycrystalline diamond compacts (“PDCs”) including a polycrystalline diamond (“PCD”) table having a diamond grain size distribution selected for improving leachability. In an embodiment, a PDC includes a PCD table bonded to a substrate. The PCD table includes diamond grains exhibiting diamond-to-diamond bonding therebetween. The diamond grains includes a first amount being about 30 to about 65 volume % of the diamond grains and a second amount being about 18 to about 65 volume % of the diamond grains. The first amount exhibits a first average grain size of about 8 μm to about 22 μm. The second amount exhibits a second average grain size that is greater than the first average grain size and is about 15 μm to about 50 μm. Other embodiments are directed methods of forming PDCs, and various applications for such PDCs in rotary drill bits, bearing apparatuses, and wire-drawing dies.